METHOD OF PREVENTING ELECTRONIC COMPONENT FROM DAMAGE DURING TRANSPORTATION AND TRAYMADE BASED ON THE METHOD
A method includes the steps of preparing a tray having at least one chamber with an opening facing upward; placing at least one electronic component in the chamber; filling the chamber with a liquid that does not react with the at least one electronic component; and sealing the chamber. In light of this, when the electronic component having any kind of shape is placed in the chamber, the space for movement of the electronic component is limited, so that the electronic component is not subject to damage incurred by collision during transportation. In light of this, the chances of damaging the electronic component during transportation can be effectively decreased.
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1. Field of the Invention
The present invention relates generally to methods of transporting goods, and more particularly, to a method of preventing electronic components from damage during transportation and a tray made based on the method.
2. Description of the Related Art
As electronic technology develops, the electronic components become more and more precise, especially the electronic sensors for reflecting the external environment, and are frequently impacted by external forces to be damaged during transportation. To solve this problem, some people proposed a method of putting each of the electronic components into one of independent chambers of a tray for transportation. However, the electronic component fails to fit the chamber very tight, i.e. at least one gap is formed between the electronic component and the chamber, so that the electronic components may still collide with sidewalls of the chambers to be damaged during transportation. Some people proposed another method of attaching the electronic components to adhesive tapes for transportation. However, when it is intended to remove the electronic components from the adhesive tapes after the transportation is finished, the electronic components are still subject to damage done by improper operation.
SUMMARY OF THE INVENTIONThe primary objective of the present invention is to provide a method, which can effectively decrease the chances of damaging the electronic components during transportation.
The foregoing objective of the present invention is attained by the method includes the steps of preparing a tray having at least one chamber with an opening facing upward; placing at least one electronic component in the chamber; filling the chamber with a liquid that does not react with the at least one electronic component; and sealing the chamber. In light of this, when the electronic component having any kind of shape is placed in the chamber, the space for movement of the electronic component is limited, so that the electronic component is not subject to damage incurred by collision during transportation.
The secondary objective of the present invention is to provide a tray capable of preventing electronic components from damage during transportation.
The foregoing objective of the present invention is attained by the tray, which is composed of a main body, at least one chamber having an opening facing upward for receiving at least one electronic component, a first through hole and a second through hole, both of which are openable and closable; an upper cover mounted on the main body, and a liquid filling the chamber without reaction with the electronic component.
As can be seen from the above, the liquid is applied to the present invention as a buffer for transportation of the electronic components. The most advantage of the present invention is simpleness and securely preventing the electronic components from damage incurred by collision during transportation.
Although the present invention has been described with respect to a specific preferred embodiment thereof, it is in no way limited to the specifics of the illustrated structures but changes and modifications may be made within the scope of the appended claims.
Claims
1. A method preventing an electronic component from damage during transportation, comprising steps of:
- a) preparing a tray;
- b) forming at least one chamber having an opening in the tray;
- c) putting at least one electronic component into the at least one chamber;
- d) infusing a liquid, which does not interact with the at least one electronic component, to enable the at least one chamber to be tilled with the liquid; and
- e) sealing the at least one chamber.
2. The method as defined in claim 1, wherein the opening is located at a top side of the at least one chamber.
3. The method as defined in claim 2, wherein the at least one chamber in the step e) is sealed by an upper cover.
4. The method as defined in claim 3, wherein the tray comprises at least one first through hole, which is openable and closable, for communication between the at least one chamber and an outside.
5. The method as defined in claim 4, wherein the upper cover comprises at least one second through hole, which is openable and closable, for communication between the at least one chamber and an outside.
6. The method as defined in claim 1, wherein the liquid is selected from a group consisting of deionized water, pure water, alcohol, and isopropyl alcohol.
7. The method as defined in claim 3 further comprising a step of removing the upper cover after the at least one electronic component is transported to a destination.
8. The method as defined in claim 7 further comprising a step of drying the tray after the at least one electronic component is transported to a destination.
9. A tray capable of preventing an electronic component from damage during transportation, comprising:
- a main body having at least one chamber and at least one first through hole that is openable and closable, the chamber having an opening facing upward for receiving at least one electronic component;
- an upper cover mounted on a top side of the at least one chamber and having at least one first through hole and at least one second through hole, both of which are openable and closable; and
- a liquid filling the at least one chamber without interaction with the at least one electronic component.
Type: Application
Filed: Feb 4, 2010
Publication Date: Jun 2, 2011
Applicant: DOMINTECH CO., LTD. (Wugu Township)
Inventor: Jeff BIAR (Taipei County)
Application Number: 12/700,070
International Classification: B65D 1/34 (20060101);