Abstract: A curable liquid composition obtained by subjecting hydrogen halosiloxane or hydrogen alkoxysilane to condensation or to hydrolysis and condensation in an organic solvent in which fine polyvalent metal oxide particles with hydroxyl groups are dispersed; a method of forming a hard silica-type layer by applying onto an inorganic substrate the aforementioned composition and then curing the composition; an inorganic substrate with the aforementioned hard silica-type layer; and a semiconductor device comprising the aforementioned inorganic substrate on which a semiconductor layer is formed.

Abstract: A silicone-type pressure-sensitive adhesive composition comprising (A) 100 weight parts of organopolysiloxane condensation reaction product that has at least two alkenyl groups and that is yielded by a condensation reaction between (a) hydroxyl-functional diorganopolysiloxane and (b) organopolysiloxane resin, (B) organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in the molecule, in an amount sufficient to provide from 1 to 200 silicon-bonded hydrogen atoms with reference to all the alkenyl groups in the composition, (C) an organotitanium compound, at from 0.1 to 20 weight parts, and (D) a platinum catalyst in a catalytic quantity.

Abstract: A heat-curable silicone rubber composition for a rubber laminate composed of a silicone-rubber layer and a rubber layer of a material other than silicone, the composition comprising: an alkenyl-containing diorganopolysiloxane (A) which comprises: 50 to 99 mass % of a diorganopolysiloxane (A1) that contains alkenyl groups, is capped at molecular terminals with alkenyl-containing organosilyl groups, and is free of alkenyl groups in side molecular chains; 1 to 50 mass % of an alkenyl-containing diorganopolysiloxane (A2) having two or more alkenyl groups in a side molecular chain; a fine silica powder (B); an organohydrogenpolysiloxane (C) having in one molecule at least two silicon-bonded hydrogen atoms; and an organic peroxide (D).

Abstract: A curable silicone composition comprising: (A) an organopolysiloxane that is represented by a specific average unit formula and that has at least two of the aforementioned epoxy-functional monovalent organic groups in each molecule; (B) a diorganosiloxane represented by the general formula: A-R5—(R42SiO)mR42Si—R5-A, wherein R4 is substituted or unsubstituted mono-valent hydrocarbon group that does not contain an aliphatically unsaturated bond, R5 is a divalent organic group, A is a siloxane residue with a specific average unit formula, and m is an integer with a value of at least 1; and (C) a curing agent for epoxy resin, exhibits excellent handling and curing characteristics and that cures to give a cured product that exhibits excellent flexibility and adhesiveness.

Abstract: A curable silicone composition comprising: (A) an organopolysiloxane that is represented by the average unit formula: (R13SiO1/2)a(R22SiO2/2)b(R3SiO3/2)c(SiO4/2)d (wherein R1, R2, and R3 are each independently selected from substituted or unsubstituted monovalent hydrocarbon groups and epoxy-functional monovalent organic groups, with the proviso that at least 20 mole % of R3 are aryl groups, and a, b, c, and d are numbers that satisfy 0?a?0.8, 0?b?0.8, 0.2?c?0.9, 0?d<0.8, and a+b+c+d=1), and that has at least two of the aforementioned epoxy-functional monovalent organic groups in each molecule; (B) a compound that has a group capable of reacting with the epoxy group; (C) a cure accelerator; and (D) a thermally conductive filler, has excellent handling characteristics and that cures rapidly to give a cured product that is highly thermally conductive, very flexible, highly adhesive, and very flame retardant.

Abstract: A curable organopolysiloxane composition comprising: (A) an organopolysiloxane that contains in one molecule at least two alkenyl groups and at least 30 mole % of all silicon-bonded monovalent hydrocarbon groups in the form of aryl groups: (B) an organopolysiloxane that contains in one molecule at least two silicon-bonded hydrogen atoms and at least 15 mole % of all silicon-bonded organic groups in the form of aryl groups; (C) a branched-chain organopolysiloxane that contains alkenyl, aryl, and epoxy-containing organic groups; and (D) a hydrosilylation catalyst. The composition is capable of forming a cured body that has a high index of refraction and strong adhesion to substrates.

Abstract: The present invention relates to a silicone elastomer composition for an artificial integument which satisfies the following formula: tan ??0.23?0.006X wherein tan ? represents the loss tangent of a cured product of the aforementioned composition; and X represents the Asker C hardness of a cured product of the aforementioned composition. With the composition of the present invention, an artificial integument which has not only a similar outer appearance, but also a similar flexible feeling on touch to the skin, can be obtained by a simple process.

Abstract: A curable silicone composition comprising at least the following components: (A) an epoxy-containing organopolysiloxane; (B) a curing agent for an epoxy resin; (C) a thermally conductive metal powder; and (D) a thermally conductive nonmetal powder; exhibits low viscosity, excellent handleability and curability and, when cured, forms a cured body of flexibility, low specific gravity, and excellent thermal conductivity. An electronic component sealed or adhesively bonded with use of a cured body obtained by curing the aforementioned composition provides high reliability.

Abstract: A curable organopolysiloxane composition comprising: (A) an novel organopolysiloxane represented by the following average structural formula: R1aSiO(4-a)/2 {wherein R1 represents a substituted or non-substituted monovalent hydrocarbon group, an alkoxy group, a hydroxyl group, or an organopolysiloxane residue of the following general formula: —X—(SiR2O)mSiR23 (wherein R2 are the same or different, substituted or unsubstituted monovalent hydrocarbon groups; X represents oxygen atoms or a bivalent hydrocarbon group; and ‘m’ is an integer equal to or greater than 1); however, at least one R1 in one molecule is the aforementioned organopolysiloxane residue, at least one R1 is a monovalent hydrocarbon group having aliphatic carbon-carbon double bonds, and ‘a’ is a positive number that satisfies the following condition: 0<a<2)}; (B) an organic silicon compound having in one molecule at least two silicon-bonded hydrogen atoms; and (C) a hydrosilylation catalyst; is capable of forming a cured product of high fle

Abstract: A method of manufacturing a semiconductor device sealed in a cured silicone body by placing an unsealed semiconductor device into a mold and subjecting a curable liquid silicone composition that fills the spaces between the mold and the unsealed semiconductor device to compression molding under a predetermined molding temperature, wherein said curable liquid silicone composition has viscosity of 90 Pa·s or less at room temperature, a time interval from the moment directly after measurement of a torque with a curometer at the molding temperature to the moment when the torque reached 1 kgf·cm is not less than 1 min., while the time interval during which the torque grows from 1 kgf·cm to 5 kgf·cm is not more than 1 min.

Abstract: A room-temperature curable organopolysiloxane composition comprising: (A) a diorganopolysiloxane capped at both molecular terminals with trialkoxysilyl groups and having viscosity of 100 to 1,000,000 mPas at 25° C.; (B) a diorganodimethoxysilane or a partially hydrolyzed product thereof; (C) a diorganodialkoxysilane having silicon-bonded alkoxy group with two or more carbon atoms or a partially hydrolyzed product thereof; and (D) a titanium chelate catalyst, exhibits excellent storage stability and easiness of controlling curing speed as well as by strong adhesion to a substrate with which this composition is in contact during curing along with the possibility of interfacial peeling of the cured product from the aforementioned substrate.

Abstract: A silicone rubber sponge emulsion composition comprising (A) (a) a liquid diorganopolysiloxane having at least two alkenyl groups per molecule, or a paste-like mixture of (a) a liquid diorganopolysiloxane having at least two alkenyl groups per molecule and (d) a reinforcing filler, (b) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule, and (c) a platinum catalyst, (B) an aqueous solution of a water-soluble polymer, and (C) an emulsifying agent; its production; and production of silicone rubber sponge, wherein silicone rubber sponge is obtained by curing the composition into a molding and heating the molding.

Abstract: A curable epoxy resin composition comprising: (I) a curable epoxy resin; (II) an epoxy-resin curing agent; and (III) a silicone rubber powder obtained by curing a condensation-curable silicone rubber composition in a dispersed state in water, the powder having an epoxy equivalent measured by titration equal to or lower than 3,000 and an average particle size in the range of 0.1 to 100 ?m, possesses excellent flowability and which, when cured, forms a cured product that in spite of low modulus of elasticity possesses high strength.

Abstract: A curable organopolysiloxane composition comprising at least the following components: (A) a linear diorganopolysiloxane with a mass average molecular weight of at least 3,000, (B) a branched organopolysiloxane, (C) an organopolysiloxane having, on average, at least two silicon-bonded aryl groups and, on average, at least two silicon-bonded hydrogen atoms in one molecule, and (D) a hydrosilylation reaction catalyst; has excellent curability and, when cured, forms a flexible cured product of high refractive index, optical transmissivity, excellent adherence to various substrates, high hardness and slight surface tack.

Abstract: A silicone rubber powder obtained by curing a condensation-curable silicone rubber composition in a dispersed state in water, having an epoxy equivalent measured by a titration method equal to or lower than 3,000 and an average particle size in the range of 0.1 to 100 ?m; and a method of manufacturing a silicone rubber powder comprising the steps of dispersing in water a silicone rubber composition comprising at least components (A) through (C) listed below; adding component (D); and curing the mixture: (A) a diorganopolysiloxane capped at both molecular terminals with silanol groups and having in one molecule 30 or less silicon atoms; (B) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; (C) an epoxy-containing alkoxysilane; and (D) a condensation-reaction catalyst. The silicone rubber powder has low epoxy equivalent and possesses excellent dispersibility in organic resins, and the method is efficient in manufacturing of the aforementioned powder.

Abstract: A method of manufacturing an inorganic substrate coated with a thin silica type glass layer of 2H to 9H pencil hardness, said method comprising the steps of: coating an inorganic substrate with a cyclic dihydrogenpolysiloxane and/or a hydrogenpolysiloxane represented by a specific unit formula, and curing it; an inorganic substrate coated with a thin silica type glass layer; a coating agent for an inorganic substrate that is composed of a cyclic dihydrogenpolysiloxane and/or a hydrogenpolysiloxane represented by a specific unit formula; and a semiconductor device having an inorganic substrate coated with a thin silica type glass layer.

Abstract: A silicone-based pressure-sensitive adhesive composition comprising (A) a condensation-reaction product obtained by subjecting a diorganopolysiloxane having silanol groups on both molecular terminals and 2 or more silicon-bonded alkenyl groups located in side molecular chains in one molecule (a) and organopolysiloxane resin having one or more hydrolyzable groups in one molecule (b) to a condensation reaction in the presence of catalyst (c), (B) an organohydrogenpolysiloxane, (C) a diorganopolysiloxane having silicon-bonded alkenyl groups on both molecular terminals, (D) an organopolysiloxane resin and (E) a platinum catalyst.

Abstract: A curable organopolysiloxane composition comprising: (A) a solvent-soluble organopolysiloxane obtained by conducting a hydrosilylation reaction between (i) an organopolysiloxane represented by the following average structural formula: RaSiO(4-a)/2 (wherein R1 represents a substituted or non-substituted monovalent hydrocarbon group, the content of alkenyl groups in all groups represented by R1 is within the range of 0.

Abstract: An acryloxy-functional silicone composition curable by high-energy radiation, which is characterized by excellent storage stability of the composition and by improved resistance to scratching, transparency, water repellency, and adhesiveness in a hard cured coating film produced from the aforementioned composition. This composition comprises (A) a polyfunctional acrylate of at least one type; an amino-modified organopolysiloxane (B) or a product (F) of a Michael addition reaction between at least one type of a polyfunctional acrylate and amino-modified organopolysiloxane; (C) an organoalkoxysilane having an aliphatic unsaturated bond, (D) a colloidal silica; and (E) an alcohol-containing organic solvent.

Abstract: A method of manufacturing a layered silicone composite material comprising the steps of: applying a second addition-curable organopolysiloxane composition that contains a second adhesion promoter onto a first silicone layer that is formed by curing a first addition-curable organopolysiloxane composition containing a first adhesion promoter and where the first silicone layer has a hardness of less than JIS A 50; and forming a second silicone layer that has hardness of JIS A 50 or more by curing said second addition-curable organopolysiloxane composition.