Abstract: A curable silicone composition comprising at least the following components: (A) an epoxy-containing organopolysiloxane; (B) a curing agent for epoxy resin; and (C) an epoxy compound represented by the specific general formula; is characterized by excellent handleability and reduced oil-bleeding, and, when cured, forms a cured body of excellent flexibility and adhesion.

Abstract: A display device having a surface with light-emitting regions and non-light-emitting regions, wherein the aforementioned light-emitting regions and non-light-emitting regions are subjected to simultaneous surface treatment selected from: (1) brush treatment; (2) blast treatment; or (3) combined brush and blast treatment, whereby after the aforementioned treatment the surfaces of the light-emitting regions have a 60°-mirror-surface glossiness according to JIS Z 8741 exceeding 20%, while the surfaces of the non-light-emitting regions have a 60°-mirror-surface glossiness according to JIS Z 8741 not exceeding 20%, has good visibility of images reproduced by the display, which is especially suitable for outdoor application.

Abstract: Polyether represented by R(—O—Xn—Zm—Y)p {R is a monovalent hydrocarbyl group that contains no more than 20 carbon atoms and that may contain an aliphatically unsaturated bond or is a group comprising the preceding group having an ether linkage therein; n is 1 to 200; m is 0 to 200; 0<n/(n+m) ?1; X is a group provided by the ring-opening polymerization of a glycidyl ether; Z is an alkyleneoxy group having 2 to 6 carbon atoms; p is 1 to 6; Y is H or is a monovalent hydrocarbyl group, acyl group that contains no more than 20 carbon atoms and that may contain an aliphatically unsaturated bond or glycidyl group; and the configuration of the X and Z groups may be, inter alia, random} wherein either R or Y contains or both R and Y contain an aliphatically unsaturated bond and the molecular weight distribution (polydispersity) determined versus a polystyrene standard is 1.25 to 1.00.

Abstract: A thermoconductive silicone elastomer comprising a silicone elastomer being a cured body of a hydrosilation-curable organopolysiloxane composition, a reinforcement fine silica powder, a thermoconductive inorganic powder, and an alkylphenylpolysiloxane that is liquid at room temperature. A hydrosilation-curable thermoconductive silicone elastomer composition comprising: a hydrosilation-curable organopolysiloxane composition, a reinforcement fine silica powder, a thermoconductive inorganic powder, and an alkylphenylpolysiloxane that is liquid at room temperature. A thermoconductive medium comprising the aforementioned thermoconductive silicone elastomer.

Abstract: A method of manufacturing a purified product of a liquid medium-chain alkyl-modified polydimethylsiloxane that is free of a specific (unpleasant) odor and is practically odorless, the method comprising the steps of: [A] synthesizing a liquid medium-chain alkyl-modified polydimethylsiloxane by carrying out a hydrosilylation reaction between a hydrosilyl-containing polydimethylsiloxane and an ?-olefin with 4 to 18 carbon atoms; and [B] subjecting a crude product of the liquid medium-chain alkyl-modified polydimethylsiloxane obtained in preceding step [A] to an odor-removing treatment by conducting a hydrogenation reaction which is carried out in the presence of a hydrogenation catalyst.

Abstract: A method for producing ketimine structure-containing alkoxysilane comprising reacting amino-functional alkoxysilane with a monocarbonyl compound by heating and azeotropically distilling off the produced water together with the monocarbonyl compound to yield ketimine structure-containing alkoxysilane, characterized by introducing additional monocarbonyl compound at the time of the azeotropic distillation of the produced water together with the monocarbonyl compound.

Abstract: A method of manufacturing a layered silicone composite material comprising the steps of: applying a second addition-curable organopolysiloxane composition that contains a second adhesion promoter onto a first silicone layer that is formed by curing a first addition-curable organopolysiloxane composition containing a first adhesion promoter and where the first silicone layer has a hardness of less than JIS A 50; and forming a second silicone layer that has hardness of JIS A 50 or more by curing said second addition-curable organopolysiloxane composition.

Abstract: An organic silicon compound represented by the following general formula: ClCH2CH(CF3)COOR3Si(R1)n(R2)3-n (wherein, R1 independently designates the same or different substituted or unsubstituted hydrocarbon groups having 1 to 20 carbon atoms, R2 independently designates the same or different groups selected from halogen groups or hydrolysable groups having 1 to 20 carbon atoms, R3 designates substituted or unsubstituted alkylene groups having 1 to 20 carbon atoms, and “n” is an integer from 0 to 3). The organic silicon compound is suitable for use as a preferable precursor in the manufacture of silanes that contain (2-trifluoromethylacryloxy)alkyl groups.

Abstract: A method for making a silylalkoxymethyl halide at good yield represented by the formula: R1R2R3Si—R4—O—CH2X wherein R1, R2, and R3 are an alkyl, cycloalkyl, aryl group, or a halogen atom, R4 is a divalent hydrocarbyl group having 1 to 10 carbon atoms, and X is a halogen atom, by reacting: (a) a silyl alcohol compound with the formula R1R2R3Si—R4—OH wherein R1, R2, R3 and R4 are defined as above, with (b) formaldehyde or a polymer thereof, and (c) a halosilane.

Abstract: A method of inhibiting or reducing discoloration of a diorganopolysiloxane composition comprising the steps of mixing: said composition with the following components in any order: i) a source of ferrous ions; and ii) 0.0001-0.05 wt. % per total weight of the composition of a bis(2-pyridylthio-1-oxide) non-ferrous salt per total weight of the composition.

Abstract: An insulating liquid die-bonding agent for bonding a semiconductor-chip-mounting member to an active surface of a semiconductor chip, said agent comprising: (A) a mixture of (a-1) an organopolysiloxane resin having alkenyl groups and (a-2) a linear-chain organopolysiloxane having in one molecule at least two alkenyl groups; (B) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; (C) an organic silicon compound having in one molecule at least one silicon-bonded alkoxy groups; (D) insulating spherical silicone rubber particles having an average diameter of 0.1 to 50 ?m and having a type A durometer hardness according to JIS K 6253 equal to or below 80; and (E) a hydrosilylation-reaction catalyst, may not damage the active surface of the semiconductor chip, is well suited for screen printing, is resistant to the formation of voids on the interface between the semiconductor chip and the die-bonding agent, and does not lose its wire-bonding properties.

Abstract: A method of controlling oil-absorbing properties of a silicone rubber powder characterized by keeping a silicone rubber powder in hot storage at a temperature in the range of 40° C. to 150° C. or in cold storage at a temperature in the range of 0° C. to 10° C.

Abstract: A curable organopolysiloxane resin composition having a viscosity at 25° C. in the range of 0.001 to 5,000 Pa·s, a total acid number as specified by JIS K 2501 (1992) in the range of 0.0001 to 0.2 mg/g, and light transmittance in a cured state equal to or greater than 80%; an optical part comprised of a cured body of the aforementioned composition. The curable organopolysiloxane resin composition of the invention is characterized by good transparency, low decrease in transmittance when exposed to high temperatures, and excellent adhesion when required.

Abstract: A curable silicone composition containing an organopolysiloxane that contains in one molecule at least one epoxy-containing organic group, has a polystyrene-referenced weight-average molecular weight at least 500, and is expressed by the following general unit formula: (RSiO3/2)x[R1aSiO(4-a)/2]y (where R represents a cycloalkyl group, and R1 represents hydrogen atom or a univalent organic group, except for an aromatic group and a cycloalkyl group, at least one R1 in one molecule being an epoxy-containing univalent organic group, and where the following condition is observed: 0<a?3; x>0; y>0; and x+y=1).

Abstract: A curable silicone composition comprising: (A) an organopolysiloxane that has a branched molecular structure and contains in one molecule at least two univalent hydrocarbon groups with phenolic hydroxyl groups therein; (B) a linear-chain organopolysiloxane having at least two univalent hydroxyl groups with epoxy groups that are free of aromatic rings; and (C) a curing accelerator.

Abstract: To provide an aminoaryl containing organosilicon compound with high efficiency, after protecting amino groups of a haloaniline compound with a specific compound, to form a Grignard reagent and to deprotect the aforementioned groups by reacting the Grignard reagent with a silicon compound.

Abstract: A curable organopolysiloxane composition comprising an organopolysiloxane containing alkenyl groups and phenyl groups, an organohydrogenpolysiloxane, a copolymer of a vinyl monomer and a vinyl monomer with hydrosilyl groups, and a platinum catalyst; a curing process that consists of two or more stages of thermal curing; an optical semiconductor device that has a light-transmitting portion made from a cured body of the aforementioned composition; and an adhesion promoter that consists of a copolymer of a vinyl monomer and a vinyl monomer with hydrosilyl groups.

Abstract: A new nitrogen-containing organosilicon compound contains tertiary amine groups and carbonyl groups wherein the tertiary amine groups are selected from R1R2N— (where R1 and R2 are the same or different univalent hydrocarbon groups of 1-15 carbon atoms), alicyclic amino groups, or heterocyclic amino groups containing in their rings one or more tertiary amine groups.

Abstract: A novel organosilicon polymer, the main chain of which is composed of siloxane units and silalkylene units and to which are bonded organic groups with amide bonds linked to silicon atoms of the molecule.

Abstract: A silicone-based pressure-sensitive adhesive comprising: (A) a mixture or a product of partial condensation of (a) a raw rubberlike organopolysiloxane having an average of at least one alkenyl group per molecule and (b) an organopolysiloxane resin consisting essentially of R13SiO1/2 units and SiO4/2 units; (B) an organopolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule; (C) a phenol-type oxidation inhibitor and/or a phenol-modified organosiloxane; (D) an aromatic amino-type oxidation inhibitor and/or aromatic amino-modified organosiloxane; and (E) a platinum-based catalyst, can form a pressure-sensitive adhesive layer that maintains good removability after being exposed to high temperatures.