Abstract: A curable organopolysiloxane composition capable of forming cured products of superior optical transmittance exhibiting little heat-induced yellowing over time. A semiconductor device having semiconductor elements encapsulated in a cured product of the composition. The composition includes (A) an organopolysiloxane having at least two silicon-bonded alkenyl groups per molecule and bearing silicon-bonded aryl groups, whose content relative to all silicon-bonded organic groups is not less than 40 mol %, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule, and (C) an organosiloxane oligomer complex of platinum, where the oligomer has not more than eight silicon atoms per molecule and bears silicon-bonded alkenyl groups and silicon-bonded aryl groups.

Abstract: A method of manufacturing a semiconductor device sealed in a cured silicone body by placing an unsealed semiconductor device into a mold and subjecting a curable liquid silicone composition that fills the spaces between the mold and the unsealed semiconductor device to compression molding under a predetermined molding temperature, wherein the curable liquid silicone composition has viscosity of 90 Pa·s or less at room temperature, a time interval from the moment directly after measurement of a torque with a curometer at the molding temperature to the moment when the torque reached 1 kgf·cm being not less than 1 min.

Abstract: Silicone antifoaming agent of the present invention demonstrates excellent antifoaming effect with regard to aqueous foaming systems, and is especially suitable for use in conjunction with inks where it significantly suppresses development of cissing during use of ink. The silicone antifoaming agent is characterized by comprising a polyoxyalkylene-modified silicone that has polyoxyalkylene groups expressed by general formula (1) and (2) given below and contains 10 to 200 diorganosiloxane units in one molecule, said polyoxyalkylene-modified silicone satisfying the following conditions: 3?E?90 and 0.01?E/(E+P)?0.45, wherein P is the total number of oxypropylene units (—C3H6O—) and E is the total number of oxyethylene units (—C2H4O—) contained in one molecule.

Abstract: A silicone rubber molding, which contains 1-50 wt % of a thermoplastic resin powder and whose silicone rubber surface possesses thermoplasticity and irregularities, and a method for manufacturing a silicone rubber molding, wherein an embossing die having surface irregularities is pressed into the surface of silicone rubber containing 1-50 wt % of a thermoplastic resin powder at a temperature that is not less than the softening point of said thermoplastic resin powder so as to transfer the irregularities of the embossing die thereto.

Abstract: A thermoconductive silicone composition comprising: (A) an organopolysiloxane (excluding component (C)), (B) a thermoconductive filler, and (C) at least two organopolysiloxanes as defined by the following general formula that have different values for the subscript n (I), wherein each R1 is independently selected from monovalent hydrocarbon groups; R2 is an oxygen atom or divalent hydrocarbon group; R3 is an alkyl, alkoxyalkyl, alkenyl, or acyl; n is an integer from 5 to 100; and a is an integer from 1 to 3

Abstract: A room-temperature-curable organopolysiloxane composition comprising: (A) an organopolysiloxane having 1.5 or more end groups having at least one hydroxyl group on the average; (B) a silane or a siloxane oligomer having three or more silicon-bonded hydrolyzable groups; (D) an inorganic powder; and either (C) microparticles of thermoplastic resin containing a platinum compound having an average diameter from 0.1 to 20 ?m; or (C1) a platinum compound; and (C2) an organosiloxane oligomer which contains aryl and alkenyl groups and has 8 or less silicon atoms in each molecule and which contains in each molecule at least one divalent organosiloxane as represented by the formula: —(R2)(R3)SiO—(R2)(R3)Si—, (where R2 is an aryl group, and R3 is an alkenyl group), in a quantity of at least 2 moles of component (C2) per 1 mole platinum atoms in component (C1).

Abstract: A method of manufacturing a semiconductor device sealed in a cured silicone body by placing a semiconductor device into a mold and subjecting a curable silicone composition that fills the spaces between said mold and said semiconductor device to compression molding, wherein the curable silicone composition comprises the following components: (A) an organopolysiloxane having at least two alkenyl groups per molecule; (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule; (C) a platinum-type catalyst; and (D) a filler, wherein either at least one of components (A) and (B) contains a T-unit siloxane and/or Q-unit siloxane. By the utilization this method, a sealed semiconductor device is free of voids in the sealing material, and a thickness of the cured silicone body can be controlled.

Abstract: A method of inhibiting or reducing discoloration of a diorganopolysiloxane composition comprising the steps of mixing: said composition with the following components in any order: i) a source of ferrous ions; and ii) 0.0001-0.05 wt.

Abstract: A coating agent composition of the present invention consists of: (A) an acrylic-type copolymer that has a weight-average molecular weight within the range of 3,000 to 100,000 and contains in its side molecular chains hydrolysable silyl groups of the following formula: —COO-Q-SiR2n(OR3)3-n and organosiloxysilyl groups of the following formula: —COO-Q-Si(OSiR43)3; and (B) a condensation-reaction accelerating catalyst. Prior to curing, the composition demonstrates excellent storage stability and coating properties, while after curing the composition produces a coating film of high hardness that has excellent water-repellent properties and durability.

Abstract: A method of manufacturing a purified product of a liquid medium-chain alkyl-modified polydimethylsiloxane that is free of a specific (unpleasant) odor and is practically odorless, the method comprising the steps of: [A] synthesizing a liquid medium-chain alkyl-modified polydimethylsiloxane by carrying out a hydrosilylation reaction between a hydrosilyl-containing polydimethylsiloxane and an ?-olefin with 4 to 18 carbon atoms; and [B] subjecting a crude product of the liquid medium-chain alkyl-modified polydimethylsiloxane obtained in preceding step [A] to an odor-removing treatment by conducting a hydrogenation reaction which is carried out in the presence of a hydrogenation catalyst.

Abstract: Method for preparation of an aqueous emulsion from a curable silicone composition consisting of (A) an organopolysiloxane having at least two silicon-bonded hydroxyl groups, (B) an organohydrogensiloxane, and (C) a curing catalyst, said method being characterized by (i) continuously supplying component (A), component (B) and component (C), or a mixture of components (A) and (B) and component (C) through individual inlet ports into a continuous mixer and mixing said components at a temperature not exceeding 10° C., (ii) continuously supplying the obtained mixture and (D) an aqueous solution of a surface-active agent to an emulsifier, and emulsifying the components at a temperature not exceeding 20° C. An apparatus for the preparation of an aqueous emulsion of a curable silicone composition comprising of a continuous mixer for mixing components (A) through (C), a distribution unit connected to the lower part of the mixer, and an emulsifier.

Abstract: An acryloxy-functional silicone composition curable by high-energy radiation, which is characterized by excellent storage stability of the composition and by improved resistance to scratching, transparency, water repellency, and adhesiveness in a hard cured coating film produced from the aforementioned composition. This composition comprises (A) a polyfunctional acrylate of at least one type; an amino-modified organopolysiloxane (B) or a product (F) of a Michael addition reaction between at least one type of a polyfunctional acrylate and amino-modified organopolysiloxane; (C) an organoalkoxysilane having an aliphatic unsaturated bond, (D) a colloidal silica; and (E) an alcohol-containing organic solvent.