Abstract: An organosilicon-modified charge transporting compound having a structure represented by the following Formula (I): wherein A represents a charge transporting group, Q represents a hydrolytic group or a hydroxyl group, R2 represents a monovalent hydrocarbon group or a halogen-substituted monovalent hydrocarbon group having 1 to 15 carbon atoms, n is 1 to 18, m is 1 to 3, and 1 is 1 to 5; and a curable composition containing the organosilicon-modified charge transporting compound and a cure type resin chiefly composed of an organosilicon high polymer.

Abstract: A high-refractive-index optical silicone oil comprising a pentasiloxane having the formula RMe2SiO(Me2SiO)3SiMe2R wherein Me is methyl, each R is independently a C8 to C12 aralkyl, and the silicone oil has a refractive index of from 1.45 to 1.50 at 25° C.; a method of preparing a high-refractive-index optical silicone oil; a high-refractive-index optical silicone oil mixture comprising a pentasiloxane having the formula RMe2SiO(Me2SiO)3SiMe2R wherein Me is methyl, each R is independently a C8 to C12 aralkyl, and a disiloxane having the formula RMe2SiOSiMe2R wherein Me and R as defined above and wherein the mixture has a refractive index of from 1.45 to 1.50 at 25° C.; and a method of preparing a high-refractive-index optical silicone oil mixture.

Abstract: A curable organopolysiloxane composition, comprising (A) an organopolysiloxane containing an average of at least 2 alkenyl groups and at least 2 silicon-bonded hydrogen atoms per molecule; (B) a compound containing alkenyl and hydroxyphenyl groups in each molecule, and (C) a hydrosilylation catalyst. A product formed by curing the organopolysiloxane composition and a unified article comprising a substrate and a product formed by curing the organopolysiloxane, wherein the substrate is unified into a single integral body with the cured product.

Abstract: A method for forming thin films on substrates wherein the films are produced by applying a solution of an electrically insulating, heat-curing resin onto the substrate, evaporating the solvent and exposing the resin to high energy radiation to cure the resin. The resin solution contains a substance selected from solvents and gas generating additives that causes the dedensification of the film during the cure of the resin. This results in a film having a dielectric constant of below 2.7. A semiconductor device is also disclosed as having an interconnect structure including at least one electrically conductive layer with an interposed insulating layer having a dielectric constant of less than 2.7 wherein the insulating layer is produced by the method described above.

Abstract: Method and apparatus for cutting high viscosity liquid material, said apparatus comprising a cylinder divided into upper and lower tanks by a partition with a central discharge opening, a moveable and elevatable liquid supply pipe with a distal end positioned opposite the discharge opening, the liquid supply pipe being mounted so that it can be raised until its distal end contacts the partition around the discharge opening, and then lowered until there is no contact, means for raising and lowering the liquid supply pipe, the upper tank having peripheral injection ports for injecting a low viscosity liquid into the upper tank, means for feeding high viscosity liquid material into the lower tank and flowing it into the upper tank, means for feeding low viscosity liquid into the liquid supply pipe and for feeding low viscosity liquid into the peripheral injection ports, the high viscosity liquid material flowing from the lower tank into the upper tank when the liquid supply pipe is lowered, the high viscosity li

Abstract: A highly weathering-resistant coating material exhibits an excellent water resistance and water repellency. The coating material contains a vinyl-type polymer that contains a pendant carbosiloxane dendrimer structure. The coating material is used on construction materials, buildings and structures undercoated with an organic coating material, automobiles, railroad rolling stock, ships, aircraft, and bridges, commercial and industrial plants, and electrical and electronic instruments and devices.

Abstract: A room-temperature curable silicone rubber composition that excels in bonding durability. comprises. The present invention is a room-temperature curable composition comprising: (A) 100 parts by weight of a polydiorganosiloxane comprising (A-1) 20 to 100 parts by weight of a first polydiorganosiloxane, (A-2) 0 to 80 parts by weight of a second polydiorganosiloxane; (B) 1 to 20 parts by weight of an alkoxysilane or an alkoxysilane partial hydrolysis condensate; (C) 0.5 to 10 parts by weight of an organo-titanium compound; (D) 0.01 to 5 parts by weight of an additive selected from light stabilizers and UV absorbers.

Abstract: A filler/adhesive agent for display units containing a condensation reaction curable silicone composition including air oxidation-curable unsaturated compounds and for use as a filler or adhesive in display units whose construction is such that the cured product of said composition is exposed in the display section, which composition is capable of forming matte finished cured products with insignificant surface tact, is disclosed.

Abstract: This invention relates to a hydroxyphenyl group-containing organosilicon compound of the formula: where X is an alkenyl group; Z is a phenylene group or a carbonyloxy group expressed by —C(O)O-1, Y is a substituted or unsubstituted hydroxyphenyl group, R1 is a hydrocarbon group with two or more carbon atoms, with the various groups being the same or different, R is a monovalent hydrocarbon group containing no aliphatic unsaturated bonds, A is a divalent hydrocarbon group with one or more carbon atoms or a group expressed by the formula —R2—O—R2— where R2 is a divalent hydrocarbon group, m and p are 0 or 1, n is a number from 0 to 2, and q is an integer from 0 to 7. These compounds are useful in curable organosiloxane compositions.

Abstract: A water repellent for treating solids provides an durable and robust water repellency. The active ingredient in the water repellent is a pendant carbosiloxane dendrimer-functional vinyl-type polymer. A spray-formulated water repellent for treating solids contains 0.5 to 20 weight % of the pendant carbosiloxane dendrimer-functional vinyl-type polymer, 30 to 98.5 weight % of an organic solvent, and 1 to 50 weight % of a propellant gas.

Abstract: An adhesive silicone sheet that enroute to its complete cure is inhibited from releasing low-viscosity silicone oil, that provides excellent bond between a semiconductor chip and the corresponding chip attachment site, and that as a consequence of these features supports the fabrication of highly reliable semiconductor devices, The adhesive silicone sheet is produced by a very efficient method which yields an adhesive silicone sheet having particularly good adhesiveness. The siliocone adhesive sheet is used to produce highly reliable semiconductor devices in which the semiconductor chip has been bonded to its attachment site using the subject adhesive silicone sheet.

Abstract: A curable silicon composition, comprising (A) 100 parts by weight of an organopolysiloxane containing silicon-bonded aryl groups and at least two alkenyl groups per molecule, and having a viscosity of from 0.01 to 1,000 Pa.s at 25° C., wherein the aryl groups comprise from 1 to 40 mole % of the total silicon-bonded organic groups in the organopolysiloxane; (B) an organopolysiloxane having a viscosity of from 0.001 to 10 Pa.s at 25° C. and containing at least 2 silicon-bonded hydrogen atoms per molecule, in a quantity sufficient to cure the composition; (C) a platinum catalyst in a quantity sufficient to cure the composition; and (D) 0.00001 to 100 parts by weight of an organopolysiloxane having a viscosity of from 0.01 to 10,000 Pa.s at 25° C.

Abstract: A method is provided that can very rapidly produce a liquid silicone rubber base in which even microfine electrically conductive filler with specific surface of at least 0.5 m2/g will be homogeneously dispersed in liquid organopolysiloxane without small lump or clump formation. The method for the continuous preparation of liquid silicone rubber base, including the steps of continuously supplying to a continuous mixing apparatus (A) 100 weight parts polyorganosiloxane that has a viscosity at 25° C. of 100 to 500,000 mPa·s comprising at least 2 silicon-bonded alkenyl groups in each molecule, (B) 0 to 200 weight parts electrically nonconductive inorganic filler, and (C) 0.1 to 700 weight parts electrically conductive filler with a specific surface of at least 0.

Abstract: A method for purifying 3-methacryloxypropyldimethylhalosilanes or 3-methacryloxypropylmethyldihalosilanes which is characterized by the fact that 1-methyl-2-methacryloxyethyldimethylhalosilanes or 1-methyl-2-methacryloxyethylmethyldihalosilanes contained in products or fractions consisting of 3-methacryloxypropyldimethylhalosilanes or 3-methacryloxypropylmethyldihalosilanes produced by a hydrosilation reaction of allyl methacrylate with dimethylhalosilanes or methyldihalosilanes are decomposed by means of a metal halide which shows the properties of a Lewis acid, after which these compounds are subjected to fractional distillation.

Abstract: The instant invention pertains to a composition that can form silica thin films, wherein said composition performs well as a substrate planarizing coating when applied to a substrate and can be converted by exposure to high-energy radiation into silica thin film with an excellent electrical insulating performance. The composition for the formation of silica thin films comprises (A) a hydrogen silsesquioxane resin that contains at least 45 weight % hydrogen silsesquioxane resin with a molecular weight no greater than 1,500; and (B) solvent. A silica thin film is produced by evaporating the solvent (B), and then converting at least a portion of the hydrogen silsesquioxane resin (A) to silica by exposing the surface of the said substrate to high-energy radiation. The preferred substrate is a semiconductor substrate having at least one electrically conductive layer.

Abstract: To provide a novel branched siloxane-silalkylene copolymer whose molecule contains a plural number of silicon-bonded hydrogen atoms or silicon-bonded alkoxy groups.

Abstract: A Heat-curable silicone rubber composition comprising (A) 100 weight parts organopolysiloxane with the average unit formula RXSiO(4−x)/2 each R is independently selected from the group consisting of hydroxyl and substituted and unsubstituted monovalent hydrocarbon groups and x has a value from 1.9 to 2.1 and containing at least 2 silicon-bonded alkenyl groups in each molecule, (B) 10 to 100 weight parts reinforcing filler, (C) 0.1 to 10 weight parts carboxiloxane dendrimer that contains at least 3 silicon-bonded hydrogen atoms in each molecule, and (D) 0.1 to 10 weight parts organoperoxide.

Abstract: Novel hollow silicone resin particles, having an average particle size of 0.1 to 100 &mgr;m are disclosed. The silicone resin particles comprise a skin formed from thermoplastic silicone resin configured in the shape of a hollow capsule. The hollow thermoplastic silicone resin particles are prepared by spraying a dispersion of water and thermoplastic silicone resin dissolved in solvent into hot gas. The hot gas evaporates the solvent and water and at the same time causes solidification of the thermoplastic silicone resin while it is in the spray state, so as to form a plurality of hollow particles therefrom.

Abstract: A coating agent composition, comprising (A) 100 parts by weight of a polymer having at least two alkoxysilyl groups, wherein the polymer has a number average molecular weight of 500 to 500,000, the polymer has a principal chain comprising a polycarbonate or a polyarylate, and the alkoxysilyl groups in the polymer have the formula —SiR3−a(OR′)a, wherein R is a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, R′ is a substituted or unsubstituted monovalent hydrocarbon group having 1 to 8 carbon atoms, and a is from 1 to 3; (B) 50 to 2,000 parts by weight of an organic solvent; (C) 1 to 90 parts by weight of an organosilane, wherein the organosilane is a compound having the formula R″eSiY4−e or a partially hydrolyzed condensate thereof, wherein R″ is a substituted or unsubstituted monovalent hydrocarbon group or a hydrogen atom, Y is a hydrolyzable group, and e is from 0 to 2; and (D) a cure catalyst in an amount sufficient to cure t

Abstract: wherein A is hydrogen or a residue afforded by the removal of n hydroxyl groups from an m-valent alcohol, each R is independently a monovalent hydrocarbon group free of aliphatic unsaturation, each R1 is independently a divalent hydrocarbon group containing at least 2 carbon atoms, m and n are natural numbers wherein m≧n, p is 0 or 1, and Y is a phenol group having the formula: wherein R3 is alkyl and q is from 0 to 4. Also, a method of preparing a phenol-functional organosilicon compound.