Abstract: A curable organopolysiloxane composition capable of forming cured products of superior optical transmittance exhibiting little heat-induced yellowing over time. A semiconductor device having semiconductor elements encapsulated in a cured product of the composition. The composition includes (A) an organopolysiloxane having at least two silicon-bonded alkenyl groups per molecule and bearing silicon-bonded aryl groups, whose content relative to all silicon-bonded organic groups is not less than 40 mol %, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule, and (C) an organosiloxane oligomer complex of platinum, where the oligomer has not more than eight silicon atoms per molecule and bears silicon-bonded alkenyl groups and silicon-bonded aryl groups.

Abstract: A silicone-based adhesive sheet has either a layer of clay-like curable silicone composition on one side and a layer of slower curing clay-like curable silicone composition than the first composition layer on the other side, or a cured silicone layer on one side and a layer of clay-like curable silicone composition on the other side. The silicone-based adhesive sheet may be used in a method for bonding semiconductor chip and a chip attachment component. A semiconductor device may be prepared by the method.

Abstract: A thermoconductive curable liquid polymer composition including (A) a curable liquid polymer, (B) a filler made from a thermally-elongatable shape-memory alloy, and (C) a thermoconductive filler other than (B). A semiconductor device having a semiconductor element glued or coated with the thermoconductive curable liquid polymer composition.

Abstract: A curable organopolysiloxane composition includes: (A) a straight-chain organopolysiloxane having per molecule at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group; (B) a branched-chain organopolysiloxane with siloxane units represented by the following general formula: RSiO3/2, where R is a substituted or unsubstituted monovalent hydrocarbon group, and having per molecule at least one silicon-bonded alkenyl group and at least one silicon-bonded aryl group; (C) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; and a semiconductor device with a semiconductor element coated with a cured body of the aforementioned composition.

Abstract: An organopolysiloxane-modified polysaccharide prepared by esterification reacting (A) an organopolysiloxane having residual carboxylic anhydride groups and (B) a polysaccharide having hydroxyl groups, wherein the organopolysiloxane is bonded to the polysaccharide through half ester groups, and a process for the preparation of organopolysiloxane-modified polysaccharide, in which component (A) and component (B) are subjected to an esterification reaction in the presence of (C) a non-protonic polar solvent. The organopolysiloxane-modified polysaccharide comprising polysaccharide and organopolysiloxane bonded thereto through half ester groups is novel. The process for the preparation of organopolysiloxane-modified polysaccharide permits introduction of organopolysiloxane into polysaccharide at a high introduction ratio.

Abstract: A curable organopolysiloxane composition includes: (A) a straight-chain organopolysiloxane having per molecule at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group; (B) a branched-chain organopolysiloxane with siloxane units represented by the following general formula: RSiO3/2, where R is a substituted or unsubstituted monovalent hydrocarbon group, and having per molecule at least one silicon-bonded alkenyl group and at least one silicon-bonded aryl group; (C) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; and a semiconductor device with a semiconductor element coated with a cured body of the aforementioned composition.

Abstract: To provide a silicone rubber composition for wiper blades, which, due excellent moldability and ability to closely repeat the shape of the die during extrusion, is suitable for forming wiper blades of complicated shapes; to provide a method of manufacturing the aforementioned composition. A silicone rubber composition for a wiper blade comprising (A), a polydiorganosiloxane, (B) a finely divided, reinforcing silica filler, (C) orthoboric acid or metaboric acid, (D) a powdered calcium carbonate, (E) an organic peroxide curing agent, and an additive for improving water-repellent properties of a wiper blade made from said composition, comprising one or both of (F) a polyorganosiloxane having a viscosity of 1 to 10000 mPa·s and containing in one molecule at least two silicon-bonded hydrogen atoms and (G) a polydiorganosiloxane having a viscosity of 1 to 10000 mPa·s; a method of manufacturing the aforementioned composition.

Abstract: A process for the preparation of (D) thiocyanato-bearing organoalkoxysilanes represented by the general formula (3) NCS—R1—Si(OR2)nR33-n wherein R1 is a divalent hydrocarbon group having 1 to 6 carbon atoms, R2 and R3 are monovalent hydrocarbon groups, and the subscript n has a value of from 0 to 3, in which (A) a thiocyanic acid salt represented by the general formula (1) MSCN, wherein M is an alkali metal and (B) a halogenated alkylalkoxysilane represented by the general formula (2) XR1Si(OR2)nR33-n wherein X is a halogen atom, and R1, R2, R3, and the subscript n are the same as above, are reacted in the presence of (C) a phase transfer catalyst.

Abstract: A silicone-based adhesive sheet prepared by a process comprising (i) curing a silicone composition to form a substantially cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising oxygen atoms and/or sulfur atoms in contact with the silicone composition and the backing materials are releasable from the cured product, and (ii) separating the cured product from the backing materials. A method of manufacturing a silicone-based adhesive sheet comprising (i) curing a silicone composition to form a cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising oxygen atoms and/or sulfur atoms in contact with the silicone composition and the backing materials are releasable from the cured product, and (ii) separating the cured product from the backing materials.

Abstract: A solvent free silicone composition for forming a cured release coating comprising (A) 100 parts by weight of a diorganopolysiloxane having in each molecule at least two alkenyl groups and a viscosity of 50 to 5,000 mPa·s at 25° C.; (B) 3 to 50 parts by weight of an organohydrogenpolysiloxane mixture comprising constituent (b-1) and constituent (b-2) in a weight ratio of 1:0.01 to 1:1, where (b-1) is a diorganopolysiloxane having a viscosity of 1 to 1,000 mPa·s at 25° C. and having both molecular terminals capped with silicon-bonded hydrogen atoms and (b-2) is an organohydrogenpolysiloxane having a viscosity of 1 to 1,000 mPa·s at 25° C. and having at least three pendant silicon-bonded hydrogen atoms in each molecular chain; and (C) a catalytic amount of a platinum-type catalyst.

Abstract: Spherical crosslinked organic particles exhibit a good dispersibility in thermoplastic resins, thermosetting resins, paints, coatings, cosmetics, rubbers, and toners and carriers employed in electrostatic development. Highly efficient methods for preparing these crosslinked organic particles are provided. Suspensions of crosslinked organic particles have excellent handling properties, and are highly blendable with other components. Highly efficient methods for preparing these suspensions are also provided. The spherical crosslinked organic particles have an average particle size of 0.

Abstract: A curable organopolysiloxane composition comprises: (A) an organopolysiloxane with two or more silicon-bonded hydrogen atoms contained in one molecule in an amount not exceeding 0.05 wt. %; (B) an organopolysiloxane with two or more alkenyl groups in one molecule {alkenyl groups of this components are to be in an amount of 0.01 to 1 mole per 1 mole of a silicon-bonded hydrogen atoms contained in said component (A)}; and (C) a hydrosilylation-reaction metal catalyst (with content of metal atoms within the range of 0.01 to 1,000 ppm in terms of weight units). A method of manufacturing a semiconductor device comprises: applying onto the surface of a semiconductor device and curing, the aforementioned curable organopolysiloxane composition.

Abstract: The present invention is a radiation-curable coating composition which comprises (A) a specified amino-group-containing alkoxysilane such as N-&bgr;-(N-vinylbenzylaminoethyl)-&ggr;-aminopropyltrimethoxysilane, and (B) an acrylic polymer.

Abstract: A silicone rubber sponge composition, a silicone rubber sponge, and a process for making a silicone rubber sponge. The silicone rubber sponge composition comprises (A) 100 parts by weight of an organopolysiloxane gum described by average structural unit RaSiO(4−a)/2, where R is a monovalent hydrocarbon radical or haloalkyl and a is 1.95 to 2.05, (B) 1 to 400 parts by weight of an inorganic filler, (C) 0.01 to 50 parts by weight hollow thermoplastic resin particles (D) a mixture of (a) water-soluble silicone and (b) water in an amount such that the water in the mixture is equivalent to 0.01 to 10 parts by weight per 100 parts by weight of component (A), and (E) a curing agent in an amount sufficient to cure the composition.

Abstract: A silicone rubber sponge composition, a silicone rubber sponge, and a process for production thereof. The silicone rubber sponge composition comprises (A) 100 parts by weight organopolysiloxane gum described by average structural unit RaSiO(4−a)/2, where R is a monovalent hydrocarbon group or haloalkyl and a is 1.8 to 2.3 and having a viscosity at 25° C. of 1,000,000 mPa·s or above, (B) 1 to 400 parts by weight inorganic filler, (C) 0.01 to 50 parts by weight hollow thermoplastic resin particles, (D) 0.01 to 10 parts by weight a water-in-oil emulsion with silicone oil an oil phase, and (E) a curing agent in an amount sufficient to cure the composition.

Abstract: An organic silicon compound emulsion for quickly imparting excellent water-repellent properties to the surfaces of porous inorganic base materials such as concrete, mortar, and masonry. The emulsion is prepared by the steps of emulsifying a mixture consisting of (A) an organoalkoxysilane, (B) an organopolysiloxane having in its molecule at least 2 alkoxy groups or hydroxyl groups bonded to a silicon atom, (C) an anionic emulsifying agent, and (D) water, and heat aging the emulsion at a temperature below 100° C. In another embodiment, the method comprises the steps emulsifying a mixture of the components (A) to (D) and adding an acidic or alkaline substance to the emulsion. In a third embodiment, the method comprises the steps of forming a mixture consisting of the components (A) to (D), adding an acidic or alkaline substance thereto, and performing the emulsification thereafter.

Abstract: A novel carbosiloxane dendrimer is disclosed containing a radically polymerizable group in the molecule and which possesses excellent polymerization reactivity. The carbosiloxane dendrimer can be used to provide organic polymers as afforded by the polymerization of the carbosiloxane dendrimer either alone or with other organic monomers. The radically polymerizable group-functional carbosiloxane dendrimer with the general formula (R1 is C1 to C10 alkyl or aryl, R2 is a divalent organic group excluding C1 to C10 alkylene, b is 1 to 3, X1 is a silylalkyl group, and Y is a radically polymerizable group). Also, dendrimer-containing organic polymer as afforded by the polymerization of (A) the aforesaid carbosiloxane dendrimer and (B) radically polymerizable organic monomer.

Abstract: A silicone rubber composition comprising 0.01 to 50 weight percent of a perfluoroalkyl group-containing polydiorganosiloxane having on a side chain (F1) an organic group selected from the group consisting of polyoxyalkylene group-containing organic groups, C12 or higher alkyl group, and polydialkylsiloxane chain-containing organic groups, and having of a side chain or at a molecular chain terminal (F2) a perfluoroalkyl group-containing organic group described by the general formula F(CF2)a—R1—, where R1 is selected from the group consisting of an alkylene group, an alkyleneoxyalkylene group, and a group in which ═CO or —COO— is present in an alkylelne chain, and a is an integer of at least 3, and having a weight average molecular weight of at least 1000.

Abstract: A semiconductor device comprising a semiconductor chip, a semiconductor chip attachment site facing the semiconductor chip, and an adhesive silicone sheet bonding the semiconductor chip to the chip attachment site, wherein at least the surfaces of the sheet that connect the semiconductor chip and chip attachment site are a semi-cured product of a curable silicone composition.

Abstract: A flame-retardant polyolefin-type resin composition comprising (A) 100 weight parts polyolefin-type resin, (B) 30 to 200 weight parts powder of a hydrated metal compound, and (C) 0.01 to 50 weight parts branched organopolysiloxane with average unit formula RaSiO(4−a)/2 where each R is a selected from the group consisting of monovalent organic groups selected from the group consisting of C1 to C12 alkyl and C6 to C12 aryl and hydroxyl, wherein aryl constitutes from 50 to 100 mole % of the total monovalent organic groups and the hydroxyl content in each molecule is from 1 to 10 weight %, a is a number from 0.75 to 2.5, and the organopolysiloxane contains at least one RSiO3/2 siloxane unit in each molecule, where R is as previously described. The composition is useful as a flame-retardant coating on electrical cables.