Abstract: A moldable silicone rubber sponge composition comprising (A) 100 weight parts silicone rubber base compound with a Williams plasticity at 25° C. of 50 to 600 comprising (a) 100 weight parts diorganopolysiloxane gum that contains at least 2 alkenyl groups in each molecule and (b) 1 to 120 weight parts wet-process silica, (B) 0.01 to 50 weight parts hollow gas-containing thermoplastic resin powder, and (C) curing agent in an amount sufficient to effect curing of the composition. The invention is further a silicone rubber sponge afforded by the thermosetting of the above-defined moldable silicone rubber sponge composition and a method for producing the silicone rubber sponge.

Abstract: A silicone rubber sponge composition, a silicone rubber sponge, and a process for making the silicone rubber sponge. The silicone rubber sponge composition comprises (A) 100 parts by weight organopolysiloxane gum described by average structural unit RaSiO(4−a)/2, where R is a monovalent hydrocarbon group or haloalkyl and a is 1.8 to 2.3 and having a viscosity of 1,000,000 mPa·s or above at 25° C., (B) 1 to 400 parts by weight inorganic filler, (C) 0.01 to 50 parts by weight hollow thermoplastic resin particles, (D) 0.1 to 10 parts by weight liquid compound with a boiling point above room temperature, and (E) a curing agent in an amount sufficient to cure the composition.

Abstract: This invention relates to a silicone composition comprising: (A) a mixture of (i) a linear trimethylsiloxy-terminated polydiorganosiloxane containing at least 2 alkenyl groups having at least 4 carbon atoms and (ii) optionally a linear dimethylalkenylsiloxy-terminated polydiorganosiloxane, (B) a polyorganohydrogensiloxane, (C) a catalytic quantity of a platinum catalyst, and (D) an inhibitor. The silicone compositions of this invention make it possible to form cured release films with low resistance to peeling when peeling is carried out at high speeds, and with the possibility of controlling the resistance to peeling between low and high values when peeling is carried out at low speeds. The silicone compositions of this invention also are not subject to a decrease in the coefficient of residual adhesion in the adhesive material applied onto a cured release film.

Abstract: A silicone rubber sponge composition, a silicone rubber sponge, and a process for production thereof. The silicone rubber sponge composition, comprises (A) 100 parts by weight organopolysiloxane gum described by average structural unit RaSiO(4−a)/2, where R is a monovalent hydrocarbon group or haloalkyl and a is 1.8 to 2.3 and having a viscosity at 25° C. of 1,000,000 mPa·s or above, (B) 1 to 400 parts by weight inorganic filler, (C) 0.01 to 50 parts by weight hollow thermoplastic resin particles, (D) 0.1 to 10 parts by weight thermally decomposable blowing agent, and (E) a curing agent in an amount sufficient to cure the composition.

Abstract: A parting agent for a copier toner is disclosed. The parting agent exhibits no loss of parting properties or generation of gel under high-temperature conditions near 200° C., and causes no problems with paper feed or the like. The parting agent is composed of a diorganopolysiloxane of the average unit formula: RaSiO4−a/2, where the R groups are the same or different and are substituted or unsubstituted monovalent hydrocarbon groups, with at least 50 mol % of the R groups being methyl groups, and 1.95 ≦a≦2.20. The diorganopolysiloxane has a viscosity of 10 to 100,000 centistokes at 25° C., and generates no more than 5 ppm (by weight) of formaldehyde per hour when kept at 200° C. in an air atmosphere.

Abstract: A silicone rubber sponge composition, a silicone rubber sponge, and a process for making a silicone rubber sponge. The silicone rubber sponge composition comprises (A) 100 parts by weight of an organopolysiloxane gum described by average structural unit RaSiO(4−a)/2, where R is a monovalent hydrocarbon radical or haloalkyl and a is 1.95 to 2.05, (B) 1 to 400 parts by weight of an inorganic filler, (C) 0.01 to 50 parts by weight hollow thermoplastic resin particles (D) a mixture of (a) water-soluble silicone and (b) water in an amount such that the water in the mixture is equivalent to 0.01 to 10 parts by weight per 100 parts by weight of component (A), and (E) a curing agent in an amount sufficient to cure the composition.

Abstract: The present invention is a low-specific-gravity liquid silicone rubber composition comprising (A) 100 parts by weight of diorganopolysiloxane which is liquid at room temperature and contains at least two silicon-bonded alkenyl groups in each molecule, (B) an organohydrogenpolysiloxane which has at least two silicon-bonded hydrogen atoms in each molecule at a mole ratio of silicone-bonded hydrogen atoms contained in this component (B) to silicon-bonded alkenyl groups contained in component (A) within a range of 0.3:1 to 5:1, (C) a platinum catalyst providing metallic platinum atoms in an amount of 0.1 to 500 parts by weight per 1,000,000 parts by weight of component (A) (D) 0.5 to 30 parts by weight of gas-filled hollow particles having shells made of a non-silicone thermoplastic resin, and (E) 0.05 to 10 parts by weight of gas-filled hollow particles having shells made of a thermoplastic silicone resin.

Abstract: The present invention relates to a curable silicone composition which contains an air-oxidation-curable unsaturated compound, and which is cured by means of a hydrosilylation reaction and a condensation reaction.

Abstract: The invention pertains to a polydiorganosiloxane dispersibility improver for fluororesin powders that contains in the pendant position (A) an organic group selected from the set consisting of polyoxyalkylene-functional organic groups, alkyl groups having at least 12 carbon atoms, and polydialkylsiloxane chain-containing organic groups, and contains in the pendant position or the molecular chain terminal position, (B) a perfluoroalkyl-functional organic group with the general formula F(CF2)a—R1— in which R1 is alkylene or alkyleneoxyalkylene and a is an integer with a value of at least 3. The polydiorganosiloxane dispersibility improver for fluororesin powders has the ability to induce the uniform dispersion of fluororesin powders in organic resins. As a consequence the organic resin compositions have the ability to form uniform and transparent coatings that have an excellent surface lubricity.

Abstract: A silicone-containing polyimide resin, a silicone-containing polyamic acid, and methods for manufacturing these. More particularly, a silicone-containing polyimide resin with superior heat resistance and flexibility, a silicone-containing polyamic acid for which this polyimide resin is a raw material, and methods for manufacturing these.

Abstract: A silicone rubber composition, comprising: (A) an polyorganosiloxane gum represented by the following average structural formula: RaSiO(4−a)/2 (where R is a substituted or non-substituted monovalent hydrocarbon, and a is a number between 1.8 and 2.3); (B) microparticulate silica; and (C) a methyl-substituted benzoyl peroxide having the maximum grain diameter not exceeding 50 &mgr;m and an average grain diameter of 30 &mgr;m. When cured, the silicone rubber composition has reduced nonuniformity in the physical properties because of fewer voids, resulting in decreased frequency of spark-outs in the insulated wires.

Abstract: A water-based treatment agent for tissue paper suppresses any feeling of slipperiness or wetness in ordinary tissue paper and toilet paper so the paper has a dry touch, ample smoothness, and a clean, smooth, tactile impression. It also provides the paper with a superior softness. The water-based treatment agent consists of a silicone oil emulsion in which crosslinked silicone particles with a mean particle size of 0.01-100 &mgr;m are contained in silicone oil droplets with a mean particle size of 0.05-500 &mgr;m, which are dispersed in water. The particle size of the crosslinked silicone particles is smaller than the particle size of the silicone oil droplets.

Abstract: A colored silicone rubber adhesive film and methods of adhesion by means of the silicone rubber adhesive film are disclosed. The silicone rubber adhesive film comprises (A) an organopolysiloxane; (B) a wet method hydrophobized reinforcing silica; (C) an organohydridopolysiloxane; (D) an azo or anthroquinone pigment, and (E) a curing accelerator. The colored silicone rubber adhesive film is easily handled, possesses excellent workability, and most important, makes it possible to verify the degree and the point of completion of the curing due to the presence of the pigment.

Abstract: An anti-staining additive comprising a higher unsaturated aliphatic acid ester-modified organosilicon compound that is produced by carrying out an addition reaction between (a) a higher unsaturated aliphatic acid ester that contains more than one aliphatically unsaturated bond in each molecule  and (b) an organosilicon compounds that contains at least 1 silicon-bonded hydrogen atom in each molecule with the aliphatically unsaturated bonds in component (a) present in molar excess over the silicon-bonded hydrogen in component (b). The additive can be used at 0.01 to 50 weight percent in a polyorganosiloxane composition that cures at room temperature by a condensation reaction.

Abstract: A silicone rubber base compound for electrical wire coating such that when it is extruded using an extruding machine having a variable screw with an L/D=10 and a die with a diameter of 1 mm attached thereto at a barrel and head temperature of 70° C., the per-minute extruder output rate at a screw rotation speed of 100 rpm is not less than 1.2 times the extruder output rate at a screw rotation speed of 50 rpm, a silicone rubber composition for electrical wire coating obtained by compounding diacyl organic peroxide consisting of carbon atoms, hydrogen atoms, and oxygen atoms with the silicone rubber base compound for electrical wire coating, and a process for the production of silicone rubber coated electrical wire using the silicone rubber composition for electrical wire coating.

Abstract: A silicone gel composition comprising (A) 100 parts by weight of an organopolysiloxane comprising 80 to 98 mole % of R(CH3)SiO2/2 units, 0.1 to 10.0 mole % of RSiO3/2 units, and 0.1 to 10 mole % of R(CH3)2SiO1/2 units, wherein R is methyl, phenyl, or alkenyl, and provided 0.25 to 4.0 mole % the R groups in the organopolysiloxane are alkenyl; (B) an organopolysiloxane having an average of at least 2 silicon-bonded hydrogen atoms per molecule in an amount sufficient to provide from 0.1 to 5 silicon-bonded hydrogen atoms per alkenyl group in component (A); (C) a platinum catalyst; (D) 0.01 to 10 parts by weight of a silica powder; and (E) 0.01 to 5 parts by weight of a thixotropic agent selected from at least one epoxy compound, at least one polyhydric alcohol, and mixtures thereof; wherein the silicone gel composition has an apparent viscosity ratio of 2.0 to 10.0 and cures to form a silicone gel having a ¼ consistency of 10 to 200.

Abstract: A curable silicone resin composition contains (A) 100 parts by weight of a silicone resin having condensation-reactive group, (B) 1 to 100 parts by weight of an inorganic fine powder, (C) 0.5 to 50 parts by weight of a silazane compound; and (D) an arbitrary amount of an organic solvent. The curable silicone resin composition cures to form a cured coating film with excellent water-repellent properties.

Abstract: This invention pertains to a dispersibility improver for fluororesin powders that has the ability to induce the uniform dispersion of fluororesin powders in organic resins; a modifier for application to organic resins wherein said modifier comprises fluororesin powder and the aforesaid dispersibility improver; and finally organic resin compositions that contain the aforesaid modifier and as a consequence have the ability to form uniform and transparent coatings having an excellent surface smoothness.

Abstract: There is provided (i) a resin additive able to impart superior thermal shock resistance even in the case of resins that have absorbed moisture, (ii) a curable resin composition capable of forming a cured resin that has superior thermal shock resistance even after absorbing moisture, and (iii) a cured resin that has superior thermal shock resistance even after absorbing moisture. The resin additive consists of a powder with a mean particle size of 0.1 to 100 &mgr;m of silicone rubber. It has a moisture absorption rate of 0.20 weight percent or less after being treated for 20 hours at a temperature of about 121° C., a pressure of two atmospheres, and a relative humidity of 100 percent. The curable resin composition contains the resin additive, and the cured resin is formed by curing the curable resin composition.

Abstract: To provides a hot-melt adhesive sheet that provides very precise bonding and a stress-relaxation capacity. Also, to provide highly reliable semiconductor devices in which the semiconductor element is bonded to its element attachment site using this hot-melt adhesive sheet. Hot-melt adhesive sheet that characteristically has hot-melt adhesive on both surfaces of the sheet and spacer within the sheet. Also, semiconductor device characterized in that the semiconductor element therein is bonded to its element attachment site by the above-described hot-melt adhesive sheet.