Abstract: There are provided a selective plating mask member including: a drum-shaped jig having a jig opening arrangement region which is a region having a jig opening portion that communicates an outer side surface with an inner side surface of the drum-shaped jig, that is a strip shaped recess provided along a circumferential direction on the outer side surface; and a mask that embeds the jig opening arrangement region and has a mask opening at a location corresponding to the jig opening, wherein the mask is placed in the jig opening arrangement region, a through hole composed of the jig opening and the mask opening is provided, and an edge of the mask opening is raised toward outside of the drum-shaped jig, and there is provided a related technique thereof.

Abstract: There is provided an aluminum/ceramic bonding substrate having a ceramic substrate, an aluminum plate of an aluminum alloy which is bonded directly to one side of the ceramic substrate, an aluminum base plate of the aluminum alloy which is bonded directly to the other side of the ceramic substrate, and a plate-shaped reinforcing member which has a higher strength than that of the aluminum base plate and which is arranged in the aluminum base plate to be bonded directly to the aluminum base plate, wherein the aluminum alloy contains 0.01 to 0.2% by weight of magnesium, 0.01 to 0.1% by weight of silicon, and the balance being aluminum and unavoidable impurities.

Abstract: There is provided a composite material having a composite film on a substrate, the composite film including a silver layer that contains carbon particles, wherein a crystallite size of silver of the composite film is 30 to 100 nm and Vickers hardness Hv of the composite film is 75 or more.

Abstract: There are provided a silver-plated product having a more excellent wear resistance than that of conventional silver-plated products, and a method for producing the same. The method comprises the steps of: preparing a silver-plating solution which is an aqueous solution containing silver potassium cyanide or silver cyanide, potassium cyanide or sodium cyanide, and a benzothiazole or a derivative thereof; and forming a surface layer of silver on a base material by electroplating at a liquid temperature and at a current density in the silver-plating solution so as to satisfy (BC/A)2/D?10 (° C.2·dm2/A) assuming that a concentration of free cyanide in the silver-plating solution is A (g/L), that a concentration of a benzothiazole content of the benzothiazole or derivative thereof in the silver-plating solution is B (g/L), that the liquid temperature of the silver-plating solution is C (° C.) and that the current density during the electroplating is D (A/dm2).

Abstract: A silver-plated product which has more excellent minute sliding abrasion resistance property than that of conventional silver-plated products, and a method for producing the same. The silver-plated product is produced by electroplating a base material 10 of copper or a copper alloy to form an underlying plating layer 12 of nickel or a nickel alloy, a first silver-plating layer of silver (lower silver-plating layer) 14, a zinc-plating layer 16 of zinc serving as an intermediate plating layer, and a second silver-plating layer of silver (upper silver-plating layer) 18 serving as a surface layer, in this order from the base material 10.

Abstract: In a metal-ceramic bonded substrate in which a metal circuit board is bonded to one surface of a ceramic substrate through a brazing material layer, an overhang portion of the brazing material layer overhanging outward by 80 ?m or more from a lower edge portion of a side surface of the metal circuit board is formed, the side surface of the metal circuit board has an inclination angle ? of 75° or more with respect to a surface of the ceramic substrate, and the side surface of the metal circuit board and the overhang portion of the brazing material layer are covered with an insulating layer. The metal-ceramic bonded substrate has good partial discharge characteristics and excellent heat cycle resistance and heat resistance.

Abstract: A metal/ceramic bonding substrate wherein the bonding strength of an aluminum plate bonded directly to a ceramic substrate is higher than that of conventional metal/ceramic bonding substrates, and a method for producing same, wherein the method includes arranging a ceramic substrate in a mold; putting the mold in a furnace; lowering an oxygen concentration to 25 ppm or less and a dew point to ?45° C. or lower in the furnace; injecting a molten metal of aluminum into the mold to contact the surface of the ceramic substrate; and cooling and solidifying the molten metal to form a metal plate for a circuit pattern of aluminum on one side of the ceramic substrate to bond one side of the metal plate for a circuit pattern directly to the ceramic substrate, while forming a metal base plate of aluminum on the other side of the ceramic substrate.

Abstract: A copper alloy sheet material having improved etching characteristics contains (in mass %) Ni: 1.00 to 4.50%, Si: 0.10 to 1.40%, and optionally one or more kind of Co, Mg, Cr, P, B, Mn, Sn, Ti, Zr, Al, Fe, Zn, and Ag. The sheet material has an area ratio SB/Ss of 0.40 or more in an EBSD measurement on a cross section perpendicular to a rolling direction, wherein Ss represents area of a region satisfying at least one of conditions of a crystal orientation difference from the S1 {241} <112>orientation of 10° or less or a crystal orientation difference from the S2 {231}<124>orientation of 10° or less, and SB represents an area of a region having a crystal orientation difference from the Brass {011}<211>orientation of 10° or less.

Abstract: There is provided a silver-plated product having a more excellent wear resistance than that of conventional silver-plated products while maintaining the high hardness thereof, and a method for producing the same. In a method for producing a silver-plated product by forming a surface layer of silver on a base material by electroplating in a silver-plating solution which is an aqueous solution containing silver potassium cyanide, potassium cyanide and a mercaptothiazole, the concentration of the mercaptothiazole in the silver-plating solution is not lower than 5 g/L, and the electroplating is carried out at a liquid temperature of not lower than 30° C. and at a current density of 1 to 15 A/cm2.

Abstract: There is provided a composite material in which an oxygen-containing silver-based coating layer is formed on a base material. the oxygen-containing silver-based coating layer containing silver and having oxygen present in the vicinity of its surface. and the base material comprising copper or copper alloy.

Abstract: There are provided an inexpensive copper alloy plate having excellent bending workability, excellent stress corrosion cracking resistance and excellent stress relaxation resistance while maintaining the high strength thereof, and a method for producing the same. The copper alloy plate has a chemical composition which contains 17 to 32% by weight of zinc, 0.1 to 4.5% by weight of tin, 0.5 to 2.5% by weight of silicon, 0.01 to 0.3% by weight of phosphorus and the balance being copper and unavoidable impurities, the total of the content of silicon and six times as much as the content of phosphorus being 1% by weight or more, the copper alloy plate having a crystal orientation wherein I{220}/I{420} in the range of from 2.5 to 8.0 assuming that the X-ray diffraction intensity on {220} crystal plane on the plate surface of the copper alloy plate is I{220} and that the X-ray diffraction intensity on {420} crystal plane thereon is I{420}.

Abstract: There is provided an aluminum-ceramic bonded substrate in which an aluminum plate comprising aluminum alloy is directly bonded to one surface of a ceramic substrate and an aluminum base plate comprising aluminum alloy is directly bonded to the other surface of the ceramic substrate, wherein the aluminum alloy is the aluminum alloy containing 0.05% by mass or more and 3.0% by mass or less of at least one element selected from nickel and iron in total amount, containing 0.01% by mass or more and 0.1% by mass or less of at least one element selected from titanium and zirconium in total amount, and containing 0% by mass or more and 0.05% by mass or less of at least one element selected from boron or carbon in total amount, with a balance being aluminum.

Abstract: There is provided a copper alloy sheet material, containing: 0.0005% by mass or more and 0.1% by mass or less of Ni, 0.0005% by mass or more and 0.1% by mass or less of Sn, 100 ppm or less of C, 800 ppm or less of O, 10 ppm or less of H, and 50 ppm or less of Ag, with a balance being Cu and impurities, wherein a total content of Ni and Sn is 0.001% by mass or more and 0.11% by mass or less, and when a content of the impurities is expressed as A to B (ppm) in consideration of a quantitative lower limit of each element (here, A is a total impurity content when a content of elements less than the quantitative lower limit is deemed 0 ppm, and B is a total impurity content when a content of the element less than the quantitative lower limit is deemed the quantitative lower limit of each element), A is 100 or less and B is 250 or less.

Abstract: There is provided an aluminum-ceramic bonded substrate in which an aluminum plate comprising aluminum alloy is directly bonded to one surface of a ceramic substrate and an aluminum base plate comprising aluminum alloy is directly bonded to the other surface of the ceramic substrate, wherein the aluminum alloy is the aluminum alloy containing 0.05% by mass or more and 3.0% by mass or less of at least one element selected from nickel and iron in total amount, containing 0.01% by mass or more and 0.1% by mass or less of at least one element selected from titanium and zirconium in total amount, and containing 0% by mass or more and 0.05% by mass or less of at least one element selected from boron or carbon in total amount, with a balance being aluminum.

Abstract: [Object] To provide a Cu—Ti-based copper alloy sheet material having a strength, an electrical conductivity, bending workability, and a stress relaxation property all at high levels in a good balance, and also having a reduced density (specific gravity). [Means for Solution] A copper alloy sheet material composed of, in mass %, Ti: 1.0 to 5.0%, Al: 0.5 to 3.0%, Ag: 0 to 0.3%, B: 0 to 0.3%, Be: 0 to 0.15%, Co: 0 to 1.0%, Cr: 0 to 1.0%, Fe: 0 to 1.0%, Mg: 0 to 0.5%, Mn: 0 to 1.5%, Nb: 0 to 0.5%, Ni: 0 to 1.0%, P: 0 to 0.2%, Si: 0 to 0.5%, Sn: 0 to 1.5%, V: 0 to 1.0%, Zn: 0 to 2.0%, Zr: 0 to 1.0%, S: 0 to 0.2%, rare earth elements: 0 to 3.0%, and the balance substantially being Cu, wherein a maximum width of a grain boundary reaction type precipitate existing region is 1000 nm or less, a KAM value when a boundary with a crystal orientation difference of 15° or more measured by EBSD (step size: 0.1 ?m) is rewarded as a crystal grain boundary is 3.

Abstract: To provide, as a sheet material of a Cu—Ni—Al based copper alloy having a compositional range exhibiting a whitish metallic appearance that is excellent in “strength-bending workability balance” and is excellent in discoloration resistance, a copper alloy sheet material having a composition containing, in terms of % by mass, Ni: more than 12.0% and 30.0% or less, Al: 1.80-6.50%, Mg: 0-0.30%, Cr: 0-0.20%, Co: 0-0.30%, P: 0-0.10%, B: 0-0.05%, Mn: 0-0.20%, Sn: 0-0.40%, Ti: 0-0.50%, Zr: 0-0.20%, Si: 0-0.50%, Fe: 0-0.30%, and Zn: 0-1.00%, with the balance of Cu and unavoidable impurities, and satisfying Ni/Al?15.0, and having a metallic structure having, on an observation plane in parallel to a sheet surface (rolled surface), a number density of fine secondary phase particles having a particle diameter of 20 to 100 nm of 1.0×107 per mm2 or more.

Abstract: There is provided a composite plating material and a related technique thereof, the composite plating material including: a base material, and a composite plating layer on the base material, the composite plating layer comprising a composite material containing carbon particles and Sb in an Ag layer, with a carbon content of 6.0 mass % or more and a Sb content of 0.5 mass % or more.

Abstract: There are provided a composite plated product wherein a composite plating film of a composite material containing carbon particles in a silver layer is formed on a base material and wherein the amount of the carbon particles dropped out of the composite plating film is small, and a method for producing the same. After a composite plating film of a composite material containing carbon particles in a silver layer is formed on a base material (of preferably copper or a copper alloy) by electroplating using a silver-plating solution to which the carbon particles are added, a treatment for removing part of the carbon particles on the surface thereof is carried out.

Abstract: To provide a heat radiation member having high durability that can favorably retain the thermal conductivity under application of heat cycles, suitable for mounting a semiconductor element of a power module. The heat radiation member includes a laminated structure including metal materials 21 and 22 and a carbon material 10 having the following property (A) bonded to each other; (A) in pressurizing one principal surface of a plate specimen having a thickness of 11 mm of the carbon material with nitrogen gas of 200 kPa, the carbon material having a gas permeability of the nitrogen gas permeating to the other principal surface with a flow rate of 5 L/min or more and 30 L/min or less per 0.01 m2 in terms of area of the pressurized principal surface, the pressurized principal surface having an area of 0.005 m2 or more.

Abstract: There is provided an inexpensive plated product, which can prevent the increase of the contact resistance of a silver-plating film and the change of the color of the surface thereof after reflow-treating a plated product wherein the silver-plating film is formed on a portion of the surface thereof and wherein a tin-plating film is formed on a portion of the other portion of the surface thereof, and a method for producing the same.