Abstract: A conductor pattern is formed on at least one surface of an AlN- or Si.sub.3 N.sub.4 -based ceramic substrate which is such that the ratio between the principal metal component binding with N to form the ceramic mass and the B in the BN remaining on the surface layer is no more than 50.times.10.sup.-6 as either B/Al or B/Si, wherein B/Al represents the ratio of I.sub.B to I.sub.Al where I.sub.B is the X-ray diffraction intensity of boron present on the surface layer and I.sub.Al is the X-ray diffraction intensity of aluminum, and B/Si represents the ratio of I.sub.B to I.sub.Si where I.sub.B is as defined above and I.sub.Si is the X-ray diffraction intensity of silicon. The thus produced circuit board has both a peel strength of at least 30 kg/mm.sup.2 and a capability of withstanding at least 30 heat cycles and, hence, satisfies the performance requirements of the recent models of power module ceramic circuit boards.

Abstract: A method for the in-situ remediation of contaminants including soluble metals more noble than iron and halogenated hydrocarbons that are present in groundwater, absorbed to soil, and exist in the free product state in a soil volume. An inert pressurized gas in combination with an atomized iron powder-water slurry is used to inject pre-determined quantities of reactive zero valent iron powder relative to the quantity of contaminants present in the soil for obtaining preselected rates of remediation with minimum quantities of iron powder and with reaction products within a preferred acidic pH range. Features, such as particle surface area and carbon content, are identified that enhance the reactivity of the iron powder.

Abstract: A conductive paste compound for via hole filling includes a conductive filler at 80 to 92 weight percent with an average particle size of from 0.5 to 20 .mu.m and specific surface of from 0.1 to 1.5 m.sup.2 /g, a liquid epoxy resin at 4.5 to 20 weight percent containing 2 or more epoxy groups with room temperature viscosity of 15 Pa.sec or less, and a hardener at 0.5 to 5 weight percent, wherein the viscosity is 2,000 Pa.sec or less and the volatile amount is 2.0 weight percent or less. A filling paste and a printed circuit board with use thereof are provided which can conduct an inner-via-hole connection between electrode layers without using a through-hole plating technique.The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener, and if necessary, a dispersant. The paste having low viscosity and low volatility under high shear is used to fill holes disposed in a laminated substrate.

Abstract: Molten aluminum and a ceramic substrate are held in direct contact with each other and thereafter cooled to have the aluminum joined directly to the ceramic substrate. This method is capable of consistent and easy production of aluminum-ceramics composite substrates having satisfactory joint strength, thermal conductivity and heat resistance characteristics. A ceramic member is fed successively into and through molten metal to directly bond the metal on the ceramic to produce a metal-bonded-ceramic (MBC) material at a low cost. An electronic circuit substrate made of an aluminum ceramic composite material wherein an electronic circuit is formed on an aluminum surface of the aluminum-ceramic composite material. The aluminum-ceramic composite material is made by directly solidifying molten aluminum or an aluminum alloy on at least a portion of a ceramic substrate.

Abstract: An oxide superconductor which has high mechanical strength and exhibits favorable magnetic properties and high resistance to environment. Further, a method of manufacturing this oxide superconductor, namely, a method of manufacturing a RE--Ba--Cu--O oxide superconductor (RE is one or more kinds of rare earth elements including Y) by performing a treatment, which includes at least a burning process to be performed in a range of temperatures that are higher than the melting point of a raw material mixture containing a RE-compound raw material, a Ba-compound raw material and a Cu-compound raw material, on the aforesaid raw material mixture. This method further comprises the addition step of adding 1 to 30 in percent by weight (wt %) of Ag to the raw material mixture, and the crystallization step of melting the raw material mixture, to which Ag is added, at a temperature that is not lower than a temperature at which the raw material mixture is decomposed and fused into the RE.sub.2 BaCuO.sub.

Abstract: The improved lamp apparatus comprises at least a trough-shaped main mirror having a parabolic inner surface, a pair of plane mirrors inclined at opposite ends of said main mirror in such a way as to leave the inner surface of said main mirror open, two light-emitting devices for optical communication that are provided to face said plane mirrors, and a small mirror provided around each of said light-emitting devices to reflect light toward said plane mirrors. The mirror assembly which permits light to spread only in a horizontal direction is combined with a leadframe which assures satisfactory heat dissipation even under application of a large current, thereby creating a luminous intensity distribution pattern from the lamp apparatus that covers a wide range in the horizontal direction even if it is used alone.

Abstract: A brazing material having 0.25-0.9 wt % of titanium oxide added to a basic formula consisting of 60-94.25 wt % Ag, 5-30 wt % Cu and 0.5-4.5 wt % of an active metal is processed to form a paste, which is applied to an AlN substrate and overlaid with a copper plate and heat treated to form a joint between the AlN substrate and the copper plate. A resist is applied to the copper plate to form a circuit pattern, which is etched to form a metallized circuit, thereby producing a metal-ceramics composite substrate capable of operation on high electrical power. The substrate is improved in various characteristics of a power module device over the composite substrates produced by using the conventional brazing materials.

Abstract: A CVD precursor that is a precursor in film preparation by the CVD method, comprising a metalorganic compound containing a metal element constituting the film (called "main compound") having blended therewith another organic compound, the other organic compound having a lower vapor pressure than the main compound at a precursor vaporization temperature and when blended with the main compound forming a fusible blend having a lower melting point than the melting point of the main compound. In particular, when the main compound has the structural formula Ma(DPM).sub.2 (Ma being representing an alkaline earth metal), Ma(TMOD).sub.2 or Ma(TMND).sub.2 is blended therewith.

Abstract: A conductive paste compound for via hole filling includes a conductive filler at 80 to 92 weight percent with an average particle size of from 0.5 to 20 .mu.m and specific surface of from 0.1 to 1.5 m.sup.2 /g, a liquid epoxy resin at 4.5 to 20 weight percent containing 2 or more epoxy groups with room temperature viscosity of 15 Pa.multidot.sec or less, and a hardener at 0.5 to 5 weight percent, wherein the viscosity is 2,000 Pa.multidot.sec or less and the volatile amount is 2.0 weight percent or less. A filling paste and a printed circuit board with use thereof are provided which can conduct an inner-via-hole connection between electrode layers without using a through-hole plating technique.The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener, and if necessary, a dispersant. The paste having low viscosity and low volatility under high shear is used to fill holes disposed in a laminated substrate.

Abstract: A method of subliming material is provided for use in a CVD film preparation method wherein a CVD precursor is sublimed from its solid state by heating to a temperature not exceeding its melting point, thereby producing a vapor of the precursor, and the vapor of the precursor is transported to a reactor. The method of subliming material comprises the steps of forming the solid-state compound into a film, covering a back surface of the film with a non-reactive support and exposing a front surface of the film to an atmosphere as a sublimation surface. The method maintains the exposed surface area of the solid compound constant during processing.

Abstract: A coating type magnetic recording medium having a multilayer structure exhibits excellent strength, surface smoothness, and weather resistance is formed on a substrate, and comprises a magnetic layer of magnetic particles dispersed in a resinous binder, and a non-magnetic layer of non-magnetic particles dispersed in a resinous binder. The magnetic particles are composed of acicular ferromagnetic metal particles of Fe containing Co, Al, rare earth elements, periodic table group 1a and 2a elements. The non-magnetic particles are composed of acicular particles of .alpha.-FeOOH.

Abstract: Method and apparatus for carburizing, quenching and tempering workpieces, by which the step of carburizing can be incorporated into a machining and manufacturing process to be performed by an on-line machining and manufacturing system as one stage thereof, and by which high-quality treatment or processing can be achieved without occurrences of variation in quality among heat-treated products. In this apparatus, a preheating chamber (2), six carburizing chambers (5a to 5f), a cooling chamber (6), a reheating chamber (7), a quenching chamber (8) are placed around an intermediate chamber (4) having a transport device (12). Further, a high-frequency induction heating technique is used for heating each of major ones of the treatment or processing chambers. Moreover, a plasma carburizing method is performed in the carburizing chambers.

Abstract: An oxide superconductor which exhibits an uniform and high critical current density. Further, a method of manufacturing this oxide superconductor, namely, a RE--Ba--Cu--O oxide superconductor (RE is one or more kinds of rare earth elements including Y) by performing a treatment, which includes at least a burning process to be performed in a range of temperatures that are higher than a melting point of a raw material mixture containing a RE-compound raw material, Ba-compound raw material and a Cu-compound raw material, on the raw material mixture. This method further comprises a step of crushing the raw material mixture into particles and establishing the mean particle diameter of one or all of the raw materials as ranging from 50 to 80 .mu.m.

Abstract: A coated Cu alloy having a high hardness surface which contains intermetallic compounds consisting essentially of Cu and Sn is produced by coating the surface of a Cu alloy with Sn and heat treating the coated Cu alloy to form on the surface thereof a high hardness coating containing Cu--Sn intermetallic compound(s). The coated Cu alloy has improved resistance to abrasion and corrosion and good workability, which permits producing terminal connectors therefrom. The Cu alloy which is coated with Sn consists essentially of 0.01-15 wt % Ni, 0.1-10 wt % Sn, 0.005-0.5 wt % P, and optionally 0.01-40 wt % in total of one or two or more elements selected from the group consisting of Fe, Co, Zn, Ti, Mg, Zr, Ca, Si, Mn, Cd, Al, Pb, Be, Te, In, Ag, B, Y, La, Cr, Ce and Au, with the balance being Cu and incidental impurities.

Abstract: Zinc powder comprising particles having part or all of their surfaces coated either with copper and/or indium or with silver is used as a battery material or an active material for the negative electrode in a battery. The powder can be used as an anode active material in a secondary battery to achieve a higher discharge capacity and better cycle characteristics.

Abstract: High-strength, high-electroconductivity copper alloys are produced by preparing an ingot of a copper alloy containing 0.05-0.40 wt % Fe, 0.05-0.40 wt % Ni, 0.01-0.30 wt % P, and optionally a total of 0.03-0.50 wt % of either Sn or Zn or both and a total of 0.05-0.50 wt % of at least one element of Ag, B, Mn, Cr, Si, Ti or Zr, with the balance being Cu and incidental impurities, heating the ingot to 800.degree. to 950.degree. C. and hot working it by a reduction ratio of 50% or more, quenching the hot worked material from 600.degree. C. or above to 300.degree. C. or below at a cooling rate of at least 1.degree. C./sec, heat treating the quenched material at 380.degree. to 520.degree. C. for 60 to 600 minutes without performing cold working, and cold working and heat treating it at 450.degree. C. or below, to precipitate an Fe--Ni--P system intermetallic compound in the Cu matrix as uniform and fine grains not larger than 50 nanometers.

Abstract: In a method for quenching metal parts, a quenching chamber is provided in which the quenching oil is continuously supplied from below the steel parts and circulated upward through the parts in a laminar flow. The circulation is accomplished by feeding the quenching oil onto the bottom of the quenching chamber of an auxiliary chamber surrounding it.

Abstract: In a cementation method of metals in which hydrocarbon gas and oxidization gas are introduced into a heat treatment furnace, a small quantity of hydrocarbon gas of is introduced at a low pressure into the heat treatment furnace. The shift time and the gradient of the carbon potential varying toward a predetermined high or low level are controlled by increasing or decreasing the quantity of cementation gas and oxidization gas to be supplied to the furnace. After the carbon potential is reached to the high or low level, the carbon potential is maintained for a predetermined time period so as to prevent the deposited carbide from being bulked. In order to prevent the gas supply pipe from being choked with the soot of the hydrocarbon, oxidization gas of intermediate pressure is flushed into the gas supply pipe.

Abstract: An automatic transferring and processing apparatus of a cathode and method thereof. A cathode having an electro-deposited metal is taken out of an electrolytic cell, rotated by a stock cathode pivot, transferred through a stock moving carriage and stock conveyor to a processor for processing an electro-deposited metal disposed on the cathode, transferred through an alignment conveyor and an alignment moving carriage to an alignment cathode pivot, rotated by the alignment cathode pivot, and inserted into a predetermined electrolytic cell.

Abstract: A heat treatment apparatus having a heat treatment furnace into which a hydrocarbon gas and an oxidization gas are introduced, wherein an outlet opening of a valve through which a pusher for pushing a work to be heat treated in the heat treatment furnace is movable is hermetically connected to a pusher insertion port formed on a wall of the heat treatment furnace, and a seal box is connected hermetically to an inlet opening of the valve, the pusher being movable hermetically through the seal box. An elevator door for opening and closing the heat treatment furnace has a guide pin projected therefrom, and a jam having an upper hook surface for receiving the guide pin thereon, the jam being pivotally supported so that when the elevator door is lowered, the elevator door is moved by the jam toward a seal surface of the opening of the heat treatment furnace.