Abstract: A heating, ventilating, air conditioning, and refrigeration (HVAC-R) system includes an evaporator, a compressor, a condenser, an expansion device between the condenser and the evaporator, a superheat controller between the evaporator and the compressor, and a mass flow meter between the condenser and the expansion device. The superheat controller is configured to measure refrigerant fluid pressure and temperature and calculate superheat therefrom, to receive and analyze a mass flow rate of the refrigerant fluid traveling out of the condenser and measured by the mass flow meter, and further configured to provide a control signal to the expansion device.

Abstract: An improved aerosol dispensing apparatus includes an aerosol container, a discharge piece movably mounted to the aerosol container, a flow control valve mounted within the discharge piece, a battery, and an electronically controlled metering valve electronically connected to the battery and in fluid communication with the flow control valve. The flow control valve is movable between an open position wherein a volume of an aerosol formulation is directed from the aerosol container through the flow control valve to the metering valve, and a closed position, wherein the metering valve is configured to precisely control a flow of the aerosol formulation outward of the discharge piece. A solenoid is electronically connected to the battery and is movable between an actuated position wherein the solenoid urges the flow control valve into the open position, and an un-actuated position wherein the flow control valve remains in the closed position.

Abstract: A manifold assembly is configured to calibrate and test one or more superheat controllers and includes a manifold frame, a manifold having a plurality of fluid conduits mounted to the manifold frame, and a plurality of superheat controller fittings mounted to the fluid conduits, each superheat controller fitting configured to have a superheat controller attached thereto.

Abstract: A method of attaching a MEMS die to a surface includes centering and rotationally aligning a solder perform on a solder surface of a body, centering and rotationally aligning a MEMS die on the solder preform, and heating the solder perform in a reflow process until the solder is molten and surface tension of the molten solder moves the MEMS die to a position where the surface tensions balance, and the MEMS die is centered on, and rotationally aligned with, the solder surface of the body.

Abstract: A method of attaching a MEMS die to a surface includes centering and rotationally aligning a solder perform on a solder surface of a body, centering and rotationally aligning a MEMS die on the solder preform, and heating the solder perform in a reflow process until the solder is molten and surface tension of the molten solder moves the MEMS die to a position where the surface tensions balance, and the MEMS die is centered on, and rotationally aligned with, the solder surface of the body.

Abstract: A test equipment arrangement includes a superheat controller configured for connection to a unit under test, and further configured to test at least one operational parameter of the unit under test.

Abstract: A spool assembly configured for use in a two-stage proportional control valve in a fluid system includes a substantially cylindrical sleeve having an axially extending sleeve bore extending from an open first end to an open second end. A spool includes a spool bore that extends from an open first axial end to a closed second axial end and is slidably mounted within the sleeve bore. The spool further includes a first circumferentially extending groove defining a fluid flow path, a second circumferentially extending groove formed near a first end thereof, a third circumferentially extending groove formed near the second axial end thereof, a circumferentially extending pressure groove formed therein between the second axial end and the third circumferentially extending groove, and first, second, and third transverse fluid passageways formed through a side wall of the spool.

Abstract: A method of attaching a MEMS die to a surface includes centering and rotationally aligning a solder perform on a solder surface of a body, centering and rotationally aligning a MEMS die on the solder preform, and heating the solder perform in a reflow process until the solder is molten and surface tension of the molten solder moves the MEMS die to a position where the surface tensions balance, and the MEMS die is centered on, and rotationally aligned with, the solder surface of the body.

Abstract: The electronically switchable MEMS valve includes a housing formed from soft magnetic material and defining a fluid flow path therethrough. A magnetic field generating member is mounted within the housing and connected to a source of electrical power. A MEMS valve portion is mounted within the magnetic field generating member, has a valve closing member movably mounted therein, and defines a portion of the fluid flow path therethrough. The valve closing element is movable between a closed position wherein the fluid flow path is blocked, and an open position wherein the fluid flow path is not blocked. When an electric current is removed from the magnetic field generating member, the valve closing element is configured to move to and remain in the one of the closed position and the open position to which the valve closing element is the closest when the electric current is removed.

Abstract: A two-stage proportional control valve configured for use in a fluid system includes a valve body having a longitudinally extending valve body bore formed therethrough. A first stage microvalve is mounted within the valve body bore, and a second stage spool assembly is mounted within the valve body bore downstream of the microvalve. The second stage spool assembly includes a sleeve and a spool slidably mounted within the sleeve.

Abstract: A method of attaching a MEMS die to a base includes selecting an attachment material (x), determining a maximum acceptable change in pressure due to mounting stress (dPtarget) transmitted to a MEMS die, determining a worst-case pressure difference transfer function of the attachment material (x) over a thickness (h) variation of the attachment material (x) using the equation: dPmaxx=h*Bx+Cx, wherein B=pressure variation/thickness (h), and C=pressure variation, substituting dPtarget for dPmaxx in the pressure difference transfer function and solving the equation for h, wherein h=(dPtarget?Cx)/Bx, and attaching the MEMS die to a base using the selected attachment material (x) having at least the calculated thickness (h).

Abstract: A two-stage fluid control valve includes a first stage mechanical control valve movable between an open position and a leak-free closed position, and a second stage microvalve configured to control the flow of fluid through a fluid outlet of the two-stage fluid control valve when the first stage mechanical control valve is in the open position.

Abstract: A method of attaching a MEMS die to a mounting surface includes coating an inside surface of a pressure port of a fluid inlet member with a layer of solder mask, the fluid inlet member having a first axial end, a second axial end, and a port opening of the pressure port formed in the second axial end of the fluid inlet member. A solder preform is disposed on the mounting surface of the fluid inlet member and a MEMS die is disposed on the solder preform. The solder preform is heated in a re-flow operation to attach the MEMS die to the mounting surface, wherein the solder mask within the pressure port prevents molten solder from entering the pressure port during the re-flow operation.

Abstract: A multi-layer, stress-isolation platform configured for attaching a MEMS die to a base includes a first platform, a first layer of attachment material between the base and the first platform and attaching the first platform to the base, a MEMS die, and a second layer of attachment material between the first platform and the MEMS die and attaching the MEMS die to the first platform.

Abstract: A microvalve includes a first plate having a surface, a recessed area provided within the surface, a fluid port provided within the recessed area, and a sealing structure extending about the fluid port, the sealing structure having at least one divot formed therein. A second plate has a surface adjacent the surface of the first plate and including a displaceable member that is movable between a closed position, wherein the displaceable member cooperates with the sealing structure to prevent fluid communication through the fluid port, and an open position, wherein the displaceable member does not cooperate with at least a portion of the sealing structure to prevent fluid communication through the fluid port.

Abstract: An improved aerosol dispensing apparatus includes an aerosol container, a discharge piece, an actuator, a flow control canister valve assembly attached to the aerosol container, a battery, and an electronically controlled flow control valve electronically connected to the battery and in fluid communication with the flow control canister valve assembly. The aerosol container and the attached flow control canister valve assembly are further attached to the actuator and the actuator is mounted for slidable movement within the discharge piece. The flow control canister valve assembly is movable between an open position wherein a volume of an aerosol formulation is directed from the aerosol container through the flow control canister valve assembly to the electronically controlled flow control valve, and a closed position wherein the aerosol formulation is not permitted to flow through the flow control canister valve assembly to the electronically controlled flow control valve.

Abstract: A two-stage control microvalve includes a generally cylindrical housing configured for insertion into a bore in a body of a hydro-mechanical valve system, a pilot microvalve mounted within the housing, and a piloted microvalve mounted within the housing and in fluid communication with the pilot microvalve.

Abstract: A valve assembly is configured to regulate the flow of an isolated fluid therethrough and includes a first valve stage configured to control the flow of a first fluid through a first fluid circuit, and a second valve stage configured to control the flow of a second fluid through a second fluid circuit. The first valve stage is connected to the second valve stage such that the first fluid acts on the second valve stage to move the second valve stage between open and closed positions. The second fluid flowing through the second valve stage is also isolated from the first fluid flowing through the first valve stage.

Abstract: A method of attaching a MEMS die to a surface includes centering and rotationally aligning a solder perform on a solder surface of a body, centering and rotationally aligning a MEMS die on the solder preform, and heating the solder perform in a reflow process until the solder is molten and surface tension of the molten solder moves the MEMS die to a position where the surface tensions balance, and the MEMS die is centered on, and rotationally aligned with, the solder surface of the body.

Abstract: A method of maintaining a fluid flow rate in a heating, ventilating, air conditioning, and refrigeration (HVAC-R) system while maintaining superheat in the HVAC-R system at a desired level includes: continuously measuring an operating fluid temperature of the HVAC-R system, continuously calculating HVAC-R system superheat at a pre-determined rate, determining if the calculated HVAC-R system superheat is stable, measuring and recording the operating fluid pressure of the HVAC-R system each time the calculated HVAC-R system superheat is stable, recording an average operating fluid pressure each subsequent time the superheat is stable, calculating an output PWM according to the equation: Output PWM=(Flow Rate Component)+(Superheat Component), and reducing fluid flow through a metering valve in the HVAC-R system when an actual HVAC-R system PWM is greater than the calculated output HVAC-R system PWM by adjusting a PWM signal to a microvalve in the metering valve, and increasing fluid flow through the metering val