Abstract: A heat-sealable peelable multi-layer laminated polymeric film comprising a polymeric substrate layer having on one side thereof a polymeric heat-sealable peelable layer and having on the opposite side thereof a polymeric shrinkable layer, wherein said shrinkable layer has a degree of shrinkage in a first dimension of about 10-80% over the temperature range 55 to 100° C., a ratio of shrinkage at 100° C. said first dimension relative to a second, orthogonal dimension in the range of 1:1 to 10:1, and further comprising one or two intermediate layer(s) wherein an intermediate layer is disposed between the substrate layer and the shrinkable layer and/or between the substrate layer and the heat-sealable peelable layer, and one or more layer(s) of an electrically conductive material; and use thereof as packaging for ovenable meals or as a lid on an ovenable container wherein the packaging is self-peeling and self-venturing during a cooking cycle.

Abstract: A multilayer white polymeric film having a core layer with an optical transmission density greater than 2.0, a white polyester outer layer on either side of the core layer and an ink receptive layer on the outer surface of the white polyester layers.

Abstract: A multilayer card has (i) an opaque polyester film substrate containing 0.2 to 30% by weight, relative to the total weight of the substrate, of at least one copolyesterether, (ii) a first ink-receptive layer on at least one surface of the substrate, (iii) a cover layer on the surface of the ink-receptive layer and/or surface of the substrate and (iv) a second ink-receptive heat-sealable layer comprising a polyester resin on a second surface of the substrate. The presence of the copolyesterether in the substrate reduces the tendency of the card to delaminate in use. Suitable for use, inter alia, in identification, magnetic, credit, pre-paid and smart cards.

Abstract: A process for the production of a polymeric film comprising a copolyester having an acid component and a diol component, said acid component comprising a dicarboxylic acid and a sulfomonomer containing a sulfonate group attached to the aromatic nucleus of an aromatic dicarboxylic acid, said process comprising the steps of: (i) melt-extruding a layer of said copolyester; (ii) stretching the extrudate in at least one direction; (iii) heat-setting the film by raising the temperature of the stretched film to a temperature T1 in a first heating zone such that (TM?T1 is in the range of from 5 to 30° C., and then raising the temperature of the film to a temperature T2 in a second heating zone such that (TM?T2 is in the range of from 0 to 10° C.

Abstract: A process in which a wound roll of biaxially oriented polyester film having a glass transition temperature (Tg (° C.)) is annealed at a temperature Ta (° C.) above Tg where Tg<Ta?Tg+100 (° C.) for a time t after thermal equilibrium where 1 hour?t?72 hours and cooled, for the purpose of improving the shrinkage of said polyester film.

Abstract: The use of a coating composition comprising: (a) from about 5 to about 50 weight percent solids, the solids comprising from about 10 to about 70 weight percent silica and from about 90 to about 30 weight percent of a partially polymerized organic silanol of the general formula RSi(OH)3, wherein R is selected from methyl and up to about 40% of a group selected from the group consisting of vinyl, phenyl, gamma-glycidoxypropyl, and gamma-methacryloxypropyl, and (b) from about 95 to about 50 weight percent solvent, the solvent comprising from about to about 90 weight percent water and from about 90 to about 10 weight percent lower aliphatic alcohol, wherein the coating composition has a pH of from about 3.0 to about 8.0, for the purpose of improving the surface smoothness of a polymeric substrate, particularly a heat-stabilised, heat-set, oriented polyester substrate, and use of said coated substrate in the manufacture of an electronic or opto-electronic device containing a conjugated conductive polymer.

Abstract: The use of a coating composition comprising: (a) from about 5 to about 50 weight percent solids, the solids comprising from about 10 to about 70 weight percent silica and from about 90 to about 30 weight percent of a partially polymerized organic silanol of the general formula RSi(OH)3, wherein R is selected from methyl and up to about 40% of a group selected from the group consisting of vinyl, phenyl, gamma-glycidoxypropyl, and gamma-methacryloxypropyl, and (b) from about 95 to about 50 weight percent solvent, the solvent comprising from about 10 to about 90 weight percent water and from about 90 to about 10 weight percent lower aliphatic alcohol, wherein the coating composition has a pH of from about 3.0 to about 8.0, for the purpose of improving the surface smoothness of a polymeric substrate, particularly a heat-stabilised, heat-set, oriented polyester substrate, and use of said coated substrate in the manufacture of an electronic or opto-electronic device containing a conjugated conductive polymer.

Abstract: An anti-microbial polymeric film comprising a polymeric substrate layer and an inorganic anti-microbial compound of formula (I): AgaHbAcM2(PO4)3.nH2O wherein: A is at least one ion selected from an alkali or alkaline earth metal ion; M is a tetravalent metal ion; a is in the range 0.4 to 0.5; b and c are positive numbers such that (a+b+mc)=1; m is the valence of metal A; and 0?n?6, wherein the anti-microbial compound is present in the substrate layer in an amount of from about 0.05 to about 0.7% of by weight of the polymeric material of the substrate layer; and the use of said inorganic anti-microbial compound for providing an antimicrobial polymeric film having reduced haze.

Abstract: A heat-sealable, coextruded composite polymeric film comprising a substrate layer comprising a first copolyester material having on a surface thereof a heat-sealable layer comprising a second copolyester material wherein: (i) the first and second copolyester materials are different from each other; (ii) the copolyester of the substrate layer comprises an aromatic dicarboxylic acid and a saturated aliphatic dicarboxylic acid of formula CnH2n(COOH)2 wherein n is 2 to 8; (iii) the heat-sealable layer comprises one or more wax(es); and (iv) the composite film is shrinkable or thermoformable; and the use thereof as a packaging film, particularly as, or in the manufacture of, a lidding film for heat-sealing to a receptacle containing a food product.

Abstract: A heat-sealable, peelable, coextruded composite polymeric film comprising a substrate layer of polymeric material having on a surface thereof a heat-sealable layer, wherein said heat-sealable layer comprises a copolyester of least one aromatic dicarboxylic acid, at least one aliphatic dicarboxylic acid and one or more glycol(s); the thickness of said heat-sealable layer is in the range of from about 0.3 to about 3 ?m; and the heat-sealable layer comprises one or more wax(es) is described.

Abstract: The use of a coating composition comprising: (a) from about 5 to about 50 weight percent solids, the solids comprising from about 10 to about 70 weight percent silica and from about 90 to about 30 weight percent of a partially polymerized organic silanol of the general formula RSi(OH)3, wherein R is selected from methyl and up to about 40% of a group selected from the group consisting of vinyl, phenyl, gamma-glycidoxypropyl, and gamma-methacryloxypropyl, and (b) from about 95 to about 50 weight percent solvent, the solvent comprising from about 10 to about 90 weight percent water and from about 90 to about 10 weight percent lower aliphatic alcohol, wherein the coating composition has a pH of from about 3.0 to about 8.0, for the purpose of improving the surface smoothness of a polymeric substrate, particularly a heat-stabilised, heat-set, oriented polyester substrate, and use of said coated substrate in the manufacture of an electronic or optoelectronic device containing a conjugated conductive polymer.

Abstract: A process for the preparation of particles with controlled dimensions comprising the steps of: (i) providing a laminar substrate having a patterned surface comprising a micro-relief repeat pattern comprising one or more discrete cells, each cell consisting of a floor portion and walls having a height (Hw); (ii) depositing organic or inorganic material onto the patterned surface and into the cells to provide a thickness (T) of the deposited material wherein T?Hw (iii) stripping the deposited organic or inorganic material from the surface of the substrate; and (iv) collecting the particles formed from said organic or inorganic material; and a composition obtainable from said process comprising a plurality of particles (P), wherein the number (n) of particles in said composition is at least 10, wherein said particles (P) are platelets exhibiting a planar geometry which is circular or which is made up of a number (x) of planar (y)-sided polygon(s), wherein x is from 1 to 20 and y is at least 3 wherein if x is gre

Abstract: Disclosed is a thermoformable film laminate that can be useful for packaging comprising or produced from (a) a thermoformable film layer comprising or produced from a polymer composition having at least 80% by weight polyethylene terephthalate polymer, said film having an outer surface and an inner surface; (b) a film layer having a heat shrinkage of at least about 5% less than (a); (c) a heat sealable layer; and optionally, (d) an additional barrier layer.

Abstract: A method of packaging ovenable fish or meat and which comprises the steps of providing a dual-ovenable thermoformable polymeric receiving film having a first and second surface and a dual-ovenable polymeric covering film having a first and second surface, wherein said receiving film consists of a mono-layer polyester or polyamide substrate, an optional barrier layer, and an optional heat-sealable layer which where present constitutes the first surface of the receiving film, wherein said receiving and covering films are separate pieces of film and wherein at least one of said first surfaces of said receiving and covering films is a heat-sealable surface; providing a raised outer portion and an indented central portion in said receiving film by thermoforming; disposing on the first surface of the receiving film a portion of meat or fish; disposing the covering film over the portion of meat or fish such that the first surface of the covering film is disposed towards the first surface of the receiving film; conta

Abstract: A radio-frequency (RF) responsive tag comprising a heat-sealing substrate comprising a polyester layer, and an antenna comprising a patter of conductive material wherein said conductive material is in direct contact with a heat-sealing surface of the substrate, and wherein the shrinkage of the heat-sealing substrate is less than 5% at 190° C. over 30 minutes; a method of manufacture of said RF-response tag.

Abstract: A heat-sealable polymeric film includes a substrate layer of polymeric material having on a surface thereof a heat-sealable coating layer. The layer includes a copolyester and is less than 8 ?m in thickness. The copolyester consists essentially of repeat units of one or more aromatic dicarboxylic acids, one or more aliphatic dicarboxylic acids, and a stoichiometric amount of a glycol component consisting of one or more glycols selected from the group consisting of aliphatic glycols and cycloaliphatic glycols.

Abstract: A composite film suitable as a donor support in a radiation-induced thermal transfer imaging process, said film comprising a polymeric substrate and a transfer-assist coating layer derived from an aqueous composition comprising one or more water-soluble or water-dispersible radiation-absorbing compound(s).

Abstract: An anti-microbial polymeric film comprising a polymeric substrate layer and an inorganic anti-microbial compound of formula (I): AgaHbAcM2(PO4)3.nH2O wherein: A is at least one ion selected from an alkali or alkaline earth metal ion; M is a tetravalent metal ion; a is in the range 0.4 to 0.5; b and c are positive numbers such that (a+b+mc)=1; m is the valence of metal A; and 0?n?6, wherein the anti-microbial compound is present in the substrate layer in an amount of from about 0.05 to about 0.7% of by weight of the polymeric material of the substrate layer; and the use of said inorganic anti-microbial compound for providing an antimicrobial polymeric film having reduced haze.

Abstract: The use of a heat-stabilized, heat-set oriented film comprising poly(ethylene naphthalate) as a substrate in, or in the manufacture of, an electronic or opto-electronic device containing a conjugated conductive polymer, wherein said film has a shrinkage at 30 mins at 230° C. of less than 1%; and a composite film comprising such a substrate layer and on a surface thereof a barrier layer.

Abstract: The use of multilayer film structure comprising at least two unfilled layers of polymeric material substantially devoid of opacifying agent and at least two filled layers of polymeric material wherein said filled layers comprise at least 5% by weight of opacifying agent for providing improved tear-resistance in an opaque polymeric film, particularly a polyester film.