Abstract: A Curable Silicone Composition, Encapsulant And Optical Semiconductor Device provides a curable silicone composition having excellent storage stability at room temperature. A curable silicone composition having (A) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and at least one siloxane unit represented by SiO4/2; (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms in one molecule; (C) an alkyne group-containing compound; and (D) a curing catalyst, wherein the content of the resinous alkenyl group-containing organopolysiloxane (A) is 20 mass % or more based on the total mass of the organopolysiloxane components.

Abstract: Hotmelt silicone compositions are provided including: (A) a resinous alkenyl group-containing organopolysiloxane component, in which the silicon atom-bonded organic groups do not include an epoxy group-containing organic group, wherein the resinous alkenyl group-containing organopolysiloxane component includes (A-1) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and free from a (Ar2SiO2/2) unit, and (A-2) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and at least one (Ar2SiO2/2) unit; (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; and (C) a curing catalyst. The resinous alkenyl group-containing organopolysiloxane (A-1) is included in an amount of about 5 mass % or more based on the total mass of all the organopolysiloxane components in the hotmelt silicone composition.

Abstract: A UV curable silicone composition has exceptional curability by ultraviolet irradiation.

Abstract: A silicone grease composition is disclosed. The grease composition contains a silicone oil and zinc dialkyldithiocarbamate as an extreme-pressure additive. The grease composition contains substantially no zinc dialkyldithiophosphate. The grease composition achieves high friction characteristics and wear characteristics. A method for transmitting torque of a clutch or a torque limiter mechanism is also disclosed. Moreover, a method for producing a clutch or a torque limiter mechanism is disclosed. The methods utilize the aforementioned grease composition.

Abstract: Disclosed is a method of making an optoelectronic device that incorporates a crosslinked resin-linear polyorganosiloxane.

Abstract: A curable silicone composition encapsulates, coats, or adheres an optical semiconductor element. The curable silicone composition can form a cured product with sufficiently low gas-permeability, and with little weight decrease and little change in hardness even on long-term exposure to high temperatures. The curable silicone composition comprises resinous organopolysiloxane that contains at least one (Ar2SiO2/2) unit, wherein Ar denotes an aryl group.

Abstract: A white curable silicone composition provides excellent elongation characteristics while providing sufficiently great hardness, which as a result can provide a cured product having excellent toughness. The composition comprises: (A) alkenyl group-containing resinous organopolysiloxane which is represented by an average composition formula: (R13SiO1/2)a(R12SiO2/2)b(R1SiO3/2)c(SiO4/2)d(XO1/2)e, where, in the formula, R1 are each independently a monovalent hydrocarbon group, while at least two R1 are alkenyl groups, X is a hydrogen atom or an alkyl group, 0?a?0.7, 0?b?0.2, 0?c?0.3, 0?d?0.8, and 0?e?0.2, a+b+c+d=1.

Abstract: A curable white silicone composition that is capable of forming a cured product having a high optical reflectance as well as exceptional light resistance is provided. The curable white silicone composition includes (A) an organopolysiloxane having at least 2 alkenyl groups per molecule, (B) a cerium-containing organopolysiloxane, (C) a white pigment, and (D) a curing catalyst.

Abstract: A silicone grease composition having high friction characteristics and wear characteristics is disclosed. The silicone grease composition is provided by adding a zinc salt (B) containing, at a mass ratio from 1:99 to 99:1, a zinc dialkyldithiophosphate (B1) and a zinc dialkyldithiocarbamate (B2) as an extreme-pressure additive to a silicone oil (A). A method for transmitting torque of a clutch or a torque limiter mechanism is also disclosed.

Abstract: A curable silicone composition for die bonding use contains at least (A) an organopolysiloxane having at least two alkenyl groups per molecule, (B) an organopolysiloxane having at least two siloxane units each represented by the formula: RHSiO (wherein R represents a monovalent hydrocarbon group having 1 to 12 carbon atoms and having no aliphatic unsaturated bond) per molecule, (C) a platinum-group metal-based catalyst for hydrosilylation reactions, (D) a hydrosilylation reaction inhibitor and (E) an adhesiveness-imparting agent, wherein the scorch time (ts1), which is defined in JIS K 6300-2, at a die bonding temperature is 20 to 60 seconds, and the 90% vulcanization time [tc(90)] with respect to the maximum torque value during the vulcanization time of 600 seconds is 300 to 500 seconds. The curable silicone composition for die bonding use according to the present invention can adhere a semiconductor chip to a support strongly.

Abstract: Curable silicone compositions, encapsulants including the same, and optical semiconductor devices including the encapsulants are provided herein. In an embodiment, a curable silicone composition includes: (A) an alkenyl group-containing organopolysiloxane having at least two alkenyl groups per molecule; (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; (C) an epoxy group-containing resinous organopolysiloxane represented by Average Unit Formula (I): (R13SiO1/2)f(R22SiO2/2)g(R1SiO3/2)h(SiO4/2)i(XO1/2)j wherein R1 are independently halogen-substituted or unsubstituted monovalent hydrocarbon groups, at least two R1 are alkenyl groups; R2 are independently halogen-substituted or unsubstituted monovalent hydrocarbon groups or epoxy group-containing organic groups, wherein at least one R2 is an epoxy group-containing organic group; X is a hydrogen atom or an alkyl group; 0?f<1; 0<g<1; 0?h<0.9; 0?i<0.5; and 0<j<0.5; f+g+h+i+j=1.

Abstract: A curable hot-melt silicone composition exhibits excellent mechanical properties, particularly strength and extension, even when formed in a film or sheet shape. The curable hot-melt silicone composition contains (A) alkenyl group-containing organopolysiloxane having at least 2 alkenyl groups per molecule, (B) branched organohydrogenpolysiloxane having at least 2 silicon-bonded hydrogen atoms per molecule, at 0.1 to 5% by mass relative to the total mass of the composition, (C) additive represented by average unit formula (C-1), (D) hydrosilylation catalyst, and (E) silica.

Abstract: Hotmelt silicone compositions are provided including: (A) a resinous alkenyl group-containing organopolysiloxane component, in which the silicon atom-bonded organic groups do not include an epoxy group-containing organic group, wherein the resinous alkenyl group-containing organopolysiloxane component includes (A-1) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and free from a (Ar2SiO2/2) unit, and (A-2) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and at least one (Ar2SiO2/2) unit; (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; and (C) a curing catalyst. The resinous alkenyl group-containing organopolysiloxane (A-1) is included in an amount of about 5 mass % or more based on the total mass of all the organopolysiloxane components in the hotmelt silicone composition.

Abstract: A method for producing a sealed optical semiconductor device includes: placing inner and outermost layer sealing films on a substrate on which an optical semiconductor element is mounted within a pressure reduction chamber, and reducing the pressure; a step in which the outermost film is heated, and at least the periphery of the outermost film is thermally fused to the surface of the substrate; and a step in which the reduction of pressure is released, and the substrate is sealed by the outermost film and the inner film. The temperature T2 of the substrate when the reduction of pressure is released is a temperature at which the outermost film exhibits a tensile strength of 0.02-0.15 MPa and an elongation at break of 200-450%. The inner film exhibits a loss tangent (tan ?) of 1.6 or more at the temperature T2.

Abstract: [Problem] To provide an aqueous coating agent composition (in particular, an aqueous coating composition for lubricating films that contains a solid lubricant) which as a whole is excellent in terms of flowability, applicability, and storage stability and which is capable of forming satisfactory and smooth coating films effective in stick-slip inhibition. [Solution] The problem can be solved with an aqueous coating agent composition which comprises (A) a curable resin in an aqueous emulsion form, (B) a surfactant, (C) solid particles, (D) one or more nitrogenous heterocyclic compounds, (E) a film-forming silicone in an aqueous emulsion form, and (F) water. In particular, it is preferable that the (C) component comprise a solid lubricant. In view of the environmental regulations, it is especially preferable that the (D) component be 1,3-dimethyl-2-imidazolidinone.

Abstract: A film is formed by use of a composition containing (A) a binder resin, (B) a hard particle, and (C) a solid lubricant selected from the group containing molybdenum disulfide and graphite, wherein the composition contains tungsten carbide as the hard particle, and wherein weight ratio of (B) the hard particles and (C) the solid lubricant, (B)/(C), is in the range of 1 to 3.

Abstract: A method for producing a sealed optical semiconductor device makes it possible to seal an optical semiconductor element using a sealing film. The method includes: placing a sealing film on an optical semiconductor element substrate on which an optical semiconductor element is placed within a pressure reduction chamber, and the pressure within the chamber is reduced; heating the film where at least the periphery of the film is thermally fused to the surface of the optical semiconductor element placement substrate; and a step in which the reduction of pressure within the chamber is released and the optical semiconductor element placement substrate is sealed by the film. The temperature T2 of the optical semiconductor element placement substrate when the reduction of pressure within the chamber is released is a temperature at which the film exhibits a tensile strength of 0.02-0.15 MPa and an elongation at break of 150-450%.

Abstract: The present invention pertains to a curable organopolysiloxane composition comprising at least (A) an organopolysiloxane having at least two alkenyl groups per module, (B) an organopolysiloxane resin represented by average unit formula: (R13SiO1/2)a(R12SiO2/2)b(R2SiO3/2)c(SiO4/2)d. In the formula, R1's are the same or different from each other, and represent a hydrogen atom or a monovalent hydrocarbon group not having an aliphatic unsaturated carbon bond but at least two of the R1's per molecule represent hydrogen atoms, R2 represents a monovalent hydrocarbon group not having an aliphatic unsaturated bond, and a, b, and c are numbers satisfying 0<a<1, 0<b<1, and 0?c?0.2, and 0<d<1, respectively, but are also numbers satisfying 0.6?a/d 1.5, 1.5?b/d?3, and a+b+c+d=1, and (C) a catalyst for hydrosilylation reaction. This composition has excellent adhesiveness to a semiconductor element, and can form a cured product in which only a small number of bubbles are produced.

Abstract: This invention is directed to polyimide films having a carbon nanotube filler to provide a surface resistivity in a range from 50 ohm/square to 1.0×1015 ohms/square. The electrically conductive polyimides of the present invention have an excellent balance of properties relative to conventional polyimides having a conductive filler, due at least in part to the film's water content, degree of imidization and polymer orientation.

Abstract: A laminate having improved resistance to separation failure when incorporated into a flexible circuit structure. The laminate comprising a highly bondable polyimide and is preferably formed from a polyamic acid comprising a tetracarboxylic acid component, a diamine component, and 0.1 to 5.0 mole % of a dicarboxylic acid component, with respect to the tetracarboxylic acid component, and wherein the adhesive strength of the laminate is greater than 10 N/cm, and more preferably greater than 19 N/cm.