Abstract: [Problem] To provide an aqueous coating agent composition (in particular, an aqueous coating composition for lubricating films that contains a solid lubricant) which as a whole is excellent in terms of flowability, applicability, and storage stability and which is capable of forming satisfactory and smooth coating films effective in stick-slip inhibition. [Solution] The problem can be solved with an aqueous coating agent composition which comprises (A) a curable resin in an aqueous emulsion form, (B) a surfactant, (C) solid particles, (D) one or more nitrogenous heterocyclic compounds, (E) a film-forming silicone in an aqueous emulsion form, and (F) water. In particular, it is preferable that the (C) component comprise a solid lubricant. In view of the environmental regulations, it is especially preferable that the (D) component be 1,3-dimethyl-2-imidazolidinone.

Abstract: A film is formed by use of a composition containing (A) a binder resin, (B) a hard particle, and (C) a solid lubricant selected from the group containing molybdenum disulfide and graphite, wherein the composition contains tungsten carbide as the hard particle, and wherein weight ratio of (B) the hard particles and (C) the solid lubricant, (B)/(C), is in the range of 1 to 3.

Abstract: A method for producing a sealed optical semiconductor device makes it possible to seal an optical semiconductor element using a sealing film. The method includes: placing a sealing film on an optical semiconductor element substrate on which an optical semiconductor element is placed within a pressure reduction chamber, and the pressure within the chamber is reduced; heating the film where at least the periphery of the film is thermally fused to the surface of the optical semiconductor element placement substrate; and a step in which the reduction of pressure within the chamber is released and the optical semiconductor element placement substrate is sealed by the film. The temperature T2 of the optical semiconductor element placement substrate when the reduction of pressure within the chamber is released is a temperature at which the film exhibits a tensile strength of 0.02-0.15 MPa and an elongation at break of 150-450%.

Abstract: The present invention pertains to a curable organopolysiloxane composition comprising at least (A) an organopolysiloxane having at least two alkenyl groups per module, (B) an organopolysiloxane resin represented by average unit formula: (R13SiO1/2)a(R12SiO2/2)b(R2SiO3/2)c(SiO4/2)d. In the formula, R1's are the same or different from each other, and represent a hydrogen atom or a monovalent hydrocarbon group not having an aliphatic unsaturated carbon bond but at least two of the R1's per molecule represent hydrogen atoms, R2 represents a monovalent hydrocarbon group not having an aliphatic unsaturated bond, and a, b, and c are numbers satisfying 0<a<1, 0<b<1, and 0?c?0.2, and 0<d<1, respectively, but are also numbers satisfying 0.6?a/d 1.5, 1.5?b/d?3, and a+b+c+d=1, and (C) a catalyst for hydrosilylation reaction. This composition has excellent adhesiveness to a semiconductor element, and can form a cured product in which only a small number of bubbles are produced.

Abstract: This invention is directed to polyimide films having a carbon nanotube filler to provide a surface resistivity in a range from 50 ohm/square to 1.0×1015 ohms/square. The electrically conductive polyimides of the present invention have an excellent balance of properties relative to conventional polyimides having a conductive filler, due at least in part to the film's water content, degree of imidization and polymer orientation.

Abstract: A laminate having improved resistance to separation failure when incorporated into a flexible circuit structure. The laminate comprising a highly bondable polyimide and is preferably formed from a polyamic acid comprising a tetracarboxylic acid component, a diamine component, and 0.1 to 5.0 mole % of a dicarboxylic acid component, with respect to the tetracarboxylic acid component, and wherein the adhesive strength of the laminate is greater than 10 N/cm, and more preferably greater than 19 N/cm.

Abstract: The invention provides a polyimide film manufactured from a polyamic acid prepared from pyromellitic dianhydride in combination with 10 to 60 mol % of phenylenediamine and 40 to 90 mol % of 3,4?-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.

Abstract: A polyimide film F is brought into an intimate contact with a molding die 3 having a concave molding surface 3a so as to tightly close the open end thereof, and the polyimide film F is bent to deform only by the pressure difference of gas while being heated in a contactless manner. Molding is conducted by applying depressurization for a space 8 on the side of the molding die 3 relative to the polyimide film F while pressurizing the space 9 on the opposite side for the pressure difference at least in the final stage of the bending deformation so as to be in intimate contact with the concave molding surface 3a.

Abstract: A low set (at low temperatures) spandex, based on copoly(alkylene ethers), which are copolymers containing tetramethylene ether and either ethylene ether or 1,2-propylene ether moieties, is provided.

Abstract: The present invention provides a process whereby high quality, well-coalesced spandex can be made by dry-spinning a high-melting thermoplastic polyurethane, bundling the as-spun filaments into a side-by-side relationship, and passing the bundled filaments over or through a guide. The spandex made by this method has high-heat settability, high denier uniformity, good knittability and weavability, and provides fabrics having good surface uniformity.

Abstract: A winding process for an elastomeric fiber package using a contact roll that exerts variable pressure during the winding to create an elastomeric fiber package with a good package shape. The method including having a high initial force of the contact roll of less than 10 kg, reducing the force to about 25-60% of the initial force during the first 30% of winding time, then holding the force substantially constant until the final 30% of the winding time when the force is reduced to about a final force of 10-35% of the initial force. Wherein the final force is no less than about 1 kg and the package size is at least 4 kg.

Abstract: A polyimide film is manufactured from a random copolymeric, block copolymeric or interpenetrating polymer network-type polyamic acid prepared from pyromellitic dianhydride in combination with 22 to 78 mol % of 4,4′-oxydianiline and 22 to 78 mol % of 3,4′-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.

Abstract: A polyimide film is produced by copolymerizing pyromellitic dianhydride in combination with phenylenediamine, methylenedianiline and 3,4′-oxydianiline in a specific molar ratio. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.

Abstract: A reflector substrate (1) adapted for use in illumination device (8) comprises an a molded aromatic polyimide film wherein the film has a glass transition temperature from 210 to 290° C. and said polyimide film has structural units of general formula (I) and (II): wherein R1 is selected from the group consisting of: wherein R2 is selected from the group consisting of: and said polyimide film has the molar ratio X:Y from 100:0 to 20:80.

Abstract: Dry-spun polyurethane-based spandex ® containing 1-10 weight percent poly(vinylpyrrolidone) and a process of their preparation, are provided.

Abstract: A process for melt-spinning solution-polymerized polyurethanes, based on polvether glycols and MDI at an addition ratio of 1.8 to 6.0, glycol chain extenders and a chain terminator to produce number average molecular weights of the polyurethanes of 40,000-150,000, and 5-2500 decitex spandex made thereby, are provided.

Abstract: The present invention relates to polyurethane based fiber containing 0.1-25 percent poly(vinylidene fluoride) and a method of making the same.

Abstract: Spandex-type polyurethanes are protected against mechanical diagradation and yellowing which is produced by nitrogen oxide, chlorine or UV light, by incorporation of poly (N,N-diethyl-2-aminoethyl methacrylate) and either zinc oxide or an admixture of huntite and hydromagnesite.

Abstract: A dyeable polyparaphenylene terephthalamide fiber which has been wound once after spinning and has not been dyed yet, characterized in that it has a tensile strength of 15 g/denier or more and a crystal size (110 direction) of 30 to 55 angstroms and has no history of a treatment drying to have a water content of 8% or less, and a method for producing the same. A polyparaphenylene terephthalamide fiber which can be dyed while its properties of high strength and high modulus elasticity are maintained, and textile products made of the fiber which are dyed in a variety of colors, can be provided.

Abstract: A double-covered yarn based on a spandex core having a heat set of at least 50% and two sheath yarns wound in the same direction, a process for the preparation of such yarn and fabrics produced therefrom, are provided.