Abstract: The invention provides a polyimide film manufactured from a polyamic acid prepared from pyromellitic dianhydride in combination with 10 to 60 mol % of phenylenediamine and 40 to 90 mol % of 3,4?-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.
Type:
Grant
Filed:
August 23, 2001
Date of Patent:
June 21, 2005
Assignees:
E. I. du Pont de Nemours and Company, DuPont-Toray Co. Ltd.
Inventors:
Kenji Uhara, Kouichi Sawasaki, Naofumi Yasuda, Brian C. Auman, John D. Summers
Abstract: A polyimide film F is brought into an intimate contact with a molding die 3 having a concave molding surface 3a so as to tightly close the open end thereof, and the polyimide film F is bent to deform only by the pressure difference of gas while being heated in a contactless manner. Molding is conducted by applying depressurization for a space 8 on the side of the molding die 3 relative to the polyimide film F while pressurizing the space 9 on the opposite side for the pressure difference at least in the final stage of the bending deformation so as to be in intimate contact with the concave molding surface 3a.
Abstract: A low set (at low temperatures) spandex, based on copoly(alkylene ethers), which are copolymers containing tetramethylene ether and either ethylene ether or 1,2-propylene ether moieties, is provided.
Abstract: The present invention provides a process whereby high quality, well-coalesced spandex can be made by dry-spinning a high-melting thermoplastic polyurethane, bundling the as-spun filaments into a side-by-side relationship, and passing the bundled filaments over or through a guide. The spandex made by this method has high-heat settability, high denier uniformity, good knittability and weavability, and provides fabrics having good surface uniformity.
Abstract: A winding process for an elastomeric fiber package using a contact roll that exerts variable pressure during the winding to create an elastomeric fiber package with a good package shape. The method including having a high initial force of the contact roll of less than 10 kg, reducing the force to about 25-60% of the initial force during the first 30% of winding time, then holding the force substantially constant until the final 30% of the winding time when the force is reduced to about a final force of 10-35% of the initial force. Wherein the final force is no less than about 1 kg and the package size is at least 4 kg.
Abstract: A polyimide film is manufactured from a random copolymeric, block copolymeric or interpenetrating polymer network-type polyamic acid prepared from pyromellitic dianhydride in combination with 22 to 78 mol % of 4,4′-oxydianiline and 22 to 78 mol % of 3,4′-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.
Abstract: A polyimide film is produced by copolymerizing pyromellitic dianhydride in combination with phenylenediamine, methylenedianiline and 3,4′-oxydianiline in a specific molar ratio. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.
Abstract: A reflector substrate (1) adapted for use in illumination device (8) comprises an a molded aromatic polyimide film wherein the film has a glass transition temperature from 210 to 290° C. and said polyimide film has structural units of general formula (I) and (II):
wherein R1 is selected from the group consisting of:
wherein R2 is selected from the group consisting of:
and said polyimide film has the molar ratio X:Y from 100:0 to 20:80.
Abstract: Dry-spun polyurethane-based spandex ® containing 1-10 weight percent poly(vinylpyrrolidone) and a process of their preparation, are provided.
Abstract: A process for melt-spinning solution-polymerized polyurethanes, based on polvether glycols and MDI at an addition ratio of 1.8 to 6.0, glycol chain extenders and a chain terminator to produce number average molecular weights of the polyurethanes of 40,000-150,000, and 5-2500 decitex spandex made thereby, are provided.
Abstract: The present invention relates to polyurethane based fiber containing 0.1-25 percent poly(vinylidene fluoride) and a method of making the same.
Abstract: Spandex-type polyurethanes are protected against mechanical diagradation and yellowing which is produced by nitrogen oxide, chlorine or UV light, by incorporation of poly (N,N-diethyl-2-aminoethyl methacrylate) and either zinc oxide or an admixture of huntite and hydromagnesite.
Abstract: A dyeable polyparaphenylene terephthalamide fiber which has been wound once after spinning and has not been dyed yet, characterized in that it has a tensile strength of 15 g/denier or more and a crystal size (110 direction) of 30 to 55 angstroms and has no history of a treatment drying to have a water content of 8% or less, and a method for producing the same. A polyparaphenylene terephthalamide fiber which can be dyed while its properties of high strength and high modulus elasticity are maintained, and textile products made of the fiber which are dyed in a variety of colors, can be provided.
Abstract: A double-covered yarn based on a spandex core having a heat set of at least 50% and two sheath yarns wound in the same direction, a process for the preparation of such yarn and fabrics produced therefrom, are provided.
Abstract: A viscosity-stable solution of a polyurethaneurea, in the substantial absence of viscosity stabilizers, and spandex dry-spun therefrom, prepared from certain polyether glycols and aliphatic diisocyanates and ethylene diamine, are provided.
Abstract: The present invention provides a process whereby high quality, well-coalesced spandex can be made by dry-spinning a high-melting thermoplastic polyurethane, bundling the as-spun filaments into a side-by-side relationship, and passing the bundled filaments over or through a guide. The spandex made by this method has high heat-settability, high denier uniformity, good knittability and weavability, and provides fabrics having good surface uniformity.
Abstract: An elastic yarn winder for winding large-diameter elastic yarn packages onto a plurality of tubes without leaving broken yarn ends in the core of the packages is provided.
Abstract: A method of heat-setting garments by boarding the garment and subjecting it to preselected temperatures that are different for different parts of the garment and an apparatus for carrying out this method are provided.
Abstract: A process for preparing durable dry-spun, polyurethane fiber exhibiting a small angle X-ray scattering pattern that forms a layer line scattering image or an eyebrow-shaped four dot scattering image is provided. The fiber is particularly useful in pantyhose, undergarments and the like.
Abstract: A durable dry-spun, polyurethane fiber exhibits a small angle X-ray scattering pattern that forms a layer line scattering image or an eyebrow-shaped four dot scattering image. The fiber is particularly useful in pantyhose, undergarments and the like.