Patents Assigned to DYNEA AS
  • Publication number: 20100233475
    Abstract: Low formaldehyde emission wood based panels are described. These wood based panels have an outer surface layer comprised of a resin composition comprising a naturally occurring component or derivative thereof which is chemically bound to an aromatic hydroxyl compound-aldehyde resin (ncPF). The advantages of having an outer surface layer of the resin composition comprising ncPF, is that the outer surface layer can act as a surface sealer to reduce migration of components from the core of the wood based panel to the surface. The outer surface layer is pleasing to the consumer because it forms light colored faces on the wood based panel. It is also a superior surface for after treatment, such as for example, painting, when compared to amino or phenol resins. In addition, the outer surface layer comprising the inventive resin composition comprising ncPF can lend added fire-retardancy to the wood based panel.
    Type: Application
    Filed: August 30, 2007
    Publication date: September 16, 2010
    Applicant: Dynea OY
    Inventors: Wolfgang Kantner, Wolfgang Heep, Kristina Durkic
  • Publication number: 20090269602
    Abstract: Particle or MFD boards are disclosed comprising an aminoplastic resins and yet exhibiting low emissions levels of formaldehyde, as well as methods to arrive at such boards.
    Type: Application
    Filed: August 30, 2007
    Publication date: October 29, 2009
    Applicant: Dynea Oy
    Inventors: Manfred Dunky, Kristina Durkic, Gunnar Andersen
  • Publication number: 20090017709
    Abstract: An aqueous composition including a particulate novolac resin and a polyol, wherein >50% of the number of total particles of novolac resin have a particle size of >15 ?m and >5% of the number of total particles of novolac resin have a particle size of >50 ?m, wherein the particulate novolac resin has a dropping point temperature of >127° C., and wherein the aqueous composition is essentially free of organic solvent. The aqueous composition will form a stable dispersion which is ideal for the preparation of a film or coating of substrates such as fiberglass, nonwoven fibers, or lignocellulosic materials which include composite boards, plywoods, parquets, laminated veneer lumber (LVL), laminated flooring, doors, wood for door frames and paper.
    Type: Application
    Filed: August 7, 2007
    Publication date: January 15, 2009
    Applicant: Dynea Oy
    Inventors: Elke Fliedner, Marc Cornick, Hendrikus W.G. Van Herwijnen
  • Patent number: 7422787
    Abstract: Oriented strand board (OSB), comprising a core layer and two face layers, whereby the face layers comprise an adhesive composition, wherein the adhesive composition in at least one of the face layers comprises a resin composition comprising melamine, formaldehyde, optionally urea and aromatic hydroxyl compounds, wherein the molar ratio of melamine to formaldehyde is 1:0.8-4.0, the molar ratio of melamine to urea is 1:0-2.0 and the molar ratio of melamine to aromatic hydroxyl compounds is 1:0-2.0. In a preferred embodiment, both the face layers and the core layer comprise the said adhesive composition. The OSB's according to the invention can meet the OSB/3 and even the OSB/4 requirements in the EN 300 standards.
    Type: Grant
    Filed: June 28, 2004
    Date of Patent: September 9, 2008
    Assignees: DSM IP Assets B.V., Dynea Oy
    Inventors: Lars Evers, Rodolphus Antonius Theodorus Maria Benthem, Van, Jozef Maria Johannes Mattheij, Jose Guadalupe Gomez Bueso, Jacobus Adriaan Antonius Vermeulen
  • Patent number: 7419519
    Abstract: An abrasive composition comprising composite non-polymeric organic particles that is useful for chemical mechanical planarization (CMP), and which can widely be used in the semiconductor industry. The composite particles individually contain at least one nonpolymeric organic component and at least one other chemical component different from the at least one nonpolymeric organic component. The slurry composition can be vastly simplified if one or more of the components are incorporated into the abrasive particles. The abrasive compositions provide an efficient polishing rate, excellent selectivity and good surface quality when utilized as a new abrasive composition in CMP applications.
    Type: Grant
    Filed: January 5, 2006
    Date of Patent: September 2, 2008
    Assignee: Dynea Chemicals Oy
    Inventors: Yuzhuo Li, Kwok Tang, Wu Li, Guomin Bian, Krishnayya Cheemalapati, Vivek Duvvuru, Deenesh Bundi, Henry Bian
  • Publication number: 20080108741
    Abstract: A formaldehyde-free curable aqueous composition comprising an adduct of (a) carbohydrate polymer and (b) a multi-functional crosslinking agent such as a polybasic acid may be used as a binder for non-woven products such as fiberglass insulation.
    Type: Application
    Filed: November 1, 2007
    Publication date: May 8, 2008
    Applicant: Dynea Oy
    Inventors: Hendrikus W.G. Van Herwijnen, Elena Pisanova, Barbara Stefke
  • Publication number: 20080038977
    Abstract: Curable formaldehyde-free aqueous binders comprising alkyd resin dispersions or hybrid alkyd-acrylic resin dispersions that are useful in producing nonwoven products such as fiberglass insulation, roofing glass mats and filtration materials.
    Type: Application
    Filed: August 8, 2007
    Publication date: February 14, 2008
    Applicant: Dynea Oy
    Inventors: Jan Lebduska, Robert Schmidt, Elena Pisanova, Hendrikus van Herwijnen, Stefan Kowatsch
  • Publication number: 20070270066
    Abstract: A hydrophilic plant growth substrate formed with a formaldehyde-free curable aqueous binder. The formaldehyde-free curable aqueous binder is formed in a process comprising combining the following components: (a) a hydroxy-containing polymer, (b) a multi-functional crosslinking agent winch is at least one selected from the group consisting of a polyacid salt(s) thereof and anhydride, and (c) a hydrophilic modifier. The hydrophilic plant growth substrate has excellent properties and is made in an environmentally friendly process.
    Type: Application
    Filed: May 4, 2007
    Publication date: November 22, 2007
    Applicant: Dynea Austria GmbH
    Inventors: Hendrikus Van Herwijnen, Elena Pisanova, Alexander Tseitlin, Rob Schmidt
  • Publication number: 20060293440
    Abstract: Methods of producing curable water-soluble organic-inorganic hybrid binder compositions that are based on the use of polyols containing a plurality of pendant hydroxyl groups and organooxysilanes. The curable water-soluble organic-inorganic hybrid binders prepared are useful in producing nonwoven products such as glass fiber products, polyester fiber products and mineral wool products.
    Type: Application
    Filed: May 5, 2006
    Publication date: December 28, 2006
    Applicant: Dynea Austria GmbH
    Inventors: Alexander Tseitlin, Robert Schmidt, Elena Pisanova
  • Patent number: 7141193
    Abstract: Method for spectroscopically monitoring resin applied to a planar surface of veneer-wood sheets during travel in an assembly line. Spectroscopic instrumentation for monitoring applied resin is calibrated by measurements of predetermined resin applications to reference-test-samples, so as to provide a pre-determined relationship enabling monitoring of applied resin, during commercial production of a veneer-wood product using the visible light spectrum and near infrared extending to 2500 nm. Monitoring of selected radiation absorbance by the applied resin is carried out by spectroscopic measurement of non-absorbed electromagnetic radiation, as reflected back by the wood-veneer matrix; selected wavelengths are utilized for determining average resin-weight per designated surface area of a sheet.
    Type: Grant
    Filed: July 6, 2005
    Date of Patent: November 28, 2006
    Assignee: Dynea Chemicals Oy
    Inventors: Reginald A. Mbachu, Tyler G. Congleton
  • Publication number: 20060261306
    Abstract: An abrasive composition comprising composite non-polymeric organic particles that is useful for chemical mechanical planarization (CMP), and which can widely be used in the semiconductor industry. The composite particles individually contain at least one nonpolymeric organic component and at least one other chemical component different from the at least one nonpolymeric organic component. The slurry composition can be vastly simplified if one or more of the components are incorporated into the abrasive particles. The abrasive compositions provide an efficient polishing rate, excellent selectivity and good surface quality when utilized as a new abrasive composition in CMP applications.
    Type: Application
    Filed: January 5, 2006
    Publication date: November 23, 2006
    Applicant: DYNEA CHEMICALS OY
    Inventors: Yuzhuo Li, Kwok Tang, Wu Li, Guomin Bian, Krishnayya Cheemalapati, Vivek Duvvuru, Deenesh Bundi, Henry Bian
  • Publication number: 20060252855
    Abstract: A formaldehyde-free curable aqueous composition containing polyvinyl alcohol, a multi-functional crosslinking agent, and, optionally, a catalyst. The composition may be used as a binder for non-woven products such as fiberglass insulation. The non-woven products are formed by contacting the formaldehyde-free curable aqueous composition with fibrous components and the mixture is cured to form a rigid thermoset polymer providing excellent strength and water resistance of the cured nonwoven product.
    Type: Application
    Filed: May 5, 2006
    Publication date: November 9, 2006
    Applicant: Dynea Austria GmbH
    Inventors: Elena Pisanova, Robert Schmidt, Alexander Tseitlin
  • Patent number: 7128867
    Abstract: Process for calibration of spectroscopic instrumentation for non-invasive monitoring of resin-loading of furnish-type wood materials, such as particles or fibers for particleboard or medium density fiberboard, respectively. Selection of ranges of wavelengths within a 350 nm to 2500 nm region by providing selection of spectrometers and sensors for wavelength ranges of 350–1000 nm, 1000 to 1800 nm, 1000 to 2500 nm, and 400 to 2200 nm, for use by engineered-wood manufacturing installations. Resin-loaded wood material is exposed to selected VIS/NIR energy and monitored as it moves on-line in relation to calibrated spectroscopic instrumentation; a sensor collects non-absorbed radiation energy reflected by the wood materials. Measurements are processed, in relation to pre-established calibration data, to determine whether the resin-loading is within manufacturing objectives; monitoring and feedback are used to maintain desired specifications.
    Type: Grant
    Filed: December 10, 2004
    Date of Patent: October 31, 2006
    Assignee: Dynea Chemicals Oy
    Inventors: Reginald A. Mbachu, Tyler G. Congleton
  • Publication number: 20060138709
    Abstract: Process and apparatus for non-invasive measuring of binder mix loading of glass fibers for monitoring production of construction insulation product, such as roofing and wall insulation. The process utilizes visible (VIS) and near infrared (NIR) spectroscopy; and, is particularly advantageous when utilized in an on-line production processing following binder mix loading of glass fibers and prior to curing treatment of the binder mix loaded glass fibers. Such spectroscopic analyses can be carried out on a static or moving support substrate. The blend is then conveyed to and through curing treatment to form insulation product. The blend is exposed to VIS-NIR radiant energy, and a radiant energy sensor collects resulting data as to absorption following penetration of the VIS-NIR radiant energy. The spectroscopic instrumentation is calibrated to determine to facilitate accuracy; and, can be used to verify load following curing.
    Type: Application
    Filed: February 17, 2006
    Publication date: June 29, 2006
    Applicant: Dynea Chemicals OY
    Inventor: Reginald Mbachu
  • Patent number: 7037351
    Abstract: An abrasive composition comprising non-polymeric organic particles that is useful for chemical mechanical planarization (CMP), and which can widely be used in the semiconductor industry. The inventive compositions preferably comprise soft water in combination with 0.001–20 w/w % of non-polymeric organic particles, 0.1–10 w/w % of an oxidizing agent, 0.05–10 w/w % of a chelating agent, 0.01–10 w/w % of a surfactant, and 0–10 w/w % of a passivation agent at a pH in the range of 2–12, wherein said percentages are w/w (weight/weight) percentages, based on the total weight of said compositions. The abrasive compositions provide an efficient polishing rate, excellent selectivity and good surface quality when utilized as a new abrasive composition in CMP applications.
    Type: Grant
    Filed: December 15, 2003
    Date of Patent: May 2, 2006
    Assignee: Dynea Chemicals Oy
    Inventors: Yuzhuo Li, Atanu Roy Chowdhury, Kwok Tang, Guomin Bian, Krishnayya Cheemalapati
  • Patent number: 6962625
    Abstract: A device for application of a liquid gluing system comprising at least two components, such as a resin component and a hardener component, the device comprising at least two hollow members (11, 11?), each member being provided with a row of orifices designed to apply the respective components onto a substrate (6) below the hollow members (11, 11?), and at least two trays (2, 2?) one tray below each of the hollow members to receive surplus of the respective component not being applied onto the substrate, wherein the hollow members (11, 11?) are adapted to be placed in the respective tray (2, 2?) having the orifices below the level of the liquid in the tray. A method for avoiding plugging of the orifices in the hollow member during a stop in application is also described.
    Type: Grant
    Filed: December 3, 2003
    Date of Patent: November 8, 2005
    Assignee: Dynea Chemicals Oy
    Inventor: Ronny Bredesen
  • Publication number: 20050241743
    Abstract: Method for spectroscopically monitoring resin applied to a planar surface of veneer-wood sheets during travel in an assembly line. Spectroscopic instrumentation for monitoring applied resin is calibrated by measurements of predetermined resin applications to reference-test-samples, so as to provide a pre-determined relationship enabling monitoring of applied resin, during commercial production of a veneer-wood product using the visible light spectrum and near infrared extending to 2500 nm. Monitoring of selected radiation absorbance by the applied resin is carried out by spectroscopic measurement of non-absorbed electromagnetic radiation, as reflected back by the wood-veneer matrix; selected wavelengths are utilized for determining average resin-weight per designated surface area of a sheet.
    Type: Application
    Filed: July 6, 2005
    Publication date: November 3, 2005
    Applicant: DYNEA Chemicals OY
    Inventors: Reginald Mbachu, Tyler Congleton
  • Patent number: 6946502
    Abstract: The present invention concerns a paint composition which comprises a binder, a coalescent agent and optionally admixtures and auxiliary agents known per se. The film forming agent comprises a glycidyl ether or glycidyl ester or a mixture thereof, the hydrocarbyl residue of the alcohol or carboxylic acid, respectively, of the ether or ester comprising a linear or branched, saturated or unsaturated hydrocarbon having 3 to 20 carbon atoms. The invention further concerns a method of accelerating the hardening of paint compositions and a novel method of preparing glycidyl esters. The film forming agents used in the invention lower the film forming temperature better than conventional reactive film forming agents. Due to low volatility the compounds are suitable for no-VOC applications.
    Type: Grant
    Filed: January 18, 2000
    Date of Patent: September 20, 2005
    Assignee: Dynea Chemicals Oy
    Inventors: Maarit Lahtinen, Kari Rissanen, Salme Koskimies, Karri Airola, Robert Jansson
  • Patent number: 6942826
    Abstract: Method for spectroscopically monitoring resin applied to a planar surface of veneer-wood sheets during travel in an assembly line. Spectroscopic instrumentation for monitoring applied resin is calibrated by measurements of predetermined resin applications to reference-test-samples, so as to provide a pre-determined relationship enabling monitoring of applied resin, during commercial production of a veneer-wood product using the visible light spectrum and near infrared extending to 2500 nm. Monitoring of selected radiation absorbance by the applied resin is carried out by spectroscopic measurement of non-absorbed electromagnetic radiation, as reflected back by the wood-veneer matrix; selected wavelengths are utilized for determining average resin-weight per designated surface area of a sheet.
    Type: Grant
    Filed: March 11, 2004
    Date of Patent: September 13, 2005
    Assignee: DYNEA Chemicals Oy
    Inventors: Reginald A. Mbachu, Tyler G. Congleton
  • Publication number: 20050140037
    Abstract: Calibrating visual (VIS) and near infra red (NIR) spectroscopic instrumentation for quantitative measurement of resin-loading of prepared wood materials, as moving in an assembly-forming line, for subsequent pressing under heat and pressure for manufacture of engineered-composite wood product. Feedback of measured data of resin-loading, during in-line assembly operations, enables maintaining consistent resin-loading and optimizes resin usage. Calibration of VIS/NIR spectroscopic instrumentation can be carried out on equipment simulating in-line movement of pre-established reference-source test-samples; or, can be carried out during on-line movement of wood-material test samples. The developed calibration method removes absorptive effects at wavelengths for constituents other than resin, such as the moisture content of the wood-materials and of the resin, while maintaining accurate and prompt VIS/NIR spectroscopic measurements of resin-loading in a continuous assembly line.
    Type: Application
    Filed: December 13, 2004
    Publication date: June 30, 2005
    Applicant: Dynea Chemicals OY
    Inventors: Reginald Mbachu, Tyler Congleton