Patents Assigned to DYNEA AS
  • Publication number: 20050101024
    Abstract: Process for calibration of spectroscopic instrumentation for non-invasive monitoring of resin-loading of furnish-type wood materials, such as particles or fibers for particleboard or medium density fiberboard, respectively. Selection of ranges of wavelengths within a 350 nm to 2500 nm region by providing selection of spectrometers and sensors for wavelength ranges of 350-1000 nm, 1000 to 1800 nm, 1000 to 2500 nm, and 400 to 2200 nm, for use by engineered-wood manufacturing installations. Resin-loaded wood material is exposed to selected VIS/NIR energy and monitored as it moves on-line in relation to calibrated spectroscopic instrumentation; a sensor collects non-absorbed radiation energy reflected by the wood materials. Measurements are processed, in relation to pre-established calibration data, to determine whether the resin-loading is within manufacturing objectives; monitoring and feedback are used to maintain desired specifications.
    Type: Application
    Filed: December 10, 2004
    Publication date: May 12, 2005
    Applicant: Dynea Chemicals OY
    Inventors: Reginald Mbachu, Tyler Congleton
  • Patent number: 6881814
    Abstract: Phenolic resins and processes of making these phenolic resins that are useful for making binders for mineral wool insulation products are disclosed. The addition of a boron salt early in the process of making these phenolic resins leads to enhanced properties such as a reduction in the amount of tetradimers and an improvement in the stability of both the base resin and the pre-react.
    Type: Grant
    Filed: October 7, 2002
    Date of Patent: April 19, 2005
    Assignee: Dynea Canada Ltd.
    Inventors: Kwok Tang, Ruben A. Santos, Bohumila Zapletal
  • Patent number: 6846446
    Abstract: Calibrating near infra red (NIR) spectroscopic instrumentation for quantitative measurement of resin-loading of prepared wood materials, as moving in an assembly-forming line, for subsequent pressing under heat and pressure for manufacture of engineered-composite wood product. Feedback of measured data of resin-loading, during in-line assembly operations, enables maintaining consistent resin-loading and optimizes resin usage. Calibration of NIR spectroscopic instrumentation can be carried out on equipment simulating in-line movement of pre-established reference-source test-samples; or, can be carried out during on-line movement of wood-material test samples. The developed calibration method removes absorptive effects at wavelengths for constituents other than resin, such as the moisture content of the wood-materials and of the resin, while maintaining accurate and prompt NIR spectroscopic measurements of resin-loading in a continuous assembly line.
    Type: Grant
    Filed: November 14, 2002
    Date of Patent: January 25, 2005
    Assignee: Dynea Chemical Oy
    Inventors: Reginald A. Mbachu, Tyler G. Congleton
  • Patent number: 6846447
    Abstract: Process for calibration of spectroscopic instrumentation for non-invasive monitoring of resin-loading of furnish-type wood materials, such as particles or fibers for particleboard or medium density fiberboard, respectively. Selection of ranges of wavelengths within a 350 nm to 2500 nm region by providing selection of spectrometers and sensors for wavelength ranges of 350-1000 nm, 1000 to 1800 nm, 1000 to 2500 nm, and 400 to 2200 nm, for use by engineered-wood manufacturing installations. Resin-loaded wood material is exposed to selected VIS/NIR energy and monitored as it moves on-line in relation to calibrated spectroscopic instrumentation; a sensor collects non-absorbed radiation energy reflected by the wood materials. Measurements are processed, in relation to pre-established calibration data, to determine whether the resin-loading is within manufacturing objectives; monitoring and feedback are used to maintain desired specifications.
    Type: Grant
    Filed: January 7, 2003
    Date of Patent: January 25, 2005
    Assignee: Dynea Chemicals Oy
    Inventors: Reginald A. Mbachu, Tyler G. Congleton
  • Patent number: 6620215
    Abstract: The present invention is drawn to a composition comprising abrasive particles comprising an organic resin for chemical mechanical planarization (CMP), which can be widely used in the semiconductor industry. The abrasive composition is an aqueous slurry comprising abrasive particles comprising an organic resin, wherein the slurry is held at a pH in the range of 2-12. An attractive feature of the inventive abrasive composition is that it can be tailored to selectively remove different components from the surface. The inventive abrasive composition also provides efficient polishing rates and good surface quality when used in CMP applications.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: September 16, 2003
    Assignee: Dynea Canada, Ltd.
    Inventors: Yuzhuo Li, Guomin Bian, Kwok Tang, Joe Zunzi Zhao, John Westbrook, Yong Lin, Leina Chan
  • Patent number: 6593502
    Abstract: The invention relates to a process for the preparation of polyols having 3 or 4 hydroxyl groups, from an aldehyde and formaldehyde in the presence of water, followed by hydrogenation of the aldolisation product in the presence of a hydrogenation catalyst at an elevated temperature. The aledhyde is obtained by an aldolisation reaction of an aldehyde having at least two &agr;-hydrogen atoms and a formula according to R1CH2CHO, wherein R1 is selected from a group comprising hydrogen, alkyl groups having 1-7 carbon atoms which can have cycloalkyl substituents, cycloalkyl groups, aryl groups and aralkyl groups with 1-7 carbon atoms is the alkyl chain, with formaldehyde in the presence of water in an amount of 20-70 wt %, preferably 40-60 wt % and in the presence of an anion exchange resin. The hydrogenation is preferably carried out in the presence of water.
    Type: Grant
    Filed: January 2, 2002
    Date of Patent: July 15, 2003
    Assignee: Dynea Chemicals Oy
    Inventors: Tapio Salmi, Valentina Serra-Holm, Tiina-Kaisa Rantakylä, Päivi Mäki-Arvela, Lars-Peter Lindfors, Hannu Nousiainen
  • Patent number: 6489392
    Abstract: A foamed resin adhesive and its use for glueing wood based panels and boards such as plywood. The adhesive comprises 40-80% of an aqueous resin solution, 2-10% of an organic filler or fillers, 1-10% of a cationic acrylamide copolymer, and 0.05-1% of a surface active agent.
    Type: Grant
    Filed: September 8, 2000
    Date of Patent: December 3, 2002
    Assignee: Dynea Chemicals Oy
    Inventors: Esa Lappalainen, Niko Musakka
  • Publication number: 20020151754
    Abstract: The invention relates to a process for the preparation of polyols having 3 or 4 hydroxyl groups, from an aldehyde and formaldehyde in the presence of water, followed by hydrogenation of the aldolisation product in the presence of a hydrogenation catalyst at an elevated temperature. The aledhyde is obtained by an aldolisation reaction of an aldehyde having at least two &agr;-hydrogen atoms and a formula according to R1CH2CHO, wherein R1 is selected from a group comprising hydrogen, alkyl groups having 1-7 carbon atoms which can have cycloalkyl substituents, cycloalkyl groups, aryl groups and aralkyl groups with 1-7 carbon atoms is the alkyl chain, with formaldehyde in the presence of water in an amount of 20-70 wt %, preferably 40-60 wt % and in the presence of an anion exchange resin. The hydrogenation is preferably carried out in the presence of water.
    Type: Application
    Filed: January 2, 2002
    Publication date: October 17, 2002
    Applicant: Dynea Chemicals Oy
    Inventors: Tapio Salmi, Valentina Serra-Holm, Tiina-Kaisa Rantakyla, Paivi Maki-Arvela, Lars-Peter Lindfors, Hannu Nousiainen