Abstract: A bitline structure for use in a memory device may be connected to a plurality of bit memory cells. The bitline may be segmented into segments connected to one-third of the plurality of bit memory cells and two-thirds of the bit memory cells, respectively. The segments may be electrically coupled to each other to provide an overall bitline output.

Abstract: A floorplan for a Structured ASIC chip is shown having a core region containing memory and VCLB logic cells surrounded by a plurality of IO connection fabrics that include a first IO connection fabric comprising IO sub-banks connecting the core of the chip to pins for external signals to the core, a first high-speed routing fabric disposed along the east-west vertical top of the core and connects the core to high-speed IO such as SerDes; a network-aware connection fabric connects the core to a microcontroller primarily for testing and repair of the memory in the core; and a second-high speed routing fabric is disposed on the north-south vertical sides of the core and communicates with the IO sub-banks. The VCLB Structured ASIC chip is manufactured on a 28 nm CMOS process lithographic node or smaller, having several metal layers and preferably is programmed on a single via layer.

Abstract: A via-configurable logic block architecture for a Structured ASIC has a plurality of MOSFET transistor chains connected to one another through vias. In one embodiment there are three chains and the first transistor chain is a NFET transistor chain, the second transistor chain is a PFET transistor chain, and the third transistor chain is a NFET transistor chain. The first, second and third transistor chains are formed into devices made of transistors that are selected from a voltage threshold group consisting of LVT, SVT and HVT devices, where the first and third transistor chains are formed into devices from a voltage threshold group that is different from one another. In another embodiment transistor drive strength may be varied in the transistor chains of the logic block. In yet another embodiment both voltage threshold and drive strength may be varied together in a symmetrical manner.

Abstract: A memory system may provide for a successful write of a multi-port memory cell (e.g., dual-port 2WR SRAM cell) when it is simultaneously accessed by more than one port. This multi-port memory cell may include at least two independent accesses to the memory cell, where each access may be controlled by an independent wordline signal. Each port may have an independent pair of bitlines. Multiple write circuitry (e.g., double write circuitry) may enable the write driver to drive the input data to more than one pair of bitlines simultaneously.

Abstract: A via-configurable circuit block may contain chains of p-type and n-type transistors that may or may not be interconnected by means of configurable vias. Configurable vias may also be used to connect various transistor terminals to a ground line, a power line and/or to various terminals that may provide connections outside of the circuit block.

Abstract: A floorplan for a Structured ASIC chip is shown having a core region containing memory and VCLB logic cells surrounded by a plurality of IO connection fabrics that include a first IO connection fabric comprising IO sub-banks connecting the core of the chip to pins for external signals to the core, a first high-speed routing fabric disposed along the east-west vertical top of the core and connects the core to high-speed IO such as SerDes; a network-aware connection fabric connects the core to a microcontroller primarily for testing and repair of the memory in the core; and a second-high speed routing fabric is disposed on the north-south vertical sides of the core and communicates with the IO sub-banks. The VCLB Structured ASIC chip is manufactured on a 28 nm CMOS process lithographic node or smaller, having several metal layers and preferably is programmed on a single via layer.

Abstract: A network-fabric used for testing with an external or internal tester is shown for a Structured ASIC. In one embodiment, the Structured ASIC uses a microprocessor, network-aware IO routing fabric comprising network agents in a scalable novel configuration, with the network-aware IO having a plurality of blocks connected in series in a plurality of paths in the fabric leading to and from the microprocessor and memory and/or logic, the blocks acting as intelligent network agents under processor control to determine what state they can assume, whether to pass a data signal or not along these paths, comprising open loops and closed loops running to and from the microprocessor and memory and/or logic, primarily for testing and determining the state of the memory and logic. In another embodiment a JTAG controller may receive JTAG test commands from an external testing apparatus and set up to communicate along the fabric.

Abstract: A clock architecture for a Structured ASIC chip, manufactured using a CMOS process is shown. A via-configurable logic block (VCLB) architecture in the Structured ASIC has a core region containing memory and logic cells arranged in columns that are supplied by a clock network having a global clock network tree and a low-level clock mesh to distribute the global clock signal in a repeating pattern. The clock mesh has a fishbone configuration in outline and allows for scalable expansion of the clock network. In one embodiment 36 global clocks may be provided to the Structured ASIC, with four clocks per logic cell. The VCLB Structured ASIC chip is manufactured on a 28 nm CMOS process lithographic node, having several metal layers but preferably is programmable on a single via layer.

Abstract: A clock signal may be aligned with a data signal by delaying the signals relative to each other until an edge of one signal aligns with an edge of the other signal, and then causing an inversion of the clock signal. A further variation may limit the relative delay period to one-half clock cycle and may use a double inversion of the clock signal.

Abstract: A MEMS-based switching device may be used to implement an interconnect switch in a programmable integrated circuit device. Such a MEMS-based device may include a deformable cantilever that may form a closed or open circuit to thereby implement switching functionality.

Abstract: A semiconductor device may be created using multiple metal layers and a layer including programmable vias that may be used to form various patterns of interconnections among segments of metal layers. The programmable vias may be formed of materials whose resistance is changeable between a high-resistance state and a low-resistance state.

Abstract: A via-configurable circuit block may contain chains of p-type and n-type transistors that may or may not be interconnected by means of configurable vias. Configurable vias may also be used to connect various transistor terminals to a ground line, a power line and/or to various terminals that may provide connections outside of the circuit block.

Abstract: A configurable memory system may be able to support at least three different write policies, namely, no-read-on-write, read-before-write, and read-after-write. Such a system may include configurable write signal timing, configurable read signal timing, and/or configurable wordline enable signal timing. Static and/or dynamic configuration of the system may be used.

Abstract: A MEMS-based switching device may be used to implement an interconnect switch in a programmable integrated circuit device. Such a MEMS-based device may include a deformable cantilever that may form a closed or open circuit to thereby implement switching functionality.

Abstract: A semiconductor device may be created using multiple metal layers and a layer including programmable vias that may be used to form various patterns of interconnections among segments of metal layers. The programmable vias may be formed of materials whose resistance is changeable between a high-resistance state and a low-resistance state.

Abstract: A configurable logic array may include a multiplicity of logic components, which may contain customizable look-up tables, and layers of fixed metal segments all of which may be customizable using a single custom via layer. The integrated circuit containing the configurable logic array may also include a multiplicity of customizable register files, customizable RAM blocks; a ROM block with customizable contents; or test logic with customizable test options and configurations to separately test logic and the PLLs.

Abstract: A method for verifying library components and designs on a via customizable ASIC, which may include the process of adding capacitors to model possible via sites of a model of an un-customized portion of or a whole ASIC, and replacing the capacitors with resistors to model where custom vias have been placed on the ASIC to implement a desired component or design. Views of this model may then be generated to verify the functionality of the component or design, and component models for timing, function and via customization may then be generated for the component library.

Abstract: A configurable logic array may include: a multiplicity of logic cells, containing look-up tables; customizable metal and via connection layers overlying the multiplicity of logic cells; a multiplicity of device customizable I/O cells; a multiplicity of configuration customizable RAM blocks; a ROM block with customizable contents; and/or a microprocessor with customizable I/O, which may be used for configuring and testing the array, where the customizations are all done on a single via layer.

Abstract: A configurable logic array may include a multiplicity of logic components, which may contain customizable look-up tables, and layers of fixed metal segments all of which may be customizable using a single custom via layer. The integrated circuit containing the configurable logic array may also include a multiplicity of customizable register files, customizable RAM blocks; a ROM block with customizable contents; or test logic With customizable test options and configurations to separately test logic and the PLLs.

Abstract: A configurable logic array may include: a multiplicity of logic cells, containing look-up tables; customizable metal and via connection layers overlying the multiplicity of logic cells; a multiplicity of device customizable I/O cells; a multiplicity of configuration customizable RAM blocks; a ROM block with customizable contents; and a microprocessor with customizable I/O for configuring and testing the array, where the customizations are all done on a single via layer.