Abstract: New photoacid generator compounds (“PAGs”) are provided that comprise a cholate moiety and photoresist compositions that comprise such PAG compounds.
Type:
Grant
Filed:
June 5, 2017
Date of Patent:
October 20, 2020
Assignee:
Rohm and Haas Electronic Materials LLC
Inventors:
Emad Aqad, Mingqi Li, Joseph Mattia, Cheng-Bai Xu
Abstract: Acoustic wave sensors comprise: a piezoelectric layer, first and second electrodes arranged with the piezoelectric layer in a piezoelectric transducer circuit; and a polymeric sensing layer for adsorbing a gas-phase analyte, the adsorption of which analyte causes a change in resonant frequency of the piezoelectric transducer circuit, wherein the polymeric sensing layer comprises: (a) a polymer chosen from substituted or unsubstituted: polyarylenes comprising the reaction product of monomers comprising a first monomer comprising an aromatic acetylene group and a second monomer comprising a cyclopentadienone group; polyamides; polypyrazoles; or novolacs; or a cured product thereof; (b) a polymer chosen from substituted or unsubstituted: polyamic acids; or polyamic acid-polyimide copolymers; (c) a polymer formed from one or more monomers comprising a monomer comprising a polar group-substituted arylcyclobutene group, or a cured product thereof; or (d) a polymer comprising polymerized units of a monomer chosen fr
Type:
Grant
Filed:
January 8, 2019
Date of Patent:
October 6, 2020
Assignees:
Rohm and Haas Electronic Materials LLC, Rohm and Haas Electronic Materials Korea Ltd.
Inventors:
Christopher Gilmore, Aaron A. Rachford, Hee Jae Yoon, Jaclyn Murphy, Peter Trefonas, III, Deyan Wang
Abstract: Organic coating compositions, particularly antireflective coating compositions for use with an overcoated photoresist, are provided that comprise that comprise a crosslinker component that comprises a structure of the following Formula (I):
Type:
Grant
Filed:
August 31, 2016
Date of Patent:
September 29, 2020
Assignees:
Rohm and Haas Electronic Materials LLC, Rohm and Haas Electronic Materials Korea Ltd.
Inventors:
Matthew Grandbois, Myung Yeol Kim, Eui Hyun Ryu, Jae Hwan Sim, Min Kyung Jang, Jung-June Lee
Abstract: In a first aspect, methods are provided that comprise: (a) applying a curable composition on a substrate; (b) applying a hardmask composition above the curable composition; (c) applying a photoresist composition layer above the hard mask composition, wherein one or more of the compositions are removed in an ash-free process. In a second aspect, methods are provided that comprise (a) applying an organic composition on a substrate; (b) applying a photoresist composition layer above the organic composition, wherein the organic composition comprises a material that produce an alkaline-soluble group upon thermal and/or radiation treatment. Related compositions also are provided.
Type:
Grant
Filed:
June 23, 2017
Date of Patent:
August 25, 2020
Assignee:
Rohm and Haas Electronic Materials LLC
Inventors:
Anthony Zampini, Michael K. Gallagher, Owendi Ongayi
Abstract: Reaction products of diamines with the reaction products of monoamines and bisanhydrides are included as additives in metal electroplating baths. The metal electroplating baths have good throwing power and deposit metal layers having substantially planar surfaces. The metal plating baths may be used to deposit metal on substrates with surface features such as through-holes and vias.
Type:
Grant
Filed:
April 28, 2015
Date of Patent:
August 11, 2020
Assignees:
Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
Inventors:
Lingli Duan, Chen Chen, Shaoguang Feng, Zukhra I. Niazimbetova, Maria Anna Rzeznik
Abstract: Copper electroplating baths include reaction products of amines and polyacrylamides. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
Type:
Grant
Filed:
October 8, 2015
Date of Patent:
August 11, 2020
Assignees:
Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
Abstract: New photoresist compositions are provided that comprise a component that comprises an amide group and multiple hydroxyl groups. Preferred photoresists of the invention may comprise a resin with photoacid-labile groups; a photoacid generator compound; and an amide component with multiple hydroxyl groups that can function to decrease undesired photogenerated-acid diffusion out of unexposed regions of a photoresist coating layer.
Type:
Grant
Filed:
June 25, 2013
Date of Patent:
July 21, 2020
Assignee:
Rohm and Haas Electronic Materials LLC
Inventors:
Cong Liu, Chunyi Wu, Gerhard Pohlers, Gregory P. Prokopowicz, Mingqi Li, Cheng-Bai Xu
Abstract: Nickel electroplating compositions containing cationic polymers of a reaction product of an imidazole compound and a bisepoxide enable the electroplating of nickel deposits which have uniform bright surfaces over wide current density ranges.
Abstract: Nickel electroplating compositions containing copolymers of arginine and a bisepoxide enable the electroplating of nickel deposits which have uniform bright surfaces over wide current density ranges.
Abstract: In one aspect, organic coating compositions, particularly antireflective coating compositions, are provided that comprise that comprise a diene/dienophile reaction product. In another aspect, organic coating compositions, particularly antireflective coating compositions, are provided that comprise a component comprising a hydroxyl-naphthoic group, such as a 6-hydroxy-2-naphthoic group Preferred compositions of the invention are useful to reduce reflection of exposing radiation from a substrate back into an overcoated photoresist layer and/or function as a planarizing, conformal or via-fill layer.
Type:
Grant
Filed:
July 17, 2017
Date of Patent:
July 7, 2020
Assignee:
Rohm and Haas Electronic Materials LLC
Inventors:
John P. Amara, James F. Cameron, Jin Wuk Sung, Gregory P. Prokopowicz
Abstract: Pattern-formation methods comprise: (a) providing a substrate; (b) forming a photoresist pattern over the substrate; (c) applying a pattern treatment composition to the photoresist pattern, the pattern treatment composition comprising a solvent mixture comprising a first organic solvent and a second organic solvent, wherein the first organic solvent has a boiling point that is greater than a boiling point of the second organic solvent, and wherein the first organic solvent has a boiling point of 210° C. or more; and (d) thereafter heating the photoresist pattern. The methods find particular applicability in the manufacture of semiconductor devices.
Type:
Grant
Filed:
December 19, 2017
Date of Patent:
June 16, 2020
Assignee:
Rohm and Haas Electronic Materials LLC
Inventors:
Kevin Rowell, Cong Liu, Cheng Bai Xu, Irvinder Kaur, Xisen Hou, Mingqi Li
Abstract: New polymers are provided comprising (i) one or more covalently linked photoacid generator moieties and (ii) one or more photoacid-labile groups, wherein the one or more photoacid generator moieties are a component of one or more of the photoacid-labile groups. Preferred polymers of the invention are suitable for use in photoresists imaged at short wavelengths such as sub-200 nm, particularly 193 nm.
Type:
Grant
Filed:
March 31, 2011
Date of Patent:
June 2, 2020
Assignee:
Rohm and Haas Electronic Materials LLC
Inventors:
Emad Aqad, Cong Liu, Cheng-Bai Xu, Mingqi Li
Abstract: Copper electroplating baths include reaction products of amines, polyacrylamides and bisepoxides. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
Type:
Grant
Filed:
October 8, 2015
Date of Patent:
May 26, 2020
Assignees:
Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
Abstract: Select carboxymethyl-thio compounds are added to electroless copper plating compositions to improve the stability of the electroless copper plating compositions such that the plating activity of the electroless plating copper compositions is not compromised even when electroless plating at low plating temperatures and high stabilizer and high leached catalyst concentrations.
Type:
Grant
Filed:
July 13, 2018
Date of Patent:
May 19, 2020
Assignee:
Rohm and Haas Electronic Materials LLC
Inventors:
Alejo M. Lifschitz Arribio, Donald E. Cleary
Abstract: Copper electroplating compositions which include a diimidazole compound enables the electroplating of copper having uniform morphology on substrates. The composition and methods of enable copper electroplating of photoresist defined features. Such features include pillars, bond pads and line space features.
Abstract: Reaction products of amines and polymers containing saturated heterocyclic moieties may be used as levelers in metal electroplating baths. The reaction products may plate metal with good surface properties and good physical reliability.
Type:
Grant
Filed:
April 28, 2015
Date of Patent:
March 31, 2020
Assignees:
Rohm and Haas Electronics Materials LLC, Dow Global Technologies LLC
Inventors:
Lingli Duan, Chen Chen, Tong Sun, Zukhra I. Niazimbetova, Maria Anna Rzeznik
Abstract: Copper electroplating baths include reaction products of amines, polyacrylamides and sultones. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
Type:
Grant
Filed:
October 8, 2015
Date of Patent:
March 31, 2020
Assignees:
Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC
Abstract: Stable electroless copper plating baths include di-cation viologen compounds to improve rate of copper deposition on substrates. The copper from the electroless plating baths can be plated at low temperatures and at high plating rates.
Type:
Grant
Filed:
June 15, 2018
Date of Patent:
March 17, 2020
Assignee:
Rohm and Haas Electronic Materials LLC
Inventors:
Alejo M. Lifschitz Arribio, Donald E. Cleary
Abstract: A polymer composed of a reaction product of an amine and a quinone. The quinone is a Michael addition receptor. The polymer may be an additive for a copper electroplating bath. The polymer may function as a leveler and enable the copper electroplating bath to have high throwing power and provide copper deposits with reduced nodules.