Patents Assigned to Electronic & Technology
  • Publication number: 20240266130
    Abstract: A ground fault circuit interrupter (GFCI) socket. The socket includes a housing, where a first circuit board is arranged in the housing, a plurality of sets of jacks, conductive sheets, a safety door assembly, and a test key and a reset key are movably arranged on the housing in a penetrating manner. The housing includes an upper housing, a middle frame and a lower housing that are detachably connected, the safety door assembly is arranged between the upper housing and the middle frame, and the safety door assembly is provided with an elastic member for promoting the safety door assembly to shield the jacks. The middle frame forms a base of safety doors, an operation structure is arranged between the two sets of jacks, and the operation structure includes a linkage frame and contact bridges movably arranged on left and right sides of the linkage frame.
    Type: Application
    Filed: May 10, 2023
    Publication date: August 8, 2024
    Applicant: Zhejiang Yuchuang Electronic Technology Co, Ltd.
    Inventors: Yangen Chen, Jingzheng Chen
  • Publication number: 20240256729
    Abstract: Provided are a method and a system for determining a model output direction on the basis of heat dissipation characteristic analysis for stabilizing output of metal 3D printing.
    Type: Application
    Filed: May 25, 2022
    Publication date: August 1, 2024
    Applicant: Korea Electronics Technology Institute
    Inventors: Hwa Seon SHIN, Sung Hwan CHUN, Hye In LEE, Jae Ho SHIN, Sung Hun PARK
  • Publication number: 20240253124
    Abstract: A thermal-analysis-based output stabilization method and system for improving 3D printing output reliability are provided. The thermal-analysis-based output stabilization method according to an embodiment of the present invention comprises steps in which: an output stabilization system performs first stacking thermal analysis on a plurality of residual heat quantity review specimens for which a process range corresponding to normal output quality is set; the output stabilization system performs second stacking thermal analysis on an actual stacked product on the basis of the first stacking thermal analysis result in the same manner as the first stacking thermal analysis method; and the output stabilization system performs stability review on the stacking result of the stacked product on the basis of the second stacking thermal analysis result.
    Type: Application
    Filed: May 25, 2022
    Publication date: August 1, 2024
    Applicant: Korea Electronics Technology Institute
    Inventors: Jae Ho SHIN, Hwa Seon SHIN, Hye In LEE, Sung Hwan CHUN, Sung Hun PARK
  • Patent number: 12051230
    Abstract: Provided is a deep learning-based panoptic segmentation accelerated processing technique using a complexity-based RPN skip method. An image segmentation system includes: a first processing unit configured to extract dynamic objects in an instance segmentation method by using an extracted feature; a calculation unit configured to control to skip some areas of the feature extracted at the network by the first processing unit, on the basis of complexity of the input image; a second processing unit configured to extract static objects in a semantic segmentation method by using the feature extracted at the network; and a fusion unit configured to fuse a result of extracting by the first processing unit and a result of extracting by the second processing unit. Accordingly, the panoptic segmentation method can be easily performed even in an embedded environment by reducing complexity for panoptic segmentation processing by reducing a calculation burden.
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: July 30, 2024
    Assignee: Korea Electronics Technology Institute
    Inventors: Kyoung Won Min, Ganzorig Gankhuyag, Haeng Seon Son, Seon Young Lee, Young Bo Shim
  • Patent number: 12052827
    Abstract: A circuit board with improved heat dissipation function and a method for manufacturing the circuit board are provided. The method includes providing a first metal layer defining a first slot; forming a first adhesive layer in the first slot; electroplating copper on each first pillar to form a first heat conducting portion; forming a first insulating layer on the first adhesive layer having the first heat conducting portion, and defining a first blind hole in the first insulating layer; filling the first blind hole with thermoelectric separation metal to form a second heat conducting portion; forming a first wiring layer on the first insulating layer; forming a second insulating layer on the first wiring layer, defining a second blind hole on the second insulating layer; electroplating copper in the second blind hole to form a third heat conducting portion; mounting an electronic component on the second insulating layer.
    Type: Grant
    Filed: December 29, 2022
    Date of Patent: July 30, 2024
    Assignees: Hong Heng Sheng Electronical Technology (HuaiAn)Co., Ltd., Avary Holding (Shenzhen) Co., Limited.
    Inventors: Pan Tang, Fu-Lin Chang
  • Patent number: 12050728
    Abstract: A haptic effect transmission method for providing real-time immersive content according to the present invention includes executing participatory content in which one or more users participate, collecting motion information of the users participating in the participatory content through a haptic device, multiplexing the motion information with video and audio files of the participatory content to obtain a multiplexed file, and demultiplexing the multiplexed file and providing the demultiplexed file to a display device and a haptic device of a client terminal.
    Type: Grant
    Filed: September 18, 2019
    Date of Patent: July 30, 2024
    Assignee: Korea Electronics Technology Institute
    Inventors: Woo Chool Park, Jun Hwan Jang, Yong Hwa Kim, Jin Wook Yang, Sang Pil Yoon, Hyun Wook Kim, Eun Kyung Cho, Min Su Choi, Jun Suk Lee, Jae Young Yang
  • Patent number: 12051082
    Abstract: A system evaluates residential satisfaction of residents living in a building, based on preferred sections of the residents predicted using personal tendencies of the residents and sensing data collected through sensors in the building. The system may include a server that evaluates the residential satisfaction of the residents by analyzing a correlation between the sensing data and residential satisfaction information obtained from the survey conducted through a communication manner including the user terminals, and controls an air conditioning system in the building of a control target by predicting a feature-based preferred section of the users through random forest model learning.
    Type: Grant
    Filed: September 18, 2023
    Date of Patent: July 30, 2024
    Assignee: Korea Electronics Technology Institute
    Inventors: Min Goo Lee, Yong Kuk Park, Tae Heon No
  • Patent number: 12050365
    Abstract: A six-piece optical image capturing system is disclosed. In order from an object side to an image side, the optical lens along the optical axis includes a first lens with refractive power; a second lens with refractive power; a third lens with refractive power; a fourth lens with refractive power; a fifth lens with refractive power, and a sixth lens with negative refractive power. The image-side surface and object-side surface of the sixth lens are aspheric, and at least one surface of the sixth lens has an inflection point. At least one among the first lens to the fifth lens has positive refractive power. The optical lens of the optical image capturing system can increase aperture value and improve the imagining quality for use in compact cameras.
    Type: Grant
    Filed: November 17, 2021
    Date of Patent: July 30, 2024
    Assignee: Ability Opto Electronics Technology Co., Ltd.
    Inventors: Yeong-Ming Chang, Chien-Hsun Lai, Yao-Wei Liu
  • Publication number: 20240249558
    Abstract: Provided are a method for segmenting sign language into morphemes, a method for predicting morpheme positions, and a method for augmenting data. A system for analyzing sign language according to an embodiment of the present invention comprises: a recognition unit which recognizes key points of a speaker from a sign language video; and a prediction unit which inputs the recognized key points into an artificial intelligence model, segments the sign language into morphemes, and predicts position information of the segmented morphemes. Accordingly, by recognizing the morphemes of the sign language video frame by frame on the basis of a skeletal model and thereby segmenting the sign language into morphemes and predicting morpheme positions, it is possible to lay the foundations for accurate sign language translation.
    Type: Application
    Filed: June 20, 2022
    Publication date: July 25, 2024
    Applicant: Korea Electronics Technology Institute
    Inventors: Han Mu PARK, Jin Yea JANG, Sa Im SHIN
  • Patent number: 12045096
    Abstract: A two-parts shell or housing assembly not requiring a pressure jig for assembly includes an upper shell and a lower shell. The upper shell includes a first surface and a second surface. Hooks are disposed on edges of the second surface. The lower shell includes an inner bottom surface and a first blocking surface. A stepped portion is formed at the connection portion between the inner bottom surface and the first blocking surface. The stepped portion includes a first side and a second side. The upper shell is disposed on the second side. The first side defines slots corresponding to the hooks. A receiving space is formed by the hook, the stepped portion, and the second side for receiving adhesive. An electronic device is also provided.
    Type: Grant
    Filed: April 14, 2022
    Date of Patent: July 23, 2024
    Assignees: Zhengzhon Wanmayun Electronic Technology CO., Ltd., HONGFUJIN PRECISION ELECTRONICS (ZHENGZHOU) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Bo-Duo Yuan, Yan-Lei Cao
  • Patent number: D1036908
    Type: Grant
    Filed: April 7, 2024
    Date of Patent: July 30, 2024
    Assignee: Shanghai Bainian Zhonghuang Electronic Technology Co., Ltd.
    Inventor: Yongyong Xu
  • Patent number: D1037025
    Type: Grant
    Filed: July 20, 2022
    Date of Patent: July 30, 2024
    Assignee: Shenzhen Hongkang International Electronic Technology Co., Ltd.
    Inventors: Qilong Ai, Jieyuan Tan
  • Patent number: D1037047
    Type: Grant
    Filed: September 11, 2023
    Date of Patent: July 30, 2024
    Assignee: Dongguan Kaishuo Electronics Technology Co., Ltd.
    Inventor: Jing Cai
  • Patent number: D1037331
    Type: Grant
    Filed: March 2, 2023
    Date of Patent: July 30, 2024
    Assignee: Shenzhen Woshijie Electronic Technology Co., Ltd.
    Inventor: Lizhang Luo
  • Patent number: D1037476
    Type: Grant
    Filed: April 9, 2024
    Date of Patent: July 30, 2024
    Assignees: Dongguan Mimao Electronic Technology Co., Ltd., Shanghai Qiaran Industrial Co., Ltd.
    Inventor: Qinling Wang
  • Patent number: D1038087
    Type: Grant
    Filed: March 17, 2023
    Date of Patent: August 6, 2024
    Assignee: Shenzhen Haoyi Electronic Technology Co., Ltd.
    Inventor: Pan Huang
  • Patent number: D1038206
    Type: Grant
    Filed: November 21, 2023
    Date of Patent: August 6, 2024
    Assignee: ShenZhen Chuangmo Electronics Technology Co., Ltd.
    Inventors: Qifa Ling, Yurong He
  • Patent number: D1038241
    Type: Grant
    Filed: April 19, 2024
    Date of Patent: August 6, 2024
    Assignee: Shenzhen Yangliming Electronic Technology Co., Ltd.
    Inventor: Decheng Yang
  • Patent number: D1038490
    Type: Grant
    Filed: April 3, 2023
    Date of Patent: August 6, 2024
    Assignee: Shenzhen Xungujing Electronic Technology Co., Ltd.
    Inventor: Linkun Hua
  • Patent number: D1039052
    Type: Grant
    Filed: April 19, 2024
    Date of Patent: August 13, 2024
    Assignee: Shenzhen Yangliming Electronic Technology Co., Ltd.
    Inventor: Decheng Yang