Abstract: A time-division control circuit individually controls an effective voltage supplied to each lighting load by adjusting the periods during which switching circuits connected to N sets of lighting loads are kept on. A zero-cross signal having a value that changes at the zero-cross point of the AC voltage is generated. An oscillation signal is generated with a frequency equal to, or an integer multiple of the AC frequency. The phase difference between the zero-cross signal and the oscillation signal is measured and a common reference point that defines the timing for turning the switching circuits ON or OFF is determined on the basis of the measured phase difference. An ON/OFF signal for each switching circuit is transmitted at a timing for each of the N sets of switching circuits on the basis of the reference point and the effective voltage to be supplied to the lighting load.

Abstract: Provided is a power source for energizing a resistance welder, including: one or a plurality of lithium-based secondary batteries (11); a charging circuit (13) for charging the lithium-based secondary battery using an external power source; and a power conversion circuit (e.g. DC-DC converter (12)) for converting DC power discharged from the lithium-based secondary battery (11) into DC or AC power having a predetermined level of maximum instantaneous power for energizing the resistance welder.

Abstract: A Three-Dimensional Structure (3DS) Memory allows for physical separation of the memory circuits and the control logic circuit onto different layers such that each layer may be separately optimized. One control logic circuit suffices for several memory circuits, reducing cost. Fabrication of 3DS memory involves thinning of the memory circuit to less than 50 ?m in thickness and bonding the circuit to a circuit stack while still in wafer substrate form. Fine-grain high density inter-layer vertical bus connections are used. The 3DS memory manufacturing method enables several performance and physical size efficiencies, and is implemented with established semiconductor processing techniques.

Abstract: The Configurable Vertical Integration [CVI] invention pertains to methods and apparatus for the enhancement of yields of 3D or stacked integrated circuits and herein referred to as a CVI Integrated Circuit [CVI IC]. The CVI methods require no testing of circuit layer components prior to their fabrication as part of a 3D integrated circuit. The CVI invention uses active circuitry to configure the CVI IC as a means to isolate or prevent the use of defective circuitry. CVI circuit configuration method can be predominately described as a large grain method.

Abstract: A method of managing backup records is provided. A central server receives, across a network, the contents of a first backup catalog from a first backup server as well as the contents of a second (distinct) backup catalog from a second backup server. The central server also extracts backup records from the first backup catalog and the second backup catalog and places the contents of each extracted backup record into a central backup catalog on the central server. Software for carrying out the method is also provided.

Abstract: An improved metering apparatus includes a metering pipette (1) and a metering attachment (2). The metering pipette (1) includes a metering body (3) and a piston (4) which is longitudinally displaceably guided in the metering body (3). The metering attachment (2) is connected or connectable to the metering pipette (1). It includes a stop body (16) having a stop (17) for the piston (4) (FIG. 2).

Abstract: An injector or applicator is used for dispensing a liquid or pasty drug. It comprises an injector body (1), a piston body (2) and a closing cap (3). The closing cap (3) has a cap portion and a connecting portion. The cap portion is used for closing the opening of the injector or applicator. The connecting portion is used for connecting the closing cap (3) with the injector or applicator. The cap portion and the connecting portion are releasably connected by a tear edge. To create an improved tamper-proof feature, the housing portion (1) has an undercut, and the piston body (2) has a protrusion (FIG. 6).

Abstract: A light emitting device which is inexpensive and has excellent characteristics and a method for manufacturing the same are provided. In the present invention, a chip-size package including a reflection wall is formed by forming a double structure in which a fluorescent material-containing film piece 2 is bonded on a light extraction surface of a semiconductor light emitting element 6 having bumps 4 and 5 on an electrode-formed surface, and covering an exposed surface of the double structure other than a bump mounting surface 7 and a light exit surface 8 with the reflection wall 3, whereby it is possible to provide a light emitting device which does not need a package substrate, is inexpensive, and has excellent brightness characteristics and heat radiation characteristics, and a manufacturing method having excellent chromaticity yield.

Abstract: The present invention is aimed at providing a dimmer capable of preventing malfunctions due to noise contamination or waveform distortion of the voltage of an AC power source.

Abstract: After a scratch 160 or similar defect formed on the readout surface of an optical disc is nearly completely removed by grinding and polishing the readout surface with surface with a grinding/polishing agent or similar compound, the readout surface is coated with a coating agent 170 made of a transparent resin or similar material. In this process, a significant change in the thickness of the optical disc before and after the restoration can be prevented by controlling the grind/polishing and coating processes so that the decrease in the thickness due to the grinding/polishing is nearly equal to the increase in the thickness due to the application of the coating agent 170. Therefore, even a Blu-ray Disc or similar optical disc having only a small distance from the surface to the information record layer can be restored many times.

Abstract: A Three-Dimensional Structure (3DS) Memory allows for physical separation of the memory circuits and the control logic circuit onto different layers such that each layer may be separately optimized. One control logic circuit suffices for several memory circuits, reducing cost. Fabrication of 3DS memory involves thinning of the memory circuit to less than 50 ?m in thickness and bonding the circuit to a circuit stack while still in wafer substrate form. Fine-grain high density inter-layer vertical bus connections are used. The 3DS memory manufacturing method enables several performance and physical size efficiencies, and is implemented with established semiconductor processing techniques.

Abstract: An optical disk restoration apparatus and optical disk restoration method are provided, which are capable of achieving a high level of capability of restoring a scratched optical disk, without consuming the time and labor of an operator, while reducing the production cost of the apparatus. During a polishing process, an appropriate amount of a polishing agent is dropped onto the readout surface of the optical disk by a polishing agent supply pump to continuously supply the polishing agent to the interface between the optical disk and polishing pads, while a polishing water supply pump is operated to replenish the polishing agent with moisture evaporated by the polishing heat. By this mechanism, the amount and physical properties of the polishing agent at the interface between the optical disk and the polishing pads are appropriately maintained for a long period of time, so that the restoration capability is maintained at high levels.

Abstract: In a germination/growing apparatus having: a heat shield chamber that can be opened and closed; an illuminator for illuminating the inside of the heat shield chamber; a temperature regulator for heating and/or cooling the inside of the heat shield chamber; and a controller for controlling the temperature regulator, whereby seeds or plants are contained in the germination/growing apparatus for germinating or growing in the heat shield chamber, a breath inspirer for inspiring a human breath to the heat shield chamber is provided. With this configuration, the concentration of the carbon dioxide in the heat shield chamber can be increased, and the growth of the plant can be promoted.

Abstract: A method in a mobile communication system for determining a distance between a first mobile terminal and a second mobile terminal. Based on a trigger distance between the first and the second mobile terminal, a triggered location server defines an area surrounding the first mobile terminal and optionally defines an area surrounding the second mobile terminal. The trigger distance may be provided by an application e.g. for providing a location based service. If the first mobile terminal determines that it has moved outside of its area, it sends a trigger to the triggered location server. If the trigger distance between the first and the second mobile terminal is reached, the triggered location server may report this to the application as an event.

Abstract: A Three-Dimensional Structure (3DS) Memory allows for physical separation of the memory circuits and the control logic circuit onto different layers such that each layer may be separately optimized. One control logic circuit suffices for several memory circuits, reducing cost. Fabrication of 3DS memory involves thinning of the memory circuit to less than 50 ?m in thickness and bonding the circuit to a circuit stack while still in wafer substrate form. Fine-grain high density inter-layer vertical bus connections are used. The 3DS memory manufacturing method enables several performance and physical size efficiencies, and is implemented with established semiconductor processing techniques.

Abstract: A Three-Dimensional Structure (3DS) Memory allows for physical separation of the memory circuits and the control logic circuit onto different layers such that each layer may be separately optimized. One control logic circuit suffices for several memory circuits, reducing cost. Fabrication of 3DS memory involves thinning of the memory circuit to less than 50 ?m in thickness and bonding the circuit to a circuit stack while still in wafer substrate form. Fine-grain high density inter-layer vertical bus connections are used. The 3DS memory manufacturing method enables several performance and physical size efficiencies, and is implemented with established semiconductor processing techniques.

Abstract: An LED lighting apparatus includes an LED-mounting base having LED elements mounted on its surface and a heat-dissipating section fixed on the back side of the LED-mounting base. The heat dissipating section is provided with: a core having a sealed space and heat-dissipating fins provided around the core. Thus, an LED lighting apparatus which has a shape substantially the same as that of a large mercury lighting apparatus, and which can efficiently dissipate heat generated from the LED elements, with only the smallest increase in the weight of the apparatus, can be provided. The electronic-circuit housing section may contain an electric circuit for generating power to be supplied to the LED elements. Furthermore, it is desirable to leave a small space in the electronic-circuit housing section so as to absorb the expansion of the cooling liquid, rather than completely fill the electronic-circuit housing section with the cooling liquid.

Abstract: The Vertical System Integration (VSI) invention herein is a method for integration of disparate electronic, optical and MEMS technologies into a single integrated circuit die or component and wherein the individual device layers used in the VSI fabrication processes are preferably previously fabricated components intended for generic multiple application use and not necessarily limited in its use to a specific application. The VSI method of integration lowers the cost difference between lower volume custom electronic products and high volume generic use electronic products by eliminating or reducing circuit design, layout, tooling and fabrication costs.

Abstract: An optical disk polishing device which includes: a disk holder for rotatably holding an optical disk, the disk holder installed in a lower fixed portion; a cylindrical buff disposed in parallel with the surface of the optical disk and perpendicular to a rotary shaft of the disk holder in an offset manner; a drive motor to rotate the buff; and an upper opening-and-closing portion normally urged to an open state to the lower fixed portion by a spring or other member. The device makes it possible to clean a readout surface of the optical disk in a short period of time, and to be offered at a low price owing to the simple and small-sized structure thereof.

Abstract: A Three-Dimensional Structure (3DS) Memory allows for physical separation of the memory circuits and the control logic circuit onto different layers such that each layer may be separately optimized. One control logic circuit suffices for several memory circuits, reducing cost Fabrication of 3DS memory involves thinning of the memory circuit to less than 50 ?m in thickness and bonding the circuit to a circuit stack while still in wafer substrate form. Fine-grain high density inter-layer vertical bus connections are used. The 3DS memory manufacturing method enables several performance and physical size efficiencies, and is implemented with established semiconductor processing techniques.