Patents Assigned to EMC Technologies
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Publication number: 20150101710Abstract: A method for the low-pressure carbonitriding of steel parts, in particular parts used in the manufacture of automobiles, comprises a heating step that includes a simple heating phase (M) followed by an initial nitridation phase (Ni) from a temperature between 700° C. to 750° C. to a temperature between 860° and 1000° C. and carried out using a reduced temperature gradient relative to the simple heating phase. Additionally, alternate cementing (C1-Cn) and nitridation (N1-Nn) steps are performed at constant temperature, wherein the final nitridation step is accompanied with a decrease in temperature immediately before quenching (T).Type: ApplicationFiled: October 8, 2012Publication date: April 16, 2015Applicant: EMC TechnologiesInventors: Philippe Lapierre, Jerome Lardinois, Yves Giraud, Alfred Rallo
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Patent number: 7125214Abstract: Described is a seaming machine for use with a container (22) and an end closure (28). The machine includes a seaming head (62) with multiple shaft assemblies (100) and a lifter table (60) located below the seaming head (62) and including multiple container stations. During use, the lifter table (60) and seaming head (62) rotate in unison about the centerline of a spindle (64). A single shaft assembly (100) is provided at each station to perform a two-step seaming operation on its corresponding container (22). In one embodiment, a seaming cam (66) is located above the seaming head (62) for moving first and second cam followers (116), (118) in the shaft assembly (100). In another embodiment, the cam followers (116) and (118) have a master/slave relationship dependent on which step of the seaming operation is being conducted. In another embodiment, a single piece plate (122) is used in a cover feed assembly (120) and provides end closures (28) to a make-up point (30).Type: GrantFiled: May 5, 2005Date of Patent: October 24, 2006Assignee: EMC Technologies, Inc.Inventors: Jos Carrein, Raymond J. Gibbs
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Publication number: 20030026991Abstract: A substrate having a diamond or diamond-like carbon coating of at least one micron thickness on an underlayer of an insulating material such as AlN. Such a substrate is advantageously used as a mounting for passive electrical components such as microwave and radio-frequency (rf) resistors, capacitors, attenuators, terminators and loads.Type: ApplicationFiled: August 13, 2002Publication date: February 6, 2003Applicant: EMC TECHNOLOGY, INC.Inventors: Rajendra Shah, Joseph B. Mazzochette, Martin A. Helfand
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Publication number: 20030025488Abstract: A power sensing RF termination comprising a calibration means allows the user to correct for part-to-part variation, miss match loss and output offset. The power sensing RF termination comprises a first and second temperature sensitive resistors connected at a first common junction, a switching means for connecting either an RF input or a DC power reference to the first common junction, a first switch for connecting either a DC voltage source or a first current detecting resistor to the first temperature sensitive resistor, and a second current detecting resistor connected to the second temperature sensitive resistor. A first output terminal is connected to the junction between the first switch and the first temperature sensitive resistor. A second output terminal is connected to the first common junction. A third output terminal is connected to the junction between the second temperature sensitive resistor and the second current detecting resistor.Type: ApplicationFiled: October 1, 2002Publication date: February 6, 2003Applicant: EMC TECHNOLOGY, INC.Inventors: Joseph B. Mazzochette, Robert Blacka, David Markman
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Patent number: 6459254Abstract: A power sensing RF termination comprising a calibration means allows the user to correct for part-to-part variation, miss match loss and output offset. The power sensing RF termination comprises a first and second temperature sensitive resistors connected at a first common junction, a switching means for connecting either an RF input or a DC power reference to the first common junction, a first switch for connecting either a DC voltage source or a first current detecting resistor to the first temperature sensitive resistor, and a second current detecting resistor connected to the second temperature sensitive resistor. A first output terminal is connected to the junction between the first switch and the first temperature sensitive resistor. A second output terminal is connected to the first common junction. A third output terminal is connected to the junction between the second temperature sensitive resistor and the second current detecting resistor.Type: GrantFiled: September 26, 2000Date of Patent: October 1, 2002Assignee: EMC Technology, Inc.Inventors: Joseph B. Mazzochette, Robert Blacka, David Markman
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Patent number: 6147481Abstract: A circuit for determining power changes in an RF circuit includes first and second temperature sensitive resistors connected in parallel with an RF input terminal so as to have a common junction therewith. The first resistor has a positive temperature coefficient of resistance and the second resistor has a negative temperature coefficient of resistance. A DC input terminal is connected to one of the temperature sensitive resistors and an output terminal is connected to the common junction of the two temperature sensitive resistors. Third and fourth temperature sensitive resistors have a common junction. The third resistor has a positive temperature coefficient of resistance and the fourth resistor has a negative temperature coefficient of resistance. The DC input terminal is also connected to one of the third and fourth temperature sensitive resistors, and an output terminal is connected to the common junction of the third and fourth temperature sensitive resistors.Type: GrantFiled: June 3, 1997Date of Patent: November 14, 2000Assignee: EMC Technology LLCInventors: Joseph B. Mazzochette, Robert Blacka, David Markman
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Patent number: 6049262Abstract: A transmission line device includes at least two rectangular plates of an insulating material having opposed planar surfaces and edges. A transmission line of a conductive material is on a surface of at least one of the plates and extends between two opposed edges of the plates. The plate having a transmission line thereon has holes therethrough adjacent its opposed edges, which holes extend to the ends of the transmission line. The holes are filled with a conductive material which makes electrical contact to the ends of the holes. Ground planes of a conductive material are on a surface of the plates. The plates are stacked together with the surface having the transmission lines facing a surface of another plate, and the ground planes facing outwardly. The plates are mechanically secured together either by metal clips or by a suitable cement between the opposed surfaces of the plates. Terminals are at the edges of the plates and are connected to the ends of the transmission line and to the ground planes.Type: GrantFiled: August 28, 1997Date of Patent: April 11, 2000Assignee: EMC Technology LLCInventor: Joseph B. Mazzochette
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Patent number: 6016085Abstract: An RF termination load includes a base of an electrically and thermally conductive material having opposed surfaces. A recess is in one of the surfaces of the base and a groove in the one surface extends from the recess to an edge of the base. A resistor is seated in the recess in the base. The resistor includes a substrate of an electrically insulating material having opposed surfaces and a resistance film on one of the surface of the substrate. A first contact of a resistance film is on the one surface of the substrate at one end of the resistor and a second contact of an electrically conductive material is on the one surface of the substrate at the other end of the resistor. The second contact extends over an edge of the substrate and over the other surface of the substrate. The resistor is mounted in the recess with the second contact being seated on and contacting the base. An RF cable has an end in the groove in the base.Type: GrantFiled: September 28, 1998Date of Patent: January 18, 2000Assignee: EMC Technology LLCInventor: Joseph B. Mazzochette
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Patent number: 5999064Abstract: A temperature compensating voltage variable attenuator includes at least two temperature variable resistors. The temperature variable resistors have different temperature coefficients of resistance, preferably, with one temperature variable resistor having a positive temperature coefficient of resistance and the other temperature variable resistor having a negative temperature coefficient of resistance. The temperature coefficient of resistance of the temperature variable resistors being such that the attenuation of the attenuator varies with changes in temperature of the attenuator. A voltage variable heater resistor is adjacent both temperature variable resistors so that a change in the voltage applied to the heater resistor changes the temperature of the heater resistor. The heat from the heater resistor is applied to the temperature variable resistors so as to change the resistance of the temperature variable resistors. This provides a controlled change in the attenuation of the attenuator.Type: GrantFiled: July 23, 1998Date of Patent: December 7, 1999Assignee: EMC Technology LLCInventors: Robert Blacka, David Markman, Joseph B. Mazzochette
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Patent number: 5986516Abstract: An attenuator includes a flat, substantially rectangular substrate of an insulating material having a surface. A plurality of termination areas of a conductive material are on the substrate surface and are spaced from each other. Three resistors are on the substrate surface and are connected in a series parallel combination between the termination areas. The resistors may be formed by three separate resistance layers extending between and connected to the termination areas, or a single resistance layer extending between and connected to the termination areas. A shunt capacitor is on the substrate surface and is connected to one of the resistors. The shunt capacitor is formed by an area of a conductive material on the substrate surface and overlapping a portion of the resistors, and a dielectric layer between the conductive area and the resistor.Type: GrantFiled: December 29, 1997Date of Patent: November 16, 1999Assignee: EMC Technology LLCInventor: Joseph B. Mazzochette
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Patent number: 5953811Abstract: The temperature coefficient of resistance (TCR) of a resistor having a layer of a resistance material on a surface of a substrate and a termination layer of a conductive material at opposite ends of the resistance layer is adjusted by changing the area of at least one of the termination layers. The area of the termination layer is changed by removing a portion of the termination layer. The portion of the termination layer can be removed by making a cut through the termination layer which extends along a line across at least a portion of the termination layer. This method can be used to form matched pairs of resistors by first adjusting the resistance value of at least one of a pair of the resistors at room temperature to provide the resistors with substantially the same resistance values. The TCR of one of the resistors is then adjusted by removing a portion of one of the terminations of the resistor until both resistors have substantially the same TCR.Type: GrantFiled: January 20, 1998Date of Patent: September 21, 1999Assignee: EMC Technology LLCInventor: Joseph B. Mazzochette
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Patent number: 5945905Abstract: A high power resistor includes a substrate of an insulating material having opposed first and second surfaces, and a strip of a resistance material on the first surface of the substrate. The resistance strip has side edges which are spaced from the side edges of the substrate. A contact of a conductive material is at each end of the resistance strip. Each contact extends to a separate end of the substrate, across the end and over a portion of the second surface of the substrate. The portions of the contacts which are on the second surface of the substrate or no longer than the portions of the contacts on the first surface of the substrate. At least one heat sink strip of a conductive material is on the second surface of the substrate. The heat sink strip is of a size that it does not overlap the resistance strip so as to minimize any capacitance between the heat sink strip and the resistance strip.Type: GrantFiled: December 21, 1998Date of Patent: August 31, 1999Assignee: EMC Technology LLCInventor: Joseph B. Mazzochette
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Patent number: 5920241Abstract: A phase shifter in which the change in phase changes with changes in temperature. The phase shifter includes a plurality of capacitors and inductors connected in series relation to form a filter network. Each of the capacitors has a dielectric material with a temperature coefficient so that the capacitance of the capacitor varies with temperature. Each of the inductors has a ferrite material which has a temperature coefficient so that the inductance of the inductor varies with temperature. The temperature coefficients of the dielectric material of the capacitors and the ferrite material of the inductors have the same sign, i.e, either negative or positive, and preferably are of the same value.Type: GrantFiled: May 12, 1997Date of Patent: July 6, 1999Assignee: EMC Technology LLCInventor: Joseph B. Mazzochette
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Patent number: 5834991Abstract: A Lange coupler device which includes a first layer which is a base substrate of a dielectric material such as alumina. Deposited on this substrate are second, third and fourth layers of the device. Each layer is made from a thick-film material. The second layer is a conductive layer, arranged in five parallel lines. One of the outermost lines is connected to the center line at one end of the substrate while the other outermost line is connected to the center line at the opposite end of the substrate. This leaves two lines unconnected at this layer. The third layer is a dielectric layer which has through-holes to: 1) each end of the unconnected lines of the bottom layer, 2) the unconnected ends of the outermost lines and, 3) the middle of the center line. The fourth layer of material is a conductive layer. The fourth layer is arranged as three parallel lines, each perpendicular to the lines of the second layer.Type: GrantFiled: April 18, 1994Date of Patent: November 10, 1998Assignee: EMC Technology, Inc.Inventor: Joseph B. Mazzochette
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Patent number: 5739743Abstract: A chip resistor includes a substantially rectangular substrate of an insulating material having opposed substantially flat top and bottom surfaces and edges extending between the top and bottom surfaces. A layer of a resistance material is on the top surface of the substrate. Separate termination layers of a conductive material are on the top surface or the substrate and contact the resistance layer at opposite ends thereof. Each of the termination layers extends across an edge of the substrate and over a portion of the bottom surface of the substrate. The total area of the portions of the termination layers on the bottom surface of the substrate is greater than the total area of the portions of the termination layers on the top surface of the substrate so that the spacing between the ends of the portions of the termination layers on the bottom surface of the substrate is smaller than the spacing between the ends of the portions of the termination layers on the top surface of the substrate.Type: GrantFiled: February 5, 1996Date of Patent: April 14, 1998Assignee: EMC Technology, Inc.Inventor: Joseph B. Mazzochette
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Patent number: 5670917Abstract: The present invention is directed to an AC termination which includes a substrate having first and second surfaces. A resistor is mounted on the first surface of the substrate. An input termination is at one end of the resistor. At least one plate of a capacitor is on the substrate and is electrically connected in series with the other end of the resistor. In one form of the termination, the capacitor is a metal film on the substrate extending from the other end of the resistor to and across the second surface of the substrate to form one electrode of the capacitor. A dielectric layer is over the metal film and another metal film extends over the dielectric layer to form the other electrode of the capacitor and the output termination of the termination. In another form of the termination, the capacitor is formed on a cover plate which extends over the first surface of the substrate and is electrically connected between the resistor and an output termination.Type: GrantFiled: September 12, 1996Date of Patent: September 23, 1997Assignee: EMC Technology, Inc.Inventor: Joseph B. Mazzochette
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Patent number: 5598131Abstract: The present invention is directed to an AC termination which includes a substrate having first and second surfaces. A resistor is mounted on the first surface of the substrate. An input termination is at one end of the resistor. At least one plate of a capacitor is on the substrate and is electrically connected in series with the other end of the resistor. In one form of the termination, the capacitor is a metal film on the substrate extending from the other end of the resistor to and across the second surface of the substrate to form one electrode of the capacitor. A dielectric layer is over the metal film and another metal film extends over the dielectric layer to form the other electrode of the capacitor and the output termination of the termination. In another form of the termination, the capacitor is formed on a cover plate which extends over the first surface of the substrate and is electrically connected between the resistor and an output termination.Type: GrantFiled: November 16, 1995Date of Patent: January 28, 1997Assignee: EMC Technology, Inc.Inventor: Joseph B. Mazzochette
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Patent number: 5585769Abstract: A temperature variable phase-shifter formed of passive components. The phase-shifter includes a power divider which is adapted to receive a signal and divide the signal into two components which are 90.degree. out of phase with each other. The outputs of the power divider are connected to positive and negative temperature variable attenuators which attenuated the components of the signal. The temperature variable attenuators are connected to a combiner which sums the attenuated signals from the temperature variable attenuators.Type: GrantFiled: August 14, 1995Date of Patent: December 17, 1996Assignee: EMC Technology, Inc.Inventor: Joseph B. Mazzochette
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Patent number: 5521563Abstract: A hybrid coupler which includes a substrate of an insulating material having a pair of opposed surfaces. A conductive ground plane is on one of the substrate surfaces. A pair of conductive transmission lines are over the other substrate surface and a layer of a dielectric material is over the other substrate surface. Each of the transmission lines has one portion which is on the substrate surface and under the dielectric layer, another portion which is over the dielectric layer and a connecting portion which electrically connects the two portions of the transmission line. Each of the connecting portion extends through an opening in the dielectric layer and one of the connecting portions crosses over the other connecting portion. The portions of the transmission lines may extend in straight lines, in a serpentine path or in a rectangular path.Type: GrantFiled: June 5, 1995Date of Patent: May 28, 1996Assignee: EMC Technology, Inc.Inventor: Joseph B. Mazzochette
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Patent number: 5521577Abstract: A low profile load resistor includes a base plate of an electrically conductive material having a pair of opposed flat surfaces and a hole therethrough. A chip resistor is mounted on one of the surfaces of the base plate. The chip resistor includes a substrate of an electrical insulating material having a pair of opposed flat surfaces and a hole therethrough which is aligned with the hole in the base plate. A resistance film is on one of the surfaces of the substrate and has termination films at opposite ends thereof. A termination tab is electrically connected to one of the termination films and extends through the holes in the substrate and base plate. The other termination film is electrically connected to the base plate. A cover plate of an electrical insulating material is over the resistor film and is mechanically connected to the substrate.Type: GrantFiled: September 1, 1995Date of Patent: May 28, 1996Assignee: EMC Technology Inc.Inventor: Jospeh B. Mazzochette