Abstract: An electrical terminal for an electrical component to surface mount the component on a printed circuit board with the component extending upright from the printed circuit board. The electrical terminal includes a metal strip having a pair of spaced tabs extending in the same direction from the metal strip to form an U-shaped clip within which the electrical component fits. A separate foot extends from each tab with the feet being aligned in the same plane and extending in opposite directions from the tabs. The feet are adapted to seat on the surface of a printed circuit board to support the electrical component in the upright position on the board. A plurality of the terminals are mounted in spaced relation along an edge of the electrical component and can be soldered to terminal pads on the electrical component to electrically and mechanically connect the terminals to the electrical component.
Abstract: A high accuracy programmable attenuator for accurately selecting and maintaining desired values of attenuation for a high frequency RF signal. The attenuator is comprised of a plurality of cells wherein each cell is comprised of an individual attenuator, a switch and a bias resistor. Each bias resistor is comprised of a plurality of individual resistors arranged in a binary sequence and wire bonds are used to short out undesired resistors for compensating for insertion loss and obtaining desired attenuation. The attenuators of the circuit are also arranged in a binary sequence so as to allow the user to select from a large variety of attenuations in small increments.
Abstract: An absorptive temperature variable microwave attenuator is produced utilizing at least two different thick film resistors. The temperature coefficients of the resistors are different and are selected so that the attenuator changes at a controlled rate with changes in temperature while the impedance of the attenuator remains substantially constant. Substantially any temperature coefficient of resistance can be created for each resistor by properly selecting and mixing different inks when forming the thick film resistors. Furthermore, attenuators can be created having either a negative temperature coefficient of attenuation or a positive temperature coefficient of attenuation.
Type:
Grant
Filed:
July 31, 1992
Date of Patent:
July 26, 1994
Assignee:
EMC Technology, Inc.
Inventors:
Joseph B. Mazzochette, John R. Steponick
Abstract: A method is provided for soldering using tin-containing solder to substrate surfaces that are gold plated wherein a selected portion of the gold plated surface is treated by impacting with a high velocity stream of fine nickel containing abrasive particles to remove all the gold from the treated surface and then effecting joining to the treated surface by conventional soldering techniques.
Abstract: A method is provided for soldering using tin-containing solder to substrate surfaces that are gold plated wherein a selected portion of the gold plated surface is treated by impacting with a high velocity stream of fine nickel containing abrasive particles to remove all the gold from the treated surface and then effecting joining to the treated surface by conventional soldering techniques.
Abstract: A stress-free transitional RF connector assembly is provided which electrically connects a planar conductor in a planar electric circuit with a cable or component having a conventional RF connector at one end thereof. The assembly includes a connector body one end of which is arranged to mate with the cable or component connector, and the other end of which is formed to accommodate the planar circuit. A conductive pin held in the connector body and extending to a fixed connection which may be made to the planar conductor is provided therebetween with a joint which permits rotation and axial movement relatively between the resulting two pin parts while maintaining electrical contact.
Abstract: A solid state device or circuit mounted or printed on a heat conductive ceramic substrate such as beryllia is brought into thermal conductive relation with a metal heat dissipation plate as by clamping with no intervening materials such as an adhesive or solder therebetween.