Abstract: A system for synchronizing central processing units (CPU) includes a schedule module that communicates a synchronization point, a first CPU that writes a first memory address to a first register in response to the first CPU reaching the synchronization point, and a second CPU that writes a second memory address to a second register in response to the second CPU reaching the synchronization point. The system further includes a first logical AND module that writes a first value to a third register based on the first and second memory addresses and a second logical AND module that writes a second value to a fourth register based on the first and second memory addresses. The system also includes a scheduler module that selectively generates a processor sync signal based on the first and second value.

Abstract: A circuit board assembly including a heating device operated during cold boot startup includes a circuit board having a computer component. A thermal transfer device connected to the circuit board assembly acts when the computer component is operating to remove heat generated by the computer component. A heating device operates to heat the thermal transfer device. A field programmable gate array acts to energize the heating device when a temperature defining a cold startup condition at the computer component or the thermal transfer device is sensed. The thermal transfer device when heated by the heating device heats the computer component to greater than the temperature of the cold startup condition. A control device connected to the heating device provides an operational mode of the heating device.

Abstract: A system for providing electrical power connection across components mounted to a backplane of an electrical chassis includes a backplane having multiple apertures and front and rear faces. A daughter board faces the front face of the backplane. The daughter board has multiple traces with individual conductive pads. A power connector connected to the rear face of the backplane has multiple conductive members. Multiple fasteners each extend through both the daughter board and into the backplane to electrically couple each of the conductive pads of the daughter board to one of the conductive members of the power connector.

Abstract: A USB receptacle assembly includes a USB receptacle. The receptacle has a first end and a second end opposite the first end. The USB receptacle also includes a USB interface located at the first end. A riser is coupled to the second end of the USB receptacle and is generally perpendicular to a long axis of the USB receptacle. A board connector is coupled to the riser in electrical communication with the USB receptacle.

Abstract: A power entry module (PEM) that is used with an electronics equipment enclosure. The PEM has a housing adapted to be coupled to a shelf of the electronics equipment enclosure. The housing has at least one pair of power cable lugs accessible from an exterior of the housing for coupling the PEM to a pair of power cables associated with a power feed. The PEM also has a backplane connector for coupling the PEM to a blackplane of the electronics enclosure. A distribution network is disposed within the PEM housing and forms at least a pair of electrically isolated power distribution buses for coupling electrical power provided from the power cables to each of the power distribution branches. Each power distribution branch independently provides electrical power to at least one blade supported within the electronics equipment enclosure.

Abstract: A system comprises an input and a hardware description language (HDL) module. The input receives design specifications for a custom circuit board. The design specifications are selected from predetermined design options for custom circuit boards. The hardware description language (HDL) module generates HDL corresponding to the design specifications and outputs the HDL to a circuit board producer.

Abstract: An embedded computer chassis may include a midplane having a first side and second side substantially opposite each other, where the midplane is suitably adapted to receive at least one computer card in each of the first side and the second side. Embedded computer chassis may further include a cooling region suitably adapted to cool the at least one computer card, where at least a portion of the cooling region is suitably adapted to receive a first fan tray and a second fan tray, where the first fan tray is suitably adapted to couple to the first side of the midplane, and where the second fan tray is suitably adapted to couple to the second side of the midplane. The first fan tray and the second fan tray are substantially redundant for removing the heat generated by the at least one computer card.

Abstract: A gap filler member apparatus for blocking air flow through a gap existing between an edge of a first electronics board and a surface of a second electronics board that is disposed generally perpendicular to the first electronics board, where the first and second electronics boards are coupled by at least one pair of connectors and disposed within an electronics equipment enclosure, to block air flow through the gap. The apparatus has at least one rib extending therefrom, with the base portion being secureable to the surface of the second electronics board. A rib extends away from the base portion and has a height approximately equal to a height of the gap, and a length at least as long as a length of the gap so that the rib at least substantially blocks air flow through the gap.

Abstract: A method of transporting a RapidIO packet (135) from an initiator RapidIO domain (102) over an IP packet network (110) to a receiver RapidIO domain (104) can include the initiator RapidIO domain creating the RapidIO packet and reading a destination domain ID (483) of the RapidIO packet, where the destination domain ID corresponds to the receiver RapidIO domain. The destination domain ID is mapped to a receiver RapidIO domain IP address (473). The RapidIO packet is encapsulated in an IP packet (436) and the IP packet is communicated to the receiver RapidIO domain over the IP packet network.

Abstract: A multi-service platform system (100) includes a VXS backplane (104), a switched fabric (106) operating on the VXS backplane, a parallel bus (108) operating coincident with the switched fabric on the VXS backplane, a VXS payload module (102) coupled to the VXS backplane, and a storage module (110) coupled to the VXS payload module, wherein the storage module is coupled to communicate with the switched fabric.

Abstract: A power distribution system and method may include a first power domain having a first plurality of power rails, a second power domain having a second plurality of power rails, where the first power domain is electrically independent of the second power domain, and a plurality of modules coupled to the first power domain and the second power domain, where each of the plurality of modules is coupled to one of the first plurality of power rails and one of the second plurality of power rails. The system may also include a plurality of mated pairs, where each of the plurality of modules is in only one of the plurality of mated pairs, and where each of the plurality of mated pairs is coupled to two separate of the first and second plurality of power rails.

Abstract: A chassis (300) for housing at least one cardcage (302) is disclosed. The chassis includes a first portion (420) of a chassis housing (300) through a sixth portion (460) thereof. The first through sixth portions forming a boundary around a storage region of the chassis housing (300). The chassis (300) also includes at least one air moving device (316). At least first (413) and second openings (425) are situated within the chassis housing (300). The first and (413) second openings (425) located at substantially different elevations relative to each other. A cardcage (302) is located in the storage region and situated in a skewed orientation relative to at least two of the portions of the chassis housing (300). The at least first (413) and second (425) openings and the at least one air moving device (316) are located relative to the skewed oriented cardcage (302) to facilitate airflow thereacross.

Abstract: A multi-service platform system (100, 200) including a VMEbus network (102) and a switched fabric network (104) wherein the VMEbus network (102) and the switched fabric network (104) operate concurrently within the multi-service platform system (100, 200). Multi-service platform system (100, 200) can include a payload module (106) with a first switched fabric connector (210) in a P0 mechanical envelope (218) that is designed to interface with a corresponding first switched fabric connector (212) in the J0 mechanical envelope (220) on a backplane (204).

Abstract: A multi-service platform system, includes a backplane (104), a switched fabric (106) on the backplane, and at least one of a VMEbus network and a PCI network coincident with the switched fabric on the backplane. A payload module (102) has one of a 3U form factor, a 6U form factor and a 9U form factor, where the payload module is communicatively coupled with the backplane using the switched fabric and at least one of the VMEbus network and the PCI network. At least one multi-gigabit connector (118) is coupled to a rear edge (119) of the payload module, where the at least one multi-gigabit connector is coupled to communicatively interface the payload module to the backplane, and where the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector. A storage module (112, 113) is coupled to the payload module, where the storage module is coupled to communicate with the switched fabric.

Abstract: A configurable switching device includes a switch card coupled to interface with a backplane of a computer chassis, a plurality of PCI-Express switching elements coupled to the switch card, and a configuration means coupled to the switch card, where the configuration means is operable to configure and reconfigure the plurality of PCI-Express switching elements to operate in a plurality of directional fabric domains, and where each of the plurality of PCI-Express switching elements can operate in only one of the plurality of directional fabric domains at a time.

Abstract: A Micro Telecommunications Computing Architecture, MicroTCA, test system comprises an interconnect for communication between modules of the MicroTCA test system. A test controller module, such as a JTAG, Switch Module, is coupled to the interconnect and comprises an interface for coupling to at least one unit under test. An interface module, such as a MicroTCA Carrier Hub module, receives test instruction messages from an external connection and forwards these to the test controller module via the interconnect. The test instruction messages comprise test input data for at least a first unit under test. The test controller module furthermore comprises an extraction processor for extracting the test input data from the test instruction messages; and a test controller for performing a test of the first unit under test in response to the test input data.

Abstract: A method of discovering and operating a payload node (104) includes in a computer network (100) having a central node (102) coupled to a payload node slot (110), coupling the payload node to the payload node slot. The payload node executing a payload boot algorithm (120) located at the payload node. The payload boot algorithm discovers a hardware capability set (122) of the payload node. The payload boot algorithm communicating the hardware capability set to a payload discovery manager (114) at the central node. The payload discovery manager selecting a software set (116) based on the hardware capability set. The payload discovery manager communicating the software set to the payload node and the payload node transitioning from the payload boot algorithm to the software set while bypassing rebooting the payload node to the software set.

Abstract: A power distribution unit may include a power distribution unit frame, where the power distribution unit frame has a 2U form factor, and where the power distribution unit frame is coupled to mount in an embedded computer frame. A plurality of power ingress sites may be coupled to a rear portion of the power distribution unit frame, where each of the plurality of power ingress sites has a current capacity of at least 100 amperes, where each of the plurality of power ingress sites includes an ingress pin coupled to interface with an ingress in-line, hyperboloid radial socket, and where the power distribution unit has a current capacity density of the plurality of power ingress sites of at least 600 amperes per power distribution unit.

Abstract: A switched fabric mezzanine storage module (560) includes a storage module (562) and a switched fabric connector (563) coupled to the storage module. The storage module is coupled to directly communicate with a switched fabric (506), where the switched fabric storage mezzanine module is coupled to a payload module (502) having one of a 3U form factor, a 6U form factor and a 9U form factor. The payload module can include at least one multi-gigabit connector (518) coupled to a rear edge (519) of the payload module, where the at least one multi-gigabit connector is coupled to communicatively interface with a backplane (504).

Abstract: A multi-service platform system, includes a backplane (104), a switched fabric (106) on the backplane, and at least one of a VMEbus network and a PCI network coincident with the switched fabric on the backplane. A payload module (102) has one of a 3U form factor, a 6U form factor and a 9U form factor, where the payload module is communicatively coupled with the backplane using the switched fabric and at least one of the VMEbus network and the PCI network. At least one multi-gigabit connector (118) is coupled to a rear edge (119) of the payload module, where the at least one multi-gigabit connector is coupled to communicatively interface the payload module to the backplane, and where the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector.