Abstract: A cooling system that has a fan having a plurality of fan blades disposed in a housing, with the fan having an input side and an exhaust side. A flow divider component may be disposed parallel to an axial center of the fan and positioned adjacent to the housing of the fan, and adjacent to one of the input side or the exhaust side. The flow divider may further project away from the fan blades for channeling an air flow created by the fan blades.

Abstract: A gap filler member apparatus for blocking air flow through a gap existing between an edge of a first electronics board and a surface of a second electronics board that is disposed generally perpendicular to the first electronics board, where the first and second electronics boards are coupled by at least one pair of connectors and disposed within an electronics equipment enclosure, to block air flow through the gap. The apparatus has at least one rib extending therefrom, with the base portion being secureable to the surface of the second electronics board. A rib extends away from the base portion and has a height approximately equal to a height of the gap, and a length at least as long as a length of the gap so that the rib at least substantially blocks air flow through the gap.

Abstract: An air flow restrictor panel adapted for use in an electronics equipment enclosure to block a gap existing between a midplane and an electronics module positioned adjacent the midplane. The air flow restrictor panel may incorporate a main panel portion and a plurality of flanges extending from the main panel portion. The main panel portion may have a footprint sufficiently large in area to block the gap.

Abstract: An apparatus is disclosed for restricting air flow through an electronics enclosure. The apparatus may include a panel having at least one edge adapted to be secured to a surface of the electronics enclosure to thus place the panel in a path of a cooling air flow flowing through a cardcage portion of the enclosure. The panel may have a footprint that at least substantially fills an opening through which said cooling air flow flows through said cardcage portion of the enclosure. The panel may have a plurality of openings so that the panel reduces a volume of a cooling air flow flowing through the panel by a predetermined desired degree, and thus reduces a volume of the air flow through the cardcage to a desired volume.

Abstract: A system and method for providing a graphical representation of a computer device and display overlay is disclosed. A computer device is represented in a graphical representation. The computer device comprises at least two modules. An overlay comprising at least one attribute corresponding to each of the modules is positioned such that the attributes are spatially associated with the modules corresponding thereto.

Abstract: A method of transporting a RapidIO packet (135) from an initiator RapidIO domain (102) over an IP packet network (110) to a receiver RapidIO domain (104) can include the initiator RapidIO domain creating the RapidIO packet and reading a destination domain ID (483) of the RapidIO packet, where the destination domain ID corresponds to the receiver RapidIO domain. The destination domain ID is mapped to a receiver RapidIO domain IP address (473). The RapidIO packet is encapsulated in an IP packet (436) and the IP packet is communicated to the receiver RapidIO domain over the IP packet network.

Abstract: A multi-service platform system (100) includes a VXS backplane (104), a switched fabric (106) operating on the VXS backplane, a parallel bus (108) operating coincident with the switched fabric on the VXS backplane, a VXS payload module (102) coupled to the VXS backplane, and a storage module (110) coupled to the VXS payload module, wherein the storage module is coupled to communicate with the switched fabric.

Abstract: A power distribution system and method may include a first power domain having a first plurality of power rails, a second power domain having a second plurality of power rails, where the first power domain is electrically independent of the second power domain, and a plurality of modules coupled to the first power domain and the second power domain, where each of the plurality of modules is coupled to one of the first plurality of power rails and one of the second plurality of power rails. The system may also include a plurality of mated pairs, where each of the plurality of modules is in only one of the plurality of mated pairs, and where each of the plurality of mated pairs is coupled to two separate of the first and second plurality of power rails.

Abstract: A chassis (300) for housing at least one cardcage (302) is disclosed. The chassis includes a first portion (420) of a chassis housing (300) through a sixth portion (460) thereof. The first through sixth portions forming a boundary around a storage region of the chassis housing (300). The chassis (300) also includes at least one air moving device (316). At least first (413) and second openings (425) are situated within the chassis housing (300). The first and (413) second openings (425) located at substantially different elevations relative to each other. A cardcage (302) is located in the storage region and situated in a skewed orientation relative to at least two of the portions of the chassis housing (300). The at least first (413) and second (425) openings and the at least one air moving device (316) are located relative to the skewed oriented cardcage (302) to facilitate airflow thereacross.

Abstract: A multi-service platform system (100, 200) including a VMEbus network (102) and a switched fabric network (104) wherein the VMEbus network (102) and the switched fabric network (104) operate concurrently within the multi-service platform system (100, 200). Multi-service platform system (100, 200) can include a payload module (106) with a first switched fabric connector (210) in a P0 mechanical envelope (218) that is designed to interface with a corresponding first switched fabric connector (212) in the J0 mechanical envelope (220) on a backplane (204).

Abstract: A multi-service platform system, includes a backplane (104), a switched fabric (106) on the backplane, and at least one of a VMEbus network and a PCI network coincident with the switched fabric on the backplane. A payload module (102) has one of a 3U form factor, a 6U form factor and a 9U form factor, where the payload module is communicatively coupled with the backplane using the switched fabric and at least one of the VMEbus network and the PCI network. At least one multi-gigabit connector (118) is coupled to a rear edge (119) of the payload module, where the at least one multi-gigabit connector is coupled to communicatively interface the payload module to the backplane, and where the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector. A storage module (112, 113) is coupled to the payload module, where the storage module is coupled to communicate with the switched fabric.

Abstract: A configurable switching device includes a switch card coupled to interface with a backplane of a computer chassis, a plurality of PCI-Express switching elements coupled to the switch card, and a configuration means coupled to the switch card, where the configuration means is operable to configure and reconfigure the plurality of PCI-Express switching elements to operate in a plurality of directional fabric domains, and where each of the plurality of PCI-Express switching elements can operate in only one of the plurality of directional fabric domains at a time.

Abstract: A Micro Telecommunications Computing Architecture, MicroTCA, test system comprises an interconnect for communication between modules of the MicroTCA test system. A test controller module, such as a JTAG, Switch Module, is coupled to the interconnect and comprises an interface for coupling to at least one unit under test. An interface module, such as a MicroTCA Carrier Hub module, receives test instruction messages from an external connection and forwards these to the test controller module via the interconnect. The test instruction messages comprise test input data for at least a first unit under test. The test controller module furthermore comprises an extraction processor for extracting the test input data from the test instruction messages; and a test controller for performing a test of the first unit under test in response to the test input data.

Abstract: A method of discovering and operating a payload node (104) includes in a computer network (100) having a central node (102) coupled to a payload node slot (110), coupling the payload node to the payload node slot. The payload node executing a payload boot algorithm (120) located at the payload node. The payload boot algorithm discovers a hardware capability set (122) of the payload node. The payload boot algorithm communicating the hardware capability set to a payload discovery manager (114) at the central node. The payload discovery manager selecting a software set (116) based on the hardware capability set. The payload discovery manager communicating the software set to the payload node and the payload node transitioning from the payload boot algorithm to the software set while bypassing rebooting the payload node to the software set.

Abstract: A power distribution unit may include a power distribution unit frame, where the power distribution unit frame has a 2U form factor, and where the power distribution unit frame is coupled to mount in an embedded computer frame. A plurality of power ingress sites may be coupled to a rear portion of the power distribution unit frame, where each of the plurality of power ingress sites has a current capacity of at least 100 amperes, where each of the plurality of power ingress sites includes an ingress pin coupled to interface with an ingress in-line, hyperboloid radial socket, and where the power distribution unit has a current capacity density of the plurality of power ingress sites of at least 600 amperes per power distribution unit.

Abstract: A switched fabric mezzanine storage module (560) includes a storage module (562) and a switched fabric connector (563) coupled to the storage module. The storage module is coupled to directly communicate with a switched fabric (506), where the switched fabric storage mezzanine module is coupled to a payload module (502) having one of a 3U form factor, a 6U form factor and a 9U form factor. The payload module can include at least one multi-gigabit connector (518) coupled to a rear edge (519) of the payload module, where the at least one multi-gigabit connector is coupled to communicatively interface with a backplane (504).

Abstract: A multi-service platform system, includes a backplane (104), a switched fabric (106) on the backplane, and at least one of a VMEbus network and a PCI network coincident with the switched fabric on the backplane. A payload module (102) has one of a 3U form factor, a 6U form factor and a 9U form factor, where the payload module is communicatively coupled with the backplane using the switched fabric and at least one of the VMEbus network and the PCI network. At least one multi-gigabit connector (118) is coupled to a rear edge (119) of the payload module, where the at least one multi-gigabit connector is coupled to communicatively interface the payload module to the backplane, and where the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector.

Abstract: A subrack having a front side and a rear side, wherein the subrack is coupled to receive an Advanced Mezzanine Card module, the subrack includes a monolithic backplane having a first portion and second portion, where the first portion runs substantially along the front side and the second portion runs substantially along the rear side. A first slot is to receive the Advanced Mezzanine Card module inserted via the front side and connect the Advanced Mezzanine Card module directly to the second portion of the monolithic backplane. A second slot is to receive the Advanced Mezzanine Card module inserted via the rear side and connect the Advanced Mezzanine Card module directly to the first portion of the monolithic backplane.

Abstract: A rear transition module (220) includes a connector (230) in an RP0 mechanical envelope (242), and an RTM alignment and keying mechanism (232) in the RP0 mechanical envelope of the rear transition module that uniquely corresponds to a first signal path configuration (363) in a corresponding connector (234) on a backplane (202) of a VXS multi-service platform system chassis (103), where the rear transition module is coupled to operate within the VXS multi-service platform system chassis having a VMEbus network (108) and a switched fabric (110) coincident on the backplane.

Abstract: A computer system includes a cooling module that cools an embedded computer chassis. The cooling module includes a fan and a fan controller that controls the fan speed based on a first signal that represents a desired speed of the fan. A bus master module generates the first signal, generates a second signal that bypasses the fan controller and selectively switches the fan to a full-speed, receives a third signal that indicates an actual speed of the fan, communicates the second signal to switch the fan to full-speed, monitors the third signal to determine if the fan speed changed due to the second signal, and indicates a latent fault if the change in the fan speed is not detected.