Patents Assigned to ENGINEER INC.
  • Publication number: 20230223676
    Abstract: A semiconductor device package includes a substrate and an antenna module. The substrate has a first surface and a second surface opposite to the first surface. The antenna module is disposed on the first surface of the substrate with a gap. The antenna module has a support and an antenna layer. The support has a first surface facing away from the substrate and a second surface facing the substrate. The antenna layer is disposed on the first surface of the support. The antenna layer has a first antenna pattern and a first dielectric layer.
    Type: Application
    Filed: March 7, 2023
    Publication date: July 13, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Lin HO, Chih-Cheng LEE, Chun Chen CHEN, Yuanhao YU
  • Publication number: 20230215790
    Abstract: An electronic package structure is provided. The electronic package structure includes a first carrier, a first electronic component, a first optical channel, and a second electronic component. The first electronic component is disposed on or within the first carrier. The first optical channel is disposed within the first carrier. The first optical channel is configured to provide optical communication between the first electronic component and the second electronic component. The first carrier is configured to electrically connect the first electronic component.
    Type: Application
    Filed: January 5, 2022
    Publication date: July 6, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chiung-Ying KUO, Hung-Chun KUO
  • Publication number: 20230215810
    Abstract: A semiconductor package structure is provided. The semiconductor package structure includes an electronic component, and an inductance component. The protection layer encapsulates the electronic component and has a top surface and a bottom surface. The top surface and the bottom surface collectively define a space to accommodate the electronic component. The inductance component outflanks the space from the top surface and the bottom surface of the protection layer.
    Type: Application
    Filed: December 30, 2021
    Publication date: July 6, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Pao-Nan LEE, Chen-Chao WANG, Chang Chi LEE
  • Publication number: 20230216174
    Abstract: An electronic package and a method of manufacturing an electronic package are provided. The electronic package includes a carrier, an antenna substrate, and an electronic component. The carrier has a first surface and a second surface. The antenna substrate includes a resonant cavity and is disposed over the first surface. The antenna substrate is closer to the first surface than the second surface of the carrier. The electronic component is disposed between the antenna substrate and the second surface of the carrier.
    Type: Application
    Filed: December 30, 2021
    Publication date: July 6, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chung Ju YU, Shao-Lun YANG, Chun-Hung YEH, Hong Jie CHEN, Tsung-Wei LU, Wei Shuen KAO
  • Publication number: 20230213008
    Abstract: An apparatus and method for a heat shield with an integrated air filter assembly is disclosed. Wherein the air filter assembly comprising a filter material circumferentially extending such that the filter material surrounds at least a portion of an interior cavity of the air filter, a distal end cap affixed to a distal end of the filter material, and a wire support extending along at least a portion of an exterior surface of the filter material; and wherein the heat shield is configured to direct cooler air into an air intake conduit extending from an intake portion of an automobile engine for combustion.
    Type: Application
    Filed: March 9, 2023
    Publication date: July 6, 2023
    Applicant: K&N Engineering, Inc.
    Inventors: Steve Williams, Jonathan Richard Fiello
  • Publication number: 20230215775
    Abstract: An electronic package is provided in the present disclosure. The electronic package comprises: an electronic component; a thermal conductive element above the electronic component, wherein thermal conductive element includes a first metal; an adhesive layer between the electronic component and the thermal conductive element, wherein the first adhesive layer includes a second metal; and an intermetallic compound (IMC) between the first metal and the second metal.
    Type: Application
    Filed: January 5, 2022
    Publication date: July 6, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Chang-Lin YEH
  • Publication number: 20230215822
    Abstract: An electronic package is provided. The electronic package includes an amplifier component, a control component, and a first circuit layer. The control component is disposed above the amplifier component. The first circuit layer is disposed between the amplifier component and the control component. The control component is configured to transmit a first signal to the amplifier component and to output a second signal amplified by the amplifier component.
    Type: Application
    Filed: December 30, 2021
    Publication date: July 6, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Meng-Wei HSIEH, Hung-Yi LIN, Hsu-Chiang SHIH, Cheng-Yuan KUNG
  • Publication number: 20230215816
    Abstract: A package structure includes an encapsulant, a patterned circuit structure, at least one electronic component and a shrinkage modifier. The patterned circuit structure is disposed on the encapsulant and includes a pad. The electronic component is disposed on the patterned circuit structure, and includes a bump electrically connected to the pad. The shrinkage modifier is encapsulated in the encapsulant and configured to reduce a relative displacement between the bump and the pad along a horizontal direction in an environment of temperature variation.
    Type: Application
    Filed: December 30, 2021
    Publication date: July 6, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Yuan KUNG, Hsu-Chiang SHIH, Hung-Yi LIN, Chien-Mei HUANG
  • Publication number: 20230213007
    Abstract: An apparatus and methods are provided for an air cleaner to be mounted onto an air inlet of an internal combustion engine. The air cleaner comprises an air filter that includes a filter medium disposed between a curved base and a cover. The curved base provides an interface between the air filter and the air inlet, and comprises a shape that provides clearance between the curved base and an electric choke installed onto a carburetor comprising the air inlet. The cover secures the air filter and the curved base to the air inlet such that an airstream is drawn through the filter medium and is conducted into the air inlet. A raised portion of the cover is configured to cooperate with the curved base to ensure a desired volume of the airstream is available to the air inlet at substantially all engine speeds.
    Type: Application
    Filed: February 27, 2023
    Publication date: July 6, 2023
    Applicant: K&N Engineering, Inc.
    Inventors: Steve E. Williams, Jere James Wall
  • Patent number: 11692348
    Abstract: A system and method for securing a roof truss to a load bearing wall is disclosed. A strap is attached to a roof truss at one end and extended to the top of a load-bearing wall. A buckle is placed over the strap to pinch the strap between the vertical and horizontal arms of the buckle. The end of the strap is wrapped back toward the vertical side of the roof truss and a flat plate is placed to pinch the free end of the strap between the buckle and the flat plate. Screws are placed through holes in the flat plate and corresponding holes in the buckle to attach the system to the top of the load-bearing wall. The system and method of the invention provides both horizontal (lateral) resistance and uplift resistance, thus resisting horizontal (lateral) forces while at the same time providing uplift resistance.
    Type: Grant
    Filed: May 26, 2021
    Date of Patent: July 4, 2023
    Assignee: S.W. Engineering Inc.
    Inventor: Stephen W. Warter
  • Patent number: 11691241
    Abstract: Embodiments of a high-speed rotatable workpiece abrasive polishing head are disclosed that allow flat surfaced hard material workpieces or sapphire or semiconductor wafers to be polished at high abrading speeds that can use water-mist cooled quick-change fixed abrasive island-type discs. Workpieces can be quickly attached with vacuum to a rotatable workpiece plate having a curved (e.g., spherical) bearing with an offset spherical center of rotation located at the workpiece abraded surface. Abrading contact there prevents lateral abrading friction forces from tilting workpieces and causing non-flat workpiece surfaces. The workpiece carrier plate can be rotationally driven by a floating drive shaft having a spherical spline head that contacts the workpiece carrier plate at a position close to the workpiece abraded surface to avoid tilting of the workpiece due to the shaft-applied workpiece rotation forces.
    Type: Grant
    Filed: August 5, 2020
    Date of Patent: July 4, 2023
    Assignee: KELTECH Engineering, Inc.
    Inventors: Wayne O. Duescher, Cameron M. Duescher
  • Publication number: 20230208175
    Abstract: An electronic device package and a method for manufacturing the electronic device are provided. The electronic device includes a charging element, a housing covering the charging element and a sensing element electrically connected to the housing. The sensing element is configured to detect an external device and to drive the charging element.
    Type: Application
    Filed: December 23, 2021
    Publication date: June 29, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wei-Hao Chang
  • Publication number: 20230208394
    Abstract: The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.
    Type: Application
    Filed: February 21, 2023
    Publication date: June 29, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chi Sheng TSENG, Lu-Ming LAI, Ching-Han HUANG, Kuo-Hua LAI, Hui-Chung LIU
  • Publication number: 20230208267
    Abstract: A two-phase bipolar step motor, comprises a rotor having a plurality of pairs of rotor poles of alternating magnetic polarity, and a stator having four primary energizable stator poles with conductive windings around those primary stator poles and four passive inter-poles located uniformly between every adjacent pair of primary stator poles, the passive inter-poles lacking any conductive windings. Both 18° steppers with five pairs of rotor poles and 30° steppers with three pairs of rotor poles are provided. Also provided are both PM hybrid mix steppers with 2D magnetic flux paths and hybrid steppers with 3D magnetic flux paths having an axial component. In each case, the overall lengths of the flux paths are substantially reduced from conventional designs resulting in improved motor efficiency.
    Type: Application
    Filed: February 21, 2023
    Publication date: June 29, 2023
    Applicant: Lin Engineering, Inc.
    Inventor: Ted T. Lin
  • Publication number: 20230207729
    Abstract: A semiconductor device package includes a carrier, an emitting element and a first package body. The carrier includes a first surface and a second surface opposite to the first surface. The emitting element is disposed on the first surface of the carrier. The first package body is disposed over the first surface of the carrier and spaced apart from the first surface of the carrier.
    Type: Application
    Filed: February 28, 2023
    Publication date: June 29, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Tang-Yuan CHEN, Meng-Wei HSIEH, Cheng-Yuan KUNG
  • Publication number: 20230207521
    Abstract: At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a first substrate with a first surface and a second surface opposite to the first surface, a second substrate adjacent to the first surface of the first substrate, and an encapsulant encapsulating the first substrate and the second substrate. The first substrate defines a space. The second substrate covers the space. The second surface of the first substrate is exposed by the encapsulant. A surface of the encapsulant is coplanar with the second surface of the first substrate or protrudes beyond the second surface of the first substrate.
    Type: Application
    Filed: February 21, 2023
    Publication date: June 29, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yung-Hsing CHANG, Wen-Hsin LIN
  • Publication number: 20230207524
    Abstract: A semiconductor package and a method for manufacturing a semiconductor package are provided. The semiconductor package includes a first processing element, a first I/O element, a second processing element, and a second I/O element. The first processing element is on a substrate. The first I/O element is on the substrate and electrically connected to the first processing element. The second processing element is on the substrate. The second I/O element is on the substrate and electrically connected to the second processing element. The first I/O element is electrically connected to and physically separated from the second I/O element.
    Type: Application
    Filed: February 28, 2023
    Publication date: June 29, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chang Chi LEE, Jung Jui KANG, Chiu-Wen LEE, Li Chieh CHEN
  • Patent number: 11688978
    Abstract: A connector to easily and correctly join an electrical component to a printed circuit board is provided. The connector comprises a generally C-shaped electrically conductive element that provides for connection alternatively to the positive and negative terminals of a device depending on the orientation of the connector. As a result of the shapes of the ends of the connector, a device can only be plugged in one way. The connector can be made from a single sheet of electrically conductive material bent generally into a “C” shape, with specific tabs and cuts made therein. The connector includes a tab that allows for quick and automated connection to a printed circuit board, and an element to prevent connectors from interlocking while in a loose and unconnected state as, during manufacturing, plating, or storage, allowing them to be added to a board using automated procedures for quick, accurate and low cost construction.
    Type: Grant
    Filed: December 4, 2019
    Date of Patent: June 27, 2023
    Assignee: Omega Engineering, Inc.
    Inventors: Kenneth J. Leibig, Matthew Annen
  • Patent number: 11685207
    Abstract: An apparatus that includes an elastic sleeve; an integrally formed top cover that completely (or at least substantially completely) covers one end of the elastic sleeve; an integrally formed elongated clamp feature that extends outward from across a top surface of the top cover, wherein the elongated clamp feature has a C-shaped cross section; an integrally formed elongated strap that is connected at a proximal end to an edge of top cover and that has an elastic loop formed at a distal end of the elongated strap.
    Type: Grant
    Filed: January 13, 2022
    Date of Patent: June 27, 2023
    Assignee: WirthCo Engineering, Inc.
    Inventors: Andrew W. Wirth, Kelly T. Eagan
  • Publication number: 20230199378
    Abstract: An electronic module is provided. The electronic module includes a first transducer and a second transducer. The first transducer is configured to radiate a first ultrasonic wave. The second transducer is configured to radiate a second ultrasonic wave. The first transducer and the second transducer are disposed on noncoplanar surfaces.
    Type: Application
    Filed: February 14, 2023
    Publication date: June 22, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chih Lung LIN, Kuei-Hao TSENG, Kai Hung WANG