Patents Assigned to ENGINEER INC.
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Publication number: 20230120036Abstract: An optoelectronic package structure is provided. The optoelectronic package includes a carrier, an electronic component, a photonic component and a first power supply path in the carrier. The carrier includes a first region and the electronic component is disposed over the first region of the carrier. A first power supply path is electrically connects the electronic component.Type: ApplicationFiled: October 20, 2021Publication date: April 20, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jr-Wei LIN, Mei-Ju LU
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Publication number: 20230121954Abstract: An optoelectronic package structure is provided. The optoelectronic package structure includes a heat source, a thermal conductive element, and a first optoelectronic component and a second optoelectronic component. The thermal conductive element is disposed over the heat source. The thermal conductive element defines a thermal conduction path P2 by which heat is transferred from the heat source to the thermal conductive element. The first optoelectronic component and the second optoelectronic component are arranged along an axis different from a thermal conduction path P2.Type: ApplicationFiled: October 15, 2021Publication date: April 20, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jr-Wei LIN, Mei-Ju LU
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Publication number: 20230124933Abstract: An electronic package structure includes an electronic structure, a wiring structure, an electrical contact and a support layer. The wiring structure is located over the electronic structure. The electrical contact connects the wiring structure and the electronic structure. The support layer is disposed around the electrical contact and has a surface facing the electrical contact. The surface includes at least one inflection point in a cross-sectional view.Type: ApplicationFiled: October 14, 2021Publication date: April 20, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Wei-Jen WANG, Po-Jen CHENG, Fu-Yuan CHEN
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Patent number: 11630008Abstract: A system and method for detecting dynamic strain of a housing. The system includes an optical fiber linearly affixed along a surface of a length of the housing and an interrogator comprising a laser source and a photodetector. The optical fiber comprises at least one pair of fiber Bragg gratings (FBGs) tuned to reflect substantially identical wavelengths with a segment of the optical fiber extending between the FBGs. The segment of the optical fiber is linearly affixed along the surface of the housing. The interrogator is configured to perform interferometry by shining laser light along the optical fiber and detecting light reflected by the FBGs. The interrogator outputs dynamic strain measurements based on interferometry performed on the reflected light.Type: GrantFiled: April 28, 2021Date of Patent: April 18, 2023Assignee: Hifi Engineering Inc.Inventors: John Hull, Seyed Ehsan Jalilian
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Publication number: 20230115954Abstract: An electronic device package and manufacturing method thereof are provided. The electronic device package includes an electronic component including an active surface, a patterned conductive layer disposed on the active surface, an encapsulation layer disposed over the patterned conductive layer, and a buffer layer disposed between the patterned conductive layer and the encapsulation layer. The buffer layer is shaped and sized to alleviate a stress generated due to an interaction between the patterned conductive layer and the encapsulation layer.Type: ApplicationFiled: October 13, 2021Publication date: April 13, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: En Hao HSU, Kuo Hwa TZENG, Chia-Pin CHEN, Chi Long TSAI
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Publication number: 20230113147Abstract: A floating substructure made of a steel structure with ballast tanks provides buoyancy and stability to support a wind turbine generator in deep waters. Mooring lines directly attach to the substructure to provide stability. These mooring lines can also be directly anchored to the bed of a body of water, such as a seabed, to control movements. Different types of anchors can be used depending on the soil characteristic of the bed of the body of water.Type: ApplicationFiled: October 12, 2022Publication date: April 13, 2023Applicant: Keystone Engineering Inc.Inventors: Sara GHAZIZADEH, Rudolph A. HALL, Frank J. FALGOUT, JR., Rick Riccardo DAMIANI
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Publication number: 20230114278Abstract: A semiconductor device package and a method for manufacturing the semiconductor device package are provided. The semiconductor device package includes a first substrate, a second substrate and an interconnection. The second substrate is arranged above the first substrate and has an opening. The interconnection passes through the opening and connects to the first substrate and the second substrate.Type: ApplicationFiled: December 13, 2022Publication date: April 13, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Chao Wei LIU
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Publication number: 20230110960Abstract: A combined mass airflow sensor and hydrocarbon trap is provided for absorbing evaporative hydrocarbon emissions from an air intake duct of an internal combustion engine. The combined mass airflow sensor and hydrocarbon trap comprises a duct that supports a hydrocarbon absorbing sheet in an unfolded configuration within a housing. The duct communicates an airstream from an air filter to the air intake duct during operation of the internal combustion engine. An opening in the housing receives a mass airflow sensor into the duct, such that the mass airflow sensor is disposed within the airstream. Guide vanes extending across the duct reduce air turbulence within the airstream passing by the mass airflow sensor. Ports disposed along the duct allow the evaporative hydrocarbon emissions to be drawn into the interior and arrested by the hydrocarbon absorbing sheet when the internal combustion engine is not operating.Type: ApplicationFiled: September 30, 2022Publication date: April 13, 2023Applicant: K&N Engineering, Inc.Inventors: Kevin McClelland, Steve Williams
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Publication number: 20230113090Abstract: A vehicle leveler includes a first portion which has a leading edge and a trailing edge; the trailing edge is disposed further from the driveway than the leading edge. The vehicle leveler also includes a second portion which has a leading edge and a trailing edge; the leading edge of the second portion is attached to the trailing edge of the first portion and the leading edge of the second portion is disposed further from the driveway than the trailing edge of the second portion. The second portion also includes an extension portion. The vehicle leveler also includes opposing side portions which extend the length of and contact the second portion and extension portion, the opposing side portions have a top surface which forms a walkway. A freestanding unitary vehicle wheel guide with a walkway is adjacent to the opposing side portions.Type: ApplicationFiled: December 13, 2022Publication date: April 13, 2023Applicant: Leum Engineering, Inc. d/b/a Dockzilla Co.Inventors: Grant Leum, Eric Demerath
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Publication number: 20230115676Abstract: An automated wellhead monitoring and control system. The system is communicatively coupled to one or more LFG wellheads as well as other desired landfill components. The system receives and aggregates both real-time and historical data related to the operation of landfill components at a single site and/or integrates numerous sites for comparison. The system controls the LFG wellheads and other desired landfill components based on the real-time, forecasted, and historical data, and utilizes various algorithms, including machine learning and artificial intelligence, to effectuate such control.Type: ApplicationFiled: October 7, 2022Publication date: April 13, 2023Applicant: Stearns, Conrad and Schmidt, Consulting Engineers, Inc.Inventors: David HOSTETTER, Philip CARRILLO, Melissa RUSSO, Christopher CARVER
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Patent number: 11624648Abstract: Systems and methods for scale calibration. One example embodiment provides a system for calibrating a scale. The system may generally include an actuator for applying force to a platform of the medical scale, and an electronic processor communicatively coupled to the actuator. The electronic processor may be configured to control an actuator to apply, for a first interval, a first applied force having a first value greater than a target force value, and control the actuator to apply, for a second interval, a second applied force having a second value substantially equal to the target force value.Type: GrantFiled: July 9, 2020Date of Patent: April 11, 2023Assignees: Pelstar, LLC, Tovey Engineering, Inc.Inventors: Michael Ohler, Ken Harris, Brian C. Skinner, Mike Tovey
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Patent number: 11626716Abstract: Disclosed are embodiments of a round floor grommet and a rectangular floor grommet. These floor grommets can be constructed in any desired shape other than round or rectangular. Frame portions that hold foam pieces are joined together to form a primary slit in the floor grommet. Cross slits can also be formed in the foam material. The foam is a semi-closed cell foam that is constructed from PVC and nitrile butadiene rubber which has superior sealing effects since the foam can conform around objects passing through the slits in the floor grommet and seal any flow of air through the slits.Type: GrantFiled: December 11, 2020Date of Patent: April 11, 2023Assignee: Raymond & Lae Engineering, Inc.Inventors: Donald M. Raymond, Jeremy D. Swanner, Timothy L. Hirschenhofer, James M. Schneider
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Publication number: 20230106612Abstract: A method for manufacturing an electrical package is provided. The method include: providing a substrate having a first surface and a second surface opposite to the first surface, wherein the second surface has a first level difference; forming an adhesive layer on the second surface of the substrate, wherein the adhesive layer is configured to cover the second surface and provides a third surface spaced apart from the second surface of the substrate, wherein the third surface has a second level difference; disposing a tape on the third surface of the adhesive layer; and performing a removing operation on the first surface of the substrate; wherein the second level difference is smaller than the first level difference.Type: ApplicationFiled: October 5, 2021Publication date: April 6, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Wen-Pin HUANG, Fu Tang CHU, Pei I CHANG, Chia Hao CHEN, Tsuan Ching KUO
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Publication number: 20230104397Abstract: A selective EMI shielding structure for a semiconductor package and a method of fabrication thereof is disclosed. The semiconductor package, comprising: a substrate having a first face; at least one first electronic component mounted adjacent to a first region of the first face; a least one second electronic component mounted adjacent to a second region of the first face; and an encapsulant disposed over the first and the second electronic components, wherein the encapsulant covers directly over the first electronic component, and wherein the encapsulant covers the second electronic component through a layer of conductive material.Type: ApplicationFiled: October 1, 2021Publication date: April 6, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Meng-Jen WANG, Chien-Yuan TSENG, Hung Chen KUO, Ying-Hao WEI, Chia-Feng HSU, Yuan-Long CHIAO
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Publication number: 20230103713Abstract: An optoelectronic package and a method of manufacturing an optoelectronic package are provided. The optoelectronic package includes a carrier. The carrier includes a first region and a second region. The first region is configured to supply power to a processing unit disposed on the carrier. The second region is for accommodating at least one optoelectronic device electrically coupled to the processing unit.Type: ApplicationFiled: October 1, 2021Publication date: April 6, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jr-Wei LIN, Mei-Ju LU
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Publication number: 20230105803Abstract: An optoelectronic package is provided. The optoelectronic package includes a photonic component. The photonic component has a bottom surface and a lateral surface. The lateral surface of the photonic component includes a light coupling region and a non-light coupling plane. The non-light coupling plane contacts the bottom surface. The light coupling region and the non-light coupling plane are not aligned.Type: ApplicationFiled: October 1, 2021Publication date: April 6, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Mei-Ju LU, Jr-Wei LIN, Chang-Feng YOU
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Publication number: 20230104471Abstract: There is described a method for interrogating optical fiber comprising fiber Bragg gratings (“FBGs”), using an optical fiber interrogator. The method comprises (a) generating an initial light pulse from phase coherent light emitted from a light source, wherein the initial light pulse is generated by modulating the intensity of the light; (b) splitting the initial light pulse into a pair of light pulses; (c) causing one of the light pulses to be delayed relative to the other of the light pulses; (d) transmitting the light pulses along the optical fiber; (e) receiving reflections of the light pulses off the FBGs; and (f) determining whether an optical path length between the FBGs has changed from an interference pattern resulting from the reflections of the light pulses.Type: ApplicationFiled: December 1, 2022Publication date: April 6, 2023Applicant: Hifi Engineering Inc.Inventors: Brian H. Moore, Walter Jeffrey Shakespeare, Phillip William Wallace, Viet Hoang, Chris Henrikson, Ajay Sandhu, Adrian Dumitru, Thomas Clement, Dongliang Huang, Seyed Ehsan Jalilian
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Patent number: 11621623Abstract: A two-phase bipolar step motor, comprises a rotor having a plurality of pairs of rotor poles of alternating magnetic polarity, and a stator having four primary energizable stator poles with conductive windings around those primary stator poles and four passive inter-poles located uniformly between every adjacent pair of primary stator poles, the passive inter-poles lacking any conductive windings. Both 18° steppers with five pairs of rotor poles and 30° steppers with three pairs of rotor poles are provided. Also provided are both PM hybrid mix steppers with 2D magnetic flux paths and hybrid steppers with 3D magnetic flux paths having an axial component. In each case, the overall lengths of the flux paths are substantially reduced from conventional designs resulting in improved motor efficiency.Type: GrantFiled: May 25, 2021Date of Patent: April 4, 2023Assignee: Lin Engineering, Inc.Inventor: Ted T. Lin
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Publication number: 20230096703Abstract: An electronic package structure and a method of manufacturing an electronic package structure are provided. The electronic package structure includes a substrate, a conductive element, and a support structure. The substrate has a bottom surface and a lateral surface angled with the bottom surface. The conductive element is on the lateral surface of the substrate. The support structure is on the bottom surface of the substrate and configured to space the bottom surface from an external carrier. A lateral surface of the support structure is spaced apart from the lateral surface of the substrate by a first distance.Type: ApplicationFiled: September 30, 2021Publication date: March 30, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Yu-Ying LEE
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Publication number: 20230097299Abstract: An electronic package includes a carrier, a protection layer and an electronic component. The carrier includes a dielectric layer and a pad in contact with the dielectric layer. The protection layer at least partially covers the pad. The electronic component is located over the protection layer and electrically connected to the pad. At least one portion of the protection layer under the electronic component is substantially conformal with a profile of the pad or with a profile of the dielectric layer.Type: ApplicationFiled: September 16, 2021Publication date: March 30, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: You-Lung YEN, Bernd Karl APPELT