Patents Assigned to ENGINEER INC.
  • PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20230075336
    Abstract: A semiconductor package structure includes a plurality of transducer devices, a cap structure, at least one redistribution layer (RDL) and a protection material. The transducer devices are disposed side by side. Each of the transducer devices has at least one transducing region, and includes a die body and at least one transducing element. The die body has a first surface and a second surface opposite to the first surface. The transducing region is disposed adjacent to the first surface of the die body. The transducing element is disposed adjacent to the first surface of the die body and within the transducing region. The cap structure covers the transducing region of the transducer device to form an enclosed space. The redistribution layer (RDL) electrically connects the transducer devices. The protection material covers the transducer devices.
    Type: Application
    Filed: November 15, 2022
    Publication date: March 9, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chien-Hua CHEN, Cheng-Yuan KUNG
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20230075021
    Abstract: A semiconductor device package and a method for manufacturing the semiconductor device package are provided. The electronic device includes a first carrier having a first surface, an interposer disposed over the first surface of the first carrier, wherein the interposer has a first thickness and a second thickness in a direction substantially perpendicular to the first surface of the first carrier; and a plurality of electrical connections between the first carrier and the interposer and configured to compensate a difference between the first thickness and the second thickness of the interposer.
    Type: Application
    Filed: September 3, 2021
    Publication date: March 9, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Ching-Feng CHENG
  • OPTICAL ADAPTIVE DEVICE AND WEARABLE DEVICE
    Publication number: 20230074105
    Abstract: The present disclosure provides an optical adaptive device and a wearable device. The optical adaptive device includes a carrier, a first light adjusting element, and a second light adjusting element. The first light adjusting element is in or on the carrier and configured to focus a first light from a first article on a visual area. The second light adjusting element is in or on the carrier and configured to focus a second light from a second article on the visual area. The second article is further away from the area than the first article.
    Type: Application
    Filed: September 3, 2021
    Publication date: March 9, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ko-Fan TSAI, Tien-Chia LIU, Kuo Sin HUANG, Cheng-Te CHOU
  • Throttle body spacer
    Patent number: 11598296
    Abstract: An apparatus and methods are provided for a throttle body spacer that improves the performance of an internal combustion engine. The throttle body spacer comprises a body that includes an airflow opening for conducting airflow from a throttle body into an intake manifold. A spiral is disposed along a sidewall of the airflow opening and configured for swirling the airflow. The spiral comprises a helical shape disposed around a circumference of the sidewall and extends from an initial bore near a first contact surface of the body to a second contact surface. The helical shape includes a diameter that increases as the spiral extends toward the second contact surface, giving the body a sidewall taper angle that contributes to an increase in power output of the engine. A sawtooth cross-sectional shape of the spiral causes the airflow to swirl so as to improve atomization of an air-fuel mixture entering engine.
    Type: Grant
    Filed: April 27, 2021
    Date of Patent: March 7, 2023
    Assignee: K&N Engineering, Inc.
    Inventor: Jonathan Richard Fiello
  • Blow through direct fired heating, A/C and ERV
    Patent number: 11598556
    Abstract: According to various aspects, exemplary embodiments are disclosed of blow through direct fired heaters including evaporator coils and/or energy recovery ventilation.
    Type: Grant
    Filed: October 13, 2020
    Date of Patent: March 7, 2023
    Assignee: Cambridge Engineering, Inc.
    Inventors: Michael Rodney Mueller, Carl Merrill Schoenberg, John Patrick Foley, Jr., Thomas Joseph Cleary, Marc David Braun
  • ELECTRONIC MODULE AND OPTICAL DEVICE
    Publication number: 20230062337
    Abstract: The present disclosure provides an electronic module includes a light source configured to radiate a first light beam having a first wavelength and a converting device configured to receive the first light beam and to convert the first light beam to a second light beam having a second wavelength different from the first wavelength. The electronic module also includes a connection element configured to transmit the first light beam from the light source to the converting device and adapted to a predetermined geometric relationship between the light source and the converting device to meet a condition of total internal reflection.
    Type: Application
    Filed: September 2, 2021
    Publication date: March 2, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shih-Chieh TANG, Ying-Chung CHEN
  • ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20230060538
    Abstract: An electronic device and a method for manufacturing the same are provided. The electronic device includes a carrier, an antenna element and a cladding element. The carrier defines a first area and a second area adjacent to the first area. The antenna element is in the first area. The cladding element covers the antenna element and is configured for enhancing antenna gain of the antenna element. The second area is exposed from the cladding element and is distant from the antenna element.
    Type: Application
    Filed: August 27, 2021
    Publication date: March 2, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jenchun CHEN, Ya-Wen LIAO
  • ELECTRONIC PACKAGE
    Publication number: 20230061843
    Abstract: An electronic package is provided. The electronic package includes a first circuit structure, a second circuit structure, and an underfill. The second circuit structure is disposed over the first circuit structure. The underfill is disposed between the first circuit structure and the second circuit structure. An inner portion of the underfill has an inner lateral surface adjacent to and is substantially conformal with a lateral surface of the second circuit structure. A first top end of the inner lateral surface is not level with a top surface of the second circuit structure. An outer portion of the underfill has a second top end higher than the first top end.
    Type: Application
    Filed: August 27, 2021
    Publication date: March 2, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yu-Lin SHIH, Chih-Cheng LEE
  • OPTICAL MODULE
    Publication number: 20230063405
    Abstract: The present disclosure provides an optical module. The optical module includes an optical component disposed in or on a carrier and configured to receive a first light. The optical component is further configured to transmit a second light to a first portion of the carrier and transmit a third light to a second portion of the carrier.
    Type: Application
    Filed: September 2, 2021
    Publication date: March 2, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shih-Chieh TANG, Lu-Ming LAI, Yu-Che HUANG, Ying-Chung CHEN
  • ELECTRONIC DEVICE
    Publication number: 20230065615
    Abstract: An electronic device includes a first electronic component, an encapsulant and a second electronic component. The encapsulant encapsulates the first electronic component. The second electronic component is disposed over the first electronic component and separated from the encapsulant. The second electronic component is configured to receive a power from the first electronic component.
    Type: Application
    Filed: August 27, 2021
    Publication date: March 2, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Yuan KUNG, Hung-Yi LIN
  • ELECTRONIC PACKAGE STRUCTURE, ELECTRONIC SUBSTRATE AND METHOD OF MANUFACTURING ELECTRONIC PACKAGE STRUCTURE
    Publication number: 20230061684
    Abstract: An electronic package structure, an electronic substrate, and a method of manufacturing an electronic package structure are provided. The electronic package structure includes a substrate. The substrate includes a bonding region and an alignment structure. The bonding region is located at a side of the substrate and configured to bond with an electronic component. The alignment structure is located at the side of the substrate and out of the bonding region and configured to providing a fiducial mark for position-aligning, wherein the alignment structure comprises a first region and a second region visually distinct from the first region.
    Type: Application
    Filed: August 27, 2021
    Publication date: March 2, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shun-Tsat TU, Pei-Jen LO
  • ELECTRONIC DEVICE
    Publication number: 20230055717
    Abstract: The present disclosure relates to an electronic device that includes a first radiating element configured to radiate a first electromagnetic wave and a second radiating element configured to radiate a second electromagnetic wave. A first radiation pattern of the first electromagnetic wave is configured to be adjusted, and a second radiation pattern of the second electromagnetic wave is configured to be fixed.
    Type: Application
    Filed: August 19, 2021
    Publication date: February 23, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Shih-Wen LU
  • ELECTRONIC MODULE
    Publication number: 20230057327
    Abstract: The present disclosure provides an electronic module including a circuit including a transmitting part and a receiving part physically separated from the transmitting part. The electronic module also includes an element isolated from the circuit and configured to block electrical interference between the transmitting part and the receiving part.
    Type: Application
    Filed: August 19, 2021
    Publication date: February 23, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shih-Wen LU, Chun-Jen CHEN, Po-Hsiang TSENG, Hsin-Han LIN, Ming-Lun YU
  • ELECTRONIC PACKAGE, SEMICONDUCTOR PACKAGE STRUCTURE, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR PACKAGE STRUCTURE
    Publication number: 20230058358
    Abstract: An electronic package, a semiconductor package structure and a method for manufacturing the same are provided. The electronic package includes a carrier, a first electronic component, an electrical extension structure, and an encapsulant. The carrier has a first face and a second face opposite to the first face. The first electronic component is adjacent to the first face of the carrier. The electrical extension structure is adjacent to the first face of the carrier and defines a space with the carrier for accommodating the first electronic component, the electrical extension structure is configured to connect the carrier with an external electronic component. The encapsulant encapsulates the first electronic component and at least a portion of the electrical extension structure.
    Type: Application
    Filed: August 20, 2021
    Publication date: February 23, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: You-Lung YEN, Bernd Karl APPELT
  • OPTOELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20230054600
    Abstract: An optoelectronic device includes a photonic component. The photonic component includes an active side, a second side different from the active side, and an optical channel extending from the active side to the second side of the photonic component. The optical channel includes a non-gaseous material configured to transmit light.
    Type: Application
    Filed: August 19, 2021
    Publication date: February 23, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jr-Wei LIN, Sin-Yuan MU, Chia-Sheng CHENG
  • ELECTRONIC CARRIER AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20230046889
    Abstract: An electronic carrier and a method of manufacturing an electronic carrier are provided. The electronic carrier includes a first interconnection structure and a second interconnection structure. The first interconnection structure includes a first patterned conductive layer having a first pattern density. The second interconnection structure is laminated to the first interconnection structure and includes a second patterned conductive layer having a second pattern density higher than the first pattern density. The first interconnection structure is electrically coupled to the second interconnection structure through a first non-soldering joint between and outside of the first interconnection structure and the second interconnection structure.
    Type: Application
    Filed: August 13, 2021
    Publication date: February 16, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: You-Lung YEN, Bernd Karl Appelt
  • OPTICAL DEVICE
    Publication number: 20230048279
    Abstract: An optical element is provided. The optical device includes a carrier, a first receiver, and a second receiver. The first receiver is disposed on the carrier and configured to receive a first light. The second receiver is disposed on the carrier and configured to receive a second light. The first light and the second light have different frequency bands.
    Type: Application
    Filed: August 12, 2021
    Publication date: February 16, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Yu-Wei CHEN
  • Large riser extended reach sluicer and tool changer
    Patent number: 11577287
    Abstract: Extended reach sluicer systems, devices, and methods for breaking up and retrieving chemical, radioactive, hazardous materials and/or other waste and/or other material from storage tanks with mechanical arms and nozzles to break up and transfer tank material. And this invention can work with tanks having high temperature or low temperature conditions.
    Type: Grant
    Filed: April 15, 2019
    Date of Patent: February 14, 2023
    Assignee: AGI Engineering, Inc.
    Inventors: Alex G. Innes, Shon S. Simon
  • Handheld backscatter imaging systems with primary and secondary detector arrays
    Patent number: 11579327
    Abstract: The present specification provides a detector for an X-ray imaging system. The detector includes at least one high resolution layer having high resolution wavelength-shifting optical fibers, each fiber occupying a distinct region of the detector, at least one low resolution layer with low resolution regions, and a single segmented multi-channel photo-multiplier tube for coupling signals obtained from the high resolution fibers and the low resolution regions.
    Type: Grant
    Filed: December 16, 2020
    Date of Patent: February 14, 2023
    Assignee: American Science and Engineering, Inc.
    Inventors: Aaron J. Couture, Jeffrey M. Denker
  • Air intake system
    Patent number: D980868
    Type: Grant
    Filed: September 3, 2020
    Date of Patent: March 14, 2023
    Assignee: Advanced FLOW Engineering Inc.
    Inventors: Shahriar Nick Niakan, Christian Luc Landel