Abstract: The present disclosure provides an electronic device. The electronic device includes a display module having a grounding element disposed under the display module and an antenna pattern. The grounding element is configured to function as a reference ground of the antenna pattern. A wearable device is also provided.

Abstract: The present disclosure provides an electronic assembly including a semiconductor device package. The semiconductor device package includes a first package and a conductive element. The first package includes an electronic component and a protection layer covering the electronic component. The conductive element is supported by the protection layer and electrically connected with the electronic component through an electrical contact. A method for manufacturing a semiconductor device package is also provided in the present disclosure.

Abstract: The present disclosure provides a semiconductor device package including a first substrate, a second substrate disposed over the first substrate, an electronic component disposed between the first substrate and the second substrate, a spacer disposed between the first substrate and the electronic component, and a supporting element disposed on the first substrate and configured to support the second substrate. The spacer is configured to control a distance between the first substrate and the second substrate through the electronic component. A method of manufacturing a semiconductor device package is also disclosed.

Abstract: An electronic module is provided. The electronic module includes a first transducer and a second transducer. The first transducer is configured to radiate a first ultrasonic wave. The second transducer is configured to radiate a second ultrasonic wave. A location of the first transducer is configured to be adjustable with respect to the second transducer.

Abstract: The present disclosure provides an electronic device and method of manufacturing the same. The electronic device includes a first region, a second region, an electronic component, and a first sensing element. The second region is adjacent to the first region. The first region has a first pliability. The second region has a second pliability. The second pliability is greater than the first pliability. The electronic component is disposed at the first region. The first sensing element is disposed at the second region and electrically connected to the electronic component.

Abstract: An apparatus and method are provided for a flangeless air filter configured to be mounted onto a flat surface within an air intake system of an internal combustion engine. The flangeless air filter is comprised of a cone-shaped filter medium, retained between a base and a cap, that is fabricated to remove contaminants and particulate matter from an intake airstream. The base includes a pliable seal that forms an airtight connection between the flangeless air filter and the flat surface of the air intake system. A mounting bracket and fasteners may be used to attach the base to the flat surface, compressing the seal there between. In some embodiments, the mounting bracket may be incorporated into, and made a part of the base. A cap is disposed on a top of the flangeless air filter and configured to direct the intake airstream around the cap and toward the filter medium.

Abstract: A semiconductor device package and a method for manufacturing the semiconductor device package are provided. The semiconductor device package includes a first substrate with a aperture, a second substrate disposed on the first substrate, a first electronic component disposed on the second substrate, an encapsulant disposed on the first substrate and covering the second substrate and a first heat dissipation structure extending through the aperture and attached to the second substrate.

Abstract: A conductive structure, a package structure and a method for manufacturing the same are provided. The conductive structure includes a main portion, a first electrical contact, a second electrical contact, a first post and a second post. The main portion has a first surface and a second surface opposite to the first surface. The first electrical contact is disposed adjacent to the first surface of the main portion. The second electrical contact is disposed adjacent to the second surface of the main portion and electrically connected to the first electrical contact. The first post is electrically connected to the first electrical contact. The second post is electrically connected to the second electrical contact.

Abstract: A reusable air filter and methods are provided for filtering air being conducted to an air intake of an internal combustion engine. The reusable air filter comprises a filter medium configured to pass an airstream and entrap particulates flowing within the airstream. The filter medium is comprised of cotton gauze disposed in a sinusoidal arrangement that provides a filtration surface area that is larger than a perimeter area of the filter medium. An end cap and base may be configured to retain the filter medium therebetween. The base provides an interface between the air filter and an air inlet of the engine. The filter medium may be disposed in a flat, panel shape that is bordered by a supportive tray. Support rods may be embedded within the tray to prevent bowing of the tray due to air pressure when coupled with an air box of the engine.

Abstract: A method for manufacturing a semiconductor package structure is provided. The method includes: (a) providing a semiconductor structure including a first device and a second device; (b) irradiating the first device by a first energy-beam with a first irradiation area; and (c) irradiating the first device and the second device by a second energy-beam with a second irradiation area greater than the first irradiation area of the first energy-beam.

Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a substrate and a first passive device. The substrate has a first surface and a second surface opposite to the first surface. The first passive device includes a first terminal and a second terminal, wherein the first terminal is closer to the first surface than to the second surface, and the second terminal is closer to the second surface than to the first surface.

Abstract: A bonding device for bonding an electronic element includes an engaging component. The engaging component has a first surface and a second surface opposite to the first surface. The engaging component includes a plurality of recesses at the second surface. The plurality of recesses are configured to cover a plurality of projections of an electronic element. The engaging component is coupled to a heating component.

Abstract: The present disclosure provides an antenna module including a substrate, a first antenna disposed on the substrate and a second antenna disposed on the substrate and spaced apart from the first antenna. The first antenna is configured to have a first operating frequency and the second antenna is configured to have a second operating frequency different from the first operating frequency. The antenna module further includes an element configured to focus an electromagnetic wave transmitted or received by the first antenna and the second antenna. A semiconductor device package is also disclosed.

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface and a second surface opposite to the first surface, an optical device disposed on the first surface of the substrate, and an electronic device disposed on the second surface of the substrate. A power of the electronic device is greater than a power of the optical device. A vertical projection of the optical device on the first surface is spaced apart from a vertical projection of the electronic device on the second surface by a distance greater than zero.

Abstract: A method and system for improving energy efficiency of a refrigeration system include system components such as a condenser, one or more expansion valves, an evaporator, one or more compressors, and a system controller electrically coupled to the one or more of the system components, according to one embodiment. The system controller is configured to selectively actuate, directly or indirectly, the one or more expansion valves, the condenser, and/or the one or more compressors, at least partially based on temperatures and/or pressures of the system fluid at various points of the system, to control a temperature of a refrigerated area.

Abstract: The present disclosure provides a wearable device. The wearable device includes a first sensing element configured to be disposed adjacent to a right ear of a user while the wearable device is worn by the user and a second sensing element configured to be disposed adjacent to a left ear of the user and coupled to the first sensing element while the wearable device is worn by the user. The second sensing element and the first sensing element are configured to sense a biological signal from the user. The wearable device also includes a reference electrode configured to reduce an interference to the biological signal. A headset device and a method for operating a wearable device is also provided in the present disclosure.

Abstract: The present disclosure provides a wearable device. The wearable device includes a first element and a second element. The first element is configured to sense a bio-signal from a user. The second element is configured to transmit the bio-signal to a processor. The second element has a first surface and a second surface non-coplanar with the first surface. The first element is in contact with the first surface and the second surface of the second element.

Abstract: An apparatus and methods are provided for an air filter for removing contaminants from air within interior building spaces. The air filter comprises a V-bank filter element for removing contaminants from an airstream flowing through a HVAC system. The V-bank filter element includes filter panels that are angled with respect to one another to form adjacent V-configurations such that front edges of adjacent filter panels are placed in contact and rear edges of adjacent filter panels similarly placed in contact. A top member and a bottom member receive top and bottom edges of the filter panels for supporting the V-configurations. A frame couples with the top member and the bottom member and orients the V-bank filter element within the HVAC system such that the airstream is directed through the V-bank filter element. Openings are disposed in the frame for allowing the airstream to enter the V-bank filter element.

Abstract: A semiconductor device package and method for manufacturing the same are provided. The semiconductor device package includes a dielectric layer, an electronic component, a first conductive layer, and a conductive element. The dielectric layer has a first surface and a second surface opposite to the first surface. The electronic component is embedded in the dielectric layer. The first conductive layer is embedded in the dielectric layer and adjacent to the first surface of the dielectric layer. The conductive element is disposed on the first surface of the dielectric layer and in contact with the first conductive layer.