Patents Assigned to ENGINEER INC.
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Publication number: 20220285313Abstract: A method for manufacturing a semiconductor package includes: (a) providing a substrate structure, wherein the substrate structure includes a chip attach area, a bottom area opposite to the chip attach area, a lower side rail surrounding the bottom area, a first lower structure and a second lower structure, wherein the first lower structure is disposed in a first lower region of the lower side rail, and a second lower occupancy ratio is greater than a first lower occupancy ratio; (b) attaching at least one semiconductor chip to the chip attach area; and (c) forming an encapsulant to cover the at least one semiconductor chip.Type: ApplicationFiled: May 24, 2022Publication date: September 8, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Shun Sing LIAO
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Publication number: 20220274043Abstract: An air filter including an open end, a closed end, and a filter area there between. The open end frictionally engages and seals an air port, while the closed end mates with the housing to secure the filter to the housing. The filter area is reinforced to provide a durable, reusable filter. The filter material is selected to provide depth loading and increase the particulate capacity of the filter.Type: ApplicationFiled: May 16, 2022Publication date: September 1, 2022Applicant: K&N Engineering, Inc.Inventors: Steve Williams, Jere James Wall
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Publication number: 20220278052Abstract: The present disclosure provides a substrate structure. The substrate structure includes an interconnection structure, a dielectric layer on the interconnection structure, an electronic component embedded in the dielectric layer, and a first conductive via penetrating through the dielectric layer and disposed adjacent to the electronic component. The interconnection structure includes a carrier having a first surface and a second surface opposite to the first surface, a first conductive layer disposed on the first surface of the carrier, and a second conductive layer disposed on the second surface of the carrier. The first conductive via and at least one of the first conductive layer and the second conductive layer define a first shielding structure surrounding the electronic component. A method of manufacturing a substrate structure is also disclosed.Type: ApplicationFiled: May 17, 2022Publication date: September 1, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chien-Fan CHEN, Yu-Ju LIAO
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Publication number: 20220271019Abstract: A semiconductor package structure and a method of manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a first electronic device and a second electronic device. The first electronic device has an active surface and a lateral surface angled with the active surface, and the lateral surface includes a first portion and a second portion that is non-coplanar with the first portion. The second electronic device is disposed on the active surface of the first electronic device.Type: ApplicationFiled: February 25, 2021Publication date: August 25, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chang-Yu LIN, Cheng-Hsuan WU
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Publication number: 20220260432Abstract: A non-invasive measuring device calculates a temperature of a medium in a container or conduit. The device includes at least one first sensor disposed on an exterior surface of the container or conduit and measures a temperature (To) of the exterior surface. The measuring device also includes at least one second sensor disposed on the exterior surface and measures a heat flux (q?) moving through a wall of the container or conduit. The measuring device further includes a processor operatively coupled to the first sensor and the second sensor. The processor is configured to receive the temperature (To) measurements and the heat flux (q?) measurements from the first sensor and the second sensor and to calculate a temperature of the medium in the container or conduit based on input variables about the container or conduit including radius, thickness and thermal conductivity of the material of the container or conduit.Type: ApplicationFiled: February 16, 2022Publication date: August 18, 2022Applicant: OMEGA Engineering, Inc.Inventors: Kenneth LEIBIG, Matthew ANNEN, Ye ZHU, David Alan AUSTIN, JR.
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Publication number: 20220262697Abstract: A package structure and a method for manufacturing the same are provided. The package structure includes an electronic device, a heat spreader, an intermediate layer and an encapsulant. The electronic device includes a plurality of electrical contacts. The intermediate layer is interposed between the electronic device and the heat spreader. The intermediate layer includes a sintered material. The encapsulant encapsulates the electronic device. A surface of the encapsulant is substantially coplanar with a plurality of surfaces of the electrical contacts.Type: ApplicationFiled: February 17, 2021Publication date: August 18, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Hsu-Nan FANG
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Patent number: 11413666Abstract: Systems, devices, and methods for passing vertical travel robotic tank cleaning systems through openings while mounted to existing riser structures, the system can extend to the bottom of the tank and horizontally more than approximately 30 feet. Plural systems can be used within a tank to break down solid sludge by placing high-pressure nozzle(s) in close proximity to solid waste providing maximum coverage. A mechanical arm with a nozzle assembly utilizes high- and low-pressure fluid streams to fluidize and liquefy solids while directly moving them to a centrally located transfer pump. The systems work in highly radioactive, chemically aggressive, explosive, high temperature and low temperature environments through hydraulic actuation. Multiple axis of freedom allows the arm and nozzle assembly to navigate and clean around internal obstacles and reach close proximity for maximum nozzle impingement force. Systems can be remotely operated up to approximately 1000 feet away.Type: GrantFiled: December 23, 2018Date of Patent: August 16, 2022Assignee: AGI Engineering, Inc.Inventor: Alex G. Innes
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Publication number: 20220256722Abstract: An electronic device package includes a substrate, at least one first electronic component and at least one electrical element. The substrate includes a first surface. The first surface comprises a plurality of electrical terminals including a first region and a second region, and a pitch of the electrical terminals of the first region is smaller than a pitch of the electrical terminals of the second region. The at least one first electronic component is electrically connected to the substrate and at least over the first region. The at least one electrical element is disposed above the first electronic component and farther from the substrate than the first electronic component. A number of the at least one electrical element under the first region is less than a number of the at least one electrical element under the second region.Type: ApplicationFiled: February 5, 2021Publication date: August 11, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Wei-Hao CHANG
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Publication number: 20220254699Abstract: A semiconductor device, a semiconductor package, and a method of manufacturing the same are provided. The semiconductor device includes an electronic component, a first thermal conductive layer, a second thermal conductive layer, and a solderable element. The first thermal conductive layer is disposed adjacent to a surface of the electronic component. The second thermal conductive layer is disposed on the first thermal conductive layer and exposes a portion of the first thermal conductive layer. The solderable element is disposed on the second thermal conductive layer.Type: ApplicationFiled: February 5, 2021Publication date: August 11, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Tun-Ching PI
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Patent number: 11412171Abstract: Existence of instrumentation for automatic video recording creates an excess capacity of video recording for those who own automatic video recorders. Others may want to utilize this excess capacity to record their activities thus there is a need for a system that helps match those who would like to utilize the excess capacity with those who have such capacity. Such excess capacity is matched with demand to use such excess capacity by creating a network of automatic video recording units and tags that are associated with people who want to be recorded.Type: GrantFiled: February 16, 2021Date of Patent: August 9, 2022Assignee: H4 Engineering, Inc.Inventors: Christopher T. Boyle, Konstantin Othmer, Gordon Jason Glover, Alexander G. Sammons
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Publication number: 20220246555Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes an antenna layer, a first circuit layer and a second circuit layer. The antenna layer has a first coefficient of thermal expansion (CTE). The first circuit layer is disposed over the antenna layer. The first circuit layer has a second CTE. The second circuit layer is disposed over the antenna layer. The second circuit layer has a third CTE. A difference between the first CTE and the second CTE is less than a difference between the first CTE and the third CTE.Type: ApplicationFiled: April 19, 2022Publication date: August 4, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Wen Hung HUANG
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Publication number: 20220246533Abstract: The present disclosure provides a semiconductor device package and a method of manufacturing the same. The semiconductor device package includes a substrate, an interconnection structure, a package body, and a first electronic component. The interconnection structure is disposed on the substrate. The package body is disposed on the substrate and partially covers the interconnection structure. The package body has a position limiting structure around the interconnection structure. The first electronic component is disposed on the interconnection structure and electrically connected to the interconnection structure.Type: ApplicationFiled: January 29, 2021Publication date: August 4, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Wei-Chih CHO, Shao-Lun Yang, Chun-Hung YEH, Tsung-Wei LU
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Publication number: 20220243992Abstract: A heat transfer element, a method for manufacturing the same and a semiconductor structure including the same are provided. The heat transfer element includes a housing, a chamber, a dendritic layer and a working fluid. The chamber is defined by the housing. The dendritic layer is disposed on an inner surface of the housing. The working fluid is located within the chamber.Type: ApplicationFiled: January 29, 2021Publication date: August 4, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hung-Hsien HUANG, Shin-Luh TARNG, Ian HU, Chien-Neng LIAO, Jui-Cheng YU, Po-Cheng HUANG
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Publication number: 20220246592Abstract: An optical package structure and a method for manufacturing an optical package structure are provided. The optical package structure includes a first die, a bumping structure, and a second die. The first die is on a carrier. The bumping structure is over the first die. The bumping structure includes a light-transmitting portion and a light-blocking portion embedded in the light-transmitting portion. The second die is electrically connected to the carrier. The light-blocking portion of the bumping structure is free from covering the second die.Type: ApplicationFiled: February 4, 2021Publication date: August 4, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Ying-Chung CHEN
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Publication number: 20220242762Abstract: Wastewater treatment plants and processes for treating wastewater are described. The wastewater treatment plant utilizes channel plug flow dynamics with attached growth media and pure oxygen or mixtures of pure oxygen and compressed air.Type: ApplicationFiled: April 12, 2022Publication date: August 4, 2022Applicant: McFadden Engineering, Inc.Inventor: A. Frank McFadden
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Publication number: 20220243689Abstract: An apparatus and a method are provided for an air box with an integrated air filter to communicate air flow from an exterior of the air filter to an air intake of an automobile engine. The air filter comprises a filter material that surrounds at least a portion of an interior cavity of the air filter. An end cap is affixed to a distal end of the filter material, and a wire support extends along at least a portion of the exterior surface of the filter material. The air box comprises a housing portion and a mount portion. The housing portion is configured to direct air drawn through the filter material into the interior cavity of the air filter and then into the air intake of the automobile engine. The mount portion is configured to support the air box and the air filter once installed within an automobile engine bay.Type: ApplicationFiled: April 14, 2022Publication date: August 4, 2022Applicant: K&N Engineering, Inc.Inventors: Kevin McClelland, Steve E. Williams, Colin Arthur Cranstone
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Patent number: 11401895Abstract: A filter oil composition and a method for removing airborne molecular contaminants from air are provided. The composition includes a first portion comprising paraffinic oil by volume of the composition, a second portion comprising polyalphaolefin (PAO) by volume of the composition, and a third portion comprising red dye by volume of the composition. Applying the filter oil composition to a cotton air filter material causes tackiness throughout the air filter material, thereby enhancing filtration of air passing through the filter. The composition generally is substantially non-reactive, has an excellent oxidation stability, possesses good thermal stability, and retains a suitable viscosity at a normal operating temperatures of an automobile engine. In an embodiment, the composition comprises 96.74% paraffinic oil by volume, 3.20% polyalphaolefin (PAO) by volume, and 0.06% red dye by volume. A viscosity of the composition at 100 degrees-C ranges between substantially 7.2 and 7.6 centistokes (cSTs).Type: GrantFiled: March 8, 2019Date of Patent: August 2, 2022Assignee: K&N Engineering, Inc.Inventors: Steve Williams, Jere James Wall, Rick Daniels
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Patent number: 11400021Abstract: An oral dosing syringe assembly comprises a syringe barrel comprising an inner chamber filled or adapted to be filled with medicament, and a channel in fluid communication with the chamber and through which medicament is dispensed. The assembly further comprises an end cap configured to be removably attached to the syringe barrel, characterised in that the barrel comprises an internal threaded section which mutually engages with a threaded section or the end cap to thereby create a seal, which prevents the flow of medicament therethrough.Type: GrantFiled: October 2, 2015Date of Patent: August 2, 2022Assignee: Plas-Tech Engineering, Inc.Inventors: Hannah Aiken, Christopher Grimes, Aaron Hirschmann, Robert Fesus
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Publication number: 20220236359Abstract: A system and method are provided for automatic cooperative object tracking using gain comparison of antenna pairs facing different directions. In cooperative object tracking, the object is associated with a radiation source, or beacon, that emits radiation that is detected by the tracking system. The present invention makes use of antennas that are not highly oriented antennas but are characterized by having a steep drop in their gain profiles at a particular angle of incidence of the radiation that they detect.Type: ApplicationFiled: April 13, 2022Publication date: July 28, 2022Applicant: H4 Engineering, Inc.Inventors: Christopher T. Boyle, Scott K. Taylor, Alexander G. Sammons, Gordon Jason Glover
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Patent number: D960063Type: GrantFiled: April 5, 2019Date of Patent: August 9, 2022Assignee: OTR Wheel Engineering, Inc.Inventor: Leonard Austin Hensel