Abstract: The invention relates to a flame retardant polycarbonate composition which is comprised of a polycarbonate, a phosphoric acid ester, a functionalized acrylic polymer, and an alkyl methacrylate-diene-vinyl aromatic terpolymer, wherein the polycarbonate is present in the composition in an amount of at least about 85 weight percent, wherein the phosphoric acid ester is present at a level which is within the range of about 1 weight percent to about 12 weight percent, wherein the functionalized acrylic polymer is present at a level which is within the range of about 0.5 weight percent to about 4.5 weight percent, and wherein the alkyl methacrylate-diene-vinyl aromatic terpolymer is present at a level which is within the range of about 0.5 weight percent to about 4.5 weight percent, with the proviso that the sum of the amount of the functionalized acrylic polymer and the alkyl methacrylate-diene-vinyl aromatic terpolymer present in the composition does not total more than 5 weight percent.

Abstract: A method of drilling a circuit substrate. A circuit substrate including at least a core layer and a metal layer covering one or both surfaces of the core layer is provided. A half-etching process is performed by etching the metal layer on the circuit substrate with an etchant to reduce the thickness of the metal layer. A surface treatment on the surface of the metal layer A via is formed in the circuit substrate by laser.

Abstract: A device for oxidizing gaseous materials, comprising a combustion chamber, wherein the device and the combustion chamber both have a top and a bottom, the device further having a gas outlet and being adapted to operate in conjunction with means applying negative pressure to the outlet, means for introducing process gas and a source of fuel into the top of the combustion chamber, means for effecting heat exchange between oxygen-containing gas and the combustion chamber to preheat the oxygen-containing gas, means for introducing the preheated gas into the top of the combustion chamber, means for mixing the preheated gas with the process gas and fuel so that the mixture can burn in the combustion chamber to form an exhaust gas, means for permitting the gas to exit from the bottom of the combustion chamber, means for diluting the exhaust with air to form a flue gas, and means for directing the flue gas from the bottom of the combustion chamber out of the outlet of the device.

Abstract: A system for containing and detoxifying a gaseous stream, comprising a storage housing containing one or more sources of toxic gas, means for applying negative pressure to the storage housing to continuously exhaust a gaseous stream therefrom, and a treatment housing interposed in the gaseous stream, the treatment housing containing one or more layers of solid sorbent material capable of removing the toxic gas from the stream, wherein a flow of treated gas that exits the treatment unit may be safely released to the environment.

Abstract: An apparatus and process for adsorbing volatile organic compounds, or VOCs, and efficiently regenerating adsorbent material in an emission control system. Flue gas, emitted from a combustion unit burning an outside fuel and desorbed VOCs, is humidified and cooled with a set of water injectors. The resultant humidified flue gas is directed through the adsorbent material, which is rapidly superheated without pressurization. A method for controlling the regeneration cycle of the emission control system includes at least three sensor configurations including a breakthrough sensor, a desorbed gas sensor and a flue gas temperature sensor.

Abstract: A cantilever tube for carrying loaded wafer boats into a diffusion furnace and confining flow of gas through the wafers includes an elongated slot extending from an open end of the tube to a predetermined region in which the wafer boats are positioned, the wafer boats abutting each other and forming a sealing cover for the elongated slot. A narrow boat carrier supported on a carriage system extends through the elongated slot and carries a wafer boat loaded with wafers into the open end and to the predetermined region in the cantilever tube without allowing either the carrier, or the wafer boat, or the wafers to touch the cantilever tube. The carrier lowers the boat onto the bottom inner surface of the tube, causing the boat to cover a portion of the elongated slot. The procedure is repeated for subsequent wafer boats, each of which abuts the previous one, to effectively close and seal the elongated slot when all of the wafer boats are positioned inside the cantilever tube.

Abstract: A cantilever diffusion tube apparatus includes a quartz cantilever tube having a support end clamped to a laterally movable carriage mechanism and an outer end portion containing a plurality of spaced semiconductor wafers. The cantilever tube is coaxially aligned with a diffusion tube of a diffusion furnace. The support end of the cantilever tube is sealed by a door plate through which a gas tube extends. The wafers are loaded into the cantilever tube through a window opening. The carriage then moves the cantilever tube and wafers therein into the diffusion tube. Reactant gases are caused to flow into the cantilever tube, between the heated wafers therein, and out of the cantilever tube. Then purging gas is caused to flow through the cantilever tube and wafers therein.

Abstract: A cantilever diffusion tube apparatus includes a quartz cantilever tube having a support end clamped to a laterally movable carriage mechanism and an outer end portion containing a plurality of spaced semiconductor wafers. The cantilever tube is coaxially aligned with a diffusion tube of a diffusion furnace. The support end of the cantilever tube is sealed by a door plate through which a gas tube extends. The wafers are loaded into the cantilever tube through a window opening. The carriage then moves the cantilever tube and wafers therein into the diffusion tube. Reactant gases are caused to flow into the cantilever tube, between the heated wafers therein, and out of the cantilever tube. Then purging gas is caused to flow through the cantilever tube and wafers therein.