Patents Assigned to Engineering
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Patent number: 11995790Abstract: The present invention provides a three-dimensional view-based fabricated building display method and system. In particular, a three-dimensional model is loaded, the three-dimensional model is rendered by a first rendering mode to obtain an average frame rate of automatic rotation. In a case that the average frame rate is less than a first threshold, the three-dimensional model is divided into two layers. the first layer is a model primitive layer, and the second layer is a reference primitive and view proprietary primitive layer. The first layer is rendered by the first rendering mode, and the second layer is rendered by a second rendering mode. In a case that the average frame rate is greater than a second threshold, the three-dimensional model is rendered by a third rendering mode.Type: GrantFiled: December 27, 2023Date of Patent: May 28, 2024Assignee: China Construction Industrial & Energy Engineering Group Huanghe Construction Co., Ltd.Inventors: Jie Liu, Zhanqi Zhang, Chunyuan Tang, Fei Huang, Song Chen, Daoming Li, Liushuai Dong
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Patent number: 11995841Abstract: A method and system for conducting a non-contact survey of an overhead crane runway system using a survey apparatus that is alternately located in the crane bay or on a crane bridge girder. Disclosed more particularly are a method and system for testing an overhead crane runway beam 3D alignment or an overhead crane runway rail 3D alignment using a 3D laser scanner.Type: GrantFiled: May 3, 2021Date of Patent: May 28, 2024Assignee: Falk PLI Engineering & Surveying, Inc.Inventors: Michael O. Falk, Sagar Deshpande, Zhengwei Davis Zhang, Nathan Plooster
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Patent number: 11993049Abstract: There is provided a press machine capable of simplifying a slide drive mechanism. The press machine comprises: a slide supported so as to be reciprocally movable; a crankshaft arranged along a longitudinal direction of the slide and having a plurality of eccentric parts; a drive unit configured to rotate the crankshaft; a plurality of yokes and each provided to each of the eccentric parts of the crankshaft and configured to reciprocate, due to rotation of the crankshaft, along a moving direction of the slide; and a plurality of points each connects each of the yokes to the slide, wherein at least one of the plurality of yokes is connected to the slide via some of the plurality of points arranged along a direction perpendicular to an axial direction of the crankshaft.Type: GrantFiled: September 24, 2021Date of Patent: May 28, 2024Assignee: AIDA ENGINEERING, LTD.Inventor: Takao Ito
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Patent number: 11994398Abstract: A system for automatic scheduling of vehicles includes a network access device configured to receive scheduling information corresponding to at least one travel request and including a user-selected starting location and a user-selected destination location. The system further includes a memory configured to store map information including road information and preselected vehicle stops. The system further includes a processor coupled to the network access device and the memory. The processor is designed to identify available vehicles to transport passengers. The processor is further designed to determine routes for the available vehicles to travel, the routes including vehicle stops and being determined based on the scheduling information, the road information, and the preselected vehicle stops. The processor is further designed to control the network access device to transmit the identified routes to the available vehicles.Type: GrantFiled: June 21, 2019Date of Patent: May 28, 2024Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.Inventor: Shalini Keshavamurthy
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Patent number: 11996769Abstract: A noise filter includes: a voltage detector which detects a common mode voltage generated by a power converter; a voltage division circuit which outputs a division voltage obtained by dividing the common mode voltage detected by the voltage detector; a plurality of common mode transformers which superimpose injection voltages each having a polarity opposite to a polarity of the common mode voltage onto an output from or an input to the power converter; and an injection waveform generator which generates, on the basis of the division voltage, output voltages to be outputted to primary sides of the plurality of common mode transformers. The injection waveform generator generates the output voltages such that a difference between the common mode voltage and a total injection voltage obtained by summing the injection voltages to be superimposed by the plurality of common mode transformers is equal to or smaller than an allowable value.Type: GrantFiled: June 4, 2020Date of Patent: May 28, 2024Assignees: MITSUBISHI ELECTRIC CORPORATION, MITSUBISHI ELECTRIC ENGINEERING COMPANY, LIMITEDInventors: Yuki Fujita, Yasuaki Furusho, Hiroyuki Ichinose
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Patent number: 11997838Abstract: Disclosed herein are apparatus and methods for a power electronics assembly that includes a cold plate assembly and one or more power device assemblies. The cold plate assembly has a manifold having a heat sink cavity in a first surface and a heat sink that includes one or more substrate cavities. The heat sink is positioned in the heat sink cavity. The one or more power device assemblies are positioned within the one or more substrate cavities. Each power device assembly includes an S-cell, a power device, and a direct bonded metal substrate bonded to the S-Cell. The S-cell includes a base layer constructed at least of graphite or a graphite-composite, a conductive layer at least partially surrounding the base layer, and a power device cavity. The power device is positioned in the power device cavity and is electrically coupled to the conductive layer.Type: GrantFiled: February 1, 2022Date of Patent: May 28, 2024Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.Inventors: Feng Zhou, Yanghe Liu, Hiroshi Ukegawa
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Patent number: 11997076Abstract: A system includes an intelligent electronic device (IED) configured to perform operations that include receiving a first user input and deriving a first connectivity association key (CAK) based on the first user input. The system also includes a gateway configured to perform operations that include receiving a second user input, deriving a second CAK based on the second user input, identifying the first CAK of the IED, establishing an adoption link with the IED based on a match between the first CAK and the second CAK, generating a third CAK, and distributing a copy of the third CAK to the IED via the adoption link to establish a MKA connectivity association with the IED.Type: GrantFiled: August 25, 2020Date of Patent: May 28, 2024Assignee: Schweitzer Engineering Laboratories, Inc.Inventors: Colin Gordon, John W. Knapek
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Patent number: 11997888Abstract: A semiconductor device package includes a display device, an electronic module and a conductive adhesion layer. The display device includes a first substrate and a TFT layer. The first substrate has a first surface and a second surface opposite to the first surface. The TFT layer is disposed on the first surface of the first substrate. The electronic module includes a second substrate and an electronic component. The second substrate has a first surface facing the second surface of the first substrate and a second surface opposite to the first surface. The electronic component is disposed on the second surface of the second substrate. The conductive adhesion layer is disposed between the first substrate and the second substrate.Type: GrantFiled: December 13, 2021Date of Patent: May 28, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Ming-Hung Chen, Sheng-Yu Chen, Chang-Lin Yeh, Yung-I Yeh
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Patent number: 11996373Abstract: A semiconductor device package includes a substrate and a shielding layer. The substrate has a first surface, a second surface opposite to the first surface and a first lateral surface extending between the first surface and the second surface. The substrate has an antenna pattern disposed closer to the second surface than the first surface. The shielding layer extends from the first surface toward the second surface of the substrate. The shielding layer covers a first portion of the first lateral surface adjacent to the first surface of the substrate. The shielding layer exposes a second portion of the first lateral surface adjacent to the second surface of the substrate.Type: GrantFiled: February 14, 2023Date of Patent: May 28, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Jenchun Chen, An-Ping Chien
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Patent number: 11996717Abstract: A wireless charging pad includes a rectifier, a receiver coil, a heat spreader plate sandwich between the rectifier and the receiver coil, and a ferrite cold plate sandwiched between the receiver coil and the heat spreader plate. The ferrite cold plate has a fluid inlet, a fluid outlet, and a fluid chamber in fluid communication with the fluid inlet and the fluid outlet. The fluid chamber includes a primary cooling chamber and a secondary cooling chamber. Primary cooling fins extending from the heat spreader plate are disposed in the primary cooling chamber and secondary cooling fins extending from a base of the ferrite cooling plate are disposed in the secondary cooling chamber. The ferrite cooling plate cools the rectifier and inhibits or blocks electromagnetic leakage from the receiver coil from interfering with operation of rectifier.Type: GrantFiled: September 16, 2021Date of Patent: May 28, 2024Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.Inventors: Yanghe Liu, Feng Zhou, Ercan Mehmet Dede
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Publication number: 20240170364Abstract: A semiconductor device package and a method of manufacturing a semiconductor device package are provided. The semiconductor device package includes at least one electronic component, a heat source, and a heat dissipation element. The heat source is adjacent to the electronic component. The heat dissipation element is disposed adjacent to the heat source and the electronic component. The heat dissipation element includes a heat transmitting structure configured to reduce heat, which is from the heat source, through the heat dissipation element, and transmitting in a direction toward the electronic component.Type: ApplicationFiled: November 23, 2022Publication date: May 23, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hung-Hsien HUANG, Wen Chun WU, Chih-Pin HUNG
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Publication number: 20240167341Abstract: A full-hole reverse circulation cluster-type down-the-hole (DTH) hammer with multiple independent channels is provided. The DTH hammer includes a drill rod, a drill rod joint, a drill rod air pipe, a diversion chamber, at least one hammer, and an upper pressure plate, a lower pressure plate, and an upper outer hammer protection pipe for fixing the hammer, where at least one jet air pipe communicated with the diversion chamber and at least one drill cuttings discharge pipe are arranged between the hammers; lower ends of the jet air pipe and the drill cuttings discharge pipe are located close to a hammer drill bit; and the lower end of the jet air pipe is provided with jet holes for producing a negative pressure.Type: ApplicationFiled: November 17, 2023Publication date: May 23, 2024Applicant: Haozhou Drilling Engineering Machinery (Shandong) Co., Ltd.Inventors: Yechen ZHAO, Chengliang YAN, Fengzheng JING, Yeshui ZHAO, Yechun ZHAO, Da ZHANG
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Publication number: 20240170603Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface and a second surface opposite to the first surface, an optical device disposed on the first surface of the substrate, and an electronic device disposed on the second surface of the substrate. A power of the electronic device is greater than a power of the optical device. A vertical projection of the optical device on the first surface is spaced apart from a vertical projection of the electronic device on the second surface by a distance greater than zero.Type: ApplicationFiled: January 30, 2024Publication date: May 23, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Mei-Yi WU, Chang Chin TSAI, Bo-Yu HUANG, Ying-Chung CHEN
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Publication number: 20240166209Abstract: Systems and methods for controlling a cruise control system of a vehicle using the moods of one or more occupants are described herein. In one example, a system includes a processor and a memory in communication with the processor. The memory includes instructions that, when executed by the processor, cause the processor to determine, using a mood model, the mood of at least one occupant of a vehicle and a setting for a cruise control to maintain a distance between the vehicle and a preceding vehicle based on the determined mood. The instructions then cause the processor to set the cruise control to operate according to the setting.Type: ApplicationFiled: November 22, 2022Publication date: May 23, 2024Applicants: Toyota Motor Engineering & Manufacturing North America, Inc., Toyota Jidosha Kabushiki KaishaInventors: Rohit Gupta, Ziran Wang, Kyungtae Han, Hazem Abdelkawy, Paul Li, Satoshi Nagashima, Pujitha Gunaratne
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Publication number: 20240171091Abstract: An artificial muscle including a housing, an electrode pair positioned in an electrode region of the housing, the electrode pair including a first electrode and a second electrode, the first electrode and the second electrode each including a pair of tab portions and a bridge portion interconnecting the pair of tab portions, and a first closing aid provided exteriorly of the housing opposite the electrode pair and applying a force in a direction toward the electrode region of the housing, wherein the electrode pair is actuatable between a non-actuated state and an actuated state such that actuation from the non-actuated state to the actuated state results in attraction of the first electrode and the second electrode.Type: ApplicationFiled: November 23, 2022Publication date: May 23, 2024Applicants: Toyota Motor Engineering & Manufacturing North America, Inc., Toyota Jidosha Kabushiki KaishaInventors: Erin J. Rutledge, Maduran Palaniswamy, Michael P. Rowe
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Publication number: 20240166103Abstract: A vehicle including a floor surface and a seat. The floor surface has a floor striker. The seat is movable between a seated state and a stowed state. The seat includes a seat cushion frame, a sear back, and a seat latch. The seat cushion frame has a seat striker. The seat back is rotatably coupled to the seat cushion frame. In the seated positon, the seat latch engaged with the floor striker. In the stowed state, the seat latch engages with the seat striker.Type: ApplicationFiled: November 21, 2022Publication date: May 23, 2024Applicants: Toyota Motor Engineering & Manufacturing North America, Inc., Toyota Jidosha Kabushiki KaishaInventors: Vasudeva S. Murthy, Christopher M. Vargo, Nicholas J. Schutzman
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Publication number: 20240166794Abstract: Provided are: a photocurable composition capable of forming a sealant composed of a foam endowed with excellent elongation and excellent tensile strength by being cured while foamed; a photocurable foam composition in which gas bubbles are included in the aforementioned photocurable composition; a urethane (meth)acrylate compound that is suitably used as a component of the aforementioned photocurable composition; and a method for producing a foam using the abovementioned photocurable composition. In this photocurable composition, which contains a urethane (meth)acrylate (A) and a photopolymerization initiator (C), a urethane (meth)acrylate compound having a specific structure that includes a urethane bond, has a polyether chain having a molecular weight within a specific range in the center, and has (meh) acryloyloxy groups at both ends of a linear polyether chain is used as the urethane (meth)acrylate (A).Type: ApplicationFiled: March 23, 2022Publication date: May 23, 2024Applicant: Sunstar Engineering Inc.Inventors: Takuro OMACHI, Akimi EBATA
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Publication number: 20240167906Abstract: Disclosed is a aqueous solution leak detection cable that locates aqueous solution leaks in pipelines, tanks, and other devices that store and transport aqueous solutions. Resistive sensor wires are used so that the location of the leak can be detected with a high degree of accuracy in an inexpensive and convenient matter. In addition, aqueous solution leaks can be detected over long distances, which reduces the cost and provides reliability for detecting aqueous solution leaks in aqueous solution pipelines.Type: ApplicationFiled: November 16, 2023Publication date: May 23, 2024Applicant: Raymond & Lae Engineering, LLCInventors: Donald M. Raymond, James Schneider
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Patent number: D1029041Type: GrantFiled: April 21, 2021Date of Patent: May 28, 2024Assignee: Sharrow Engineering LLCInventor: Gregory C. Sharrow
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Patent number: D1029057Type: GrantFiled: May 24, 2018Date of Patent: May 28, 2024Assignee: AIDA ENGINEERING, LTD.Inventor: Yasuhiro Harada