Patents Assigned to Engineering
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Publication number: 20240170167Abstract: The invention relates to nuclear power engineering and is intended for using in power plants with a reactor with a heavy liquid metal coolant (HLMC) based on lead or on lead-bismuth alloys. The invention makes it possible to increase the radiation protection efficiency for the in-vessel equipment of a nuclear reactor, to increase the heat storage capacity of the primary circuit, to reduce the nuclear reactor weight, and to improve its strength characteristics. In the in-vessel space of a nuclear reactor, which is not occupied by the necessary equipment, containers filled with a material that reflects or absorbs neutrons, with a heat capacity greater than that of the coolant, are installed with gaps ensuring the coolant flow, while the containers are placed in such a way that the resulting gaps form channels with a turbulent coolant flow to cool these containers at a flow rate corresponding to the nominal power output level of the nuclear reactor.Type: ApplicationFiled: October 4, 2021Publication date: May 23, 2024Applicant: "AKME-ENGINEERING", JOINT-STOCK COMPANYInventors: Aleksandr Vladislavovich DEDYL, Vladimir Sergeevich STEPANOV, Georgii Il'ich TOSHINSKII, Urii Aleksandrovich ARSEN'EV, Oleg Gennad'evich KOMLEV, Mihail Petrovich VAHRUSHIN, Sergey Aleksandrovich GRIGOR'EV, Sergey Vladimirovich SAMKOTRYASOV
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Publication number: 20240167905Abstract: Disclosed is a hydrocarbon leak detection cable that locates hydrocarbon leaks in oil pipelines, gas pipelines, oil and gas tanks, and other devices that store and transport hydrocarbons. Resistive sensor wires are used so that the location of the leak can be detected with a high degree of accuracy in an inexpensive and convenient matter. In addition, hydrocarbon leaks can be detected over long distances, which reduces the cost and provides reliability for detecting hydrocarbon leaks in hydrocarbon pipelines.Type: ApplicationFiled: November 17, 2022Publication date: May 23, 2024Applicant: Raymond & Lae Engineering, Inc.Inventors: Donald M. Raymond, James Schneider
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Publication number: 20240170302Abstract: A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) measuring an amount of a molding powder; (b) controlling the amount of a molding powder; and (c) dispensing the molding powder on an assembly structure including a carrier and at least one semiconductor device disposed on the carrier.Type: ApplicationFiled: January 30, 2024Publication date: May 23, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Chenghan SHE
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Publication number: 20240169119Abstract: A method for implementing a modeling tool that generates optimized reduced kinetic models for given operating conditions and a numerical scheme to speed-up kinetic evaluation of turbulent-chemistry coupling during CFD simulations. The tool is capable of predicting ignition and flameholding phenomenon for most propulsion systems, including gas turbine applications. A lumped-parameterization based optimization scheme may generate multi-step quasi-global kinetic models using laminar flame speed as the target data. This scheme may be further extended to include optimization of emission predictions such as CO and NOx.Type: ApplicationFiled: January 23, 2024Publication date: May 23, 2024Applicant: COMBUSTION SCIENCE & ENGINEERING, INC.Inventors: Ponnuthurai GOKULAKRISHNAN, Darin VIEHE, Andrew TRETTEL, Michael S. KLASSEN
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Publication number: 20240170345Abstract: A method of manufacturing a circuit pattern structure, a measurement method, and a circuit pattern structure are provided. The method of manufacturing the circuit pattern structure includes: forming a dielectric layer; forming at least one first pad at least partially in the dielectric layer; forming a second pad adjacent to the at least one first pad and having a height greater than that of the at least one first pad.Type: ApplicationFiled: November 17, 2022Publication date: May 23, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Yu-Kai LIN, Chih-Cheng LEE
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Publication number: 20240170437Abstract: A package structure is disclosed. The package structure includes a first substrate, a second substrate, a gap, and a directing structure. The second substrate is disposed under the first substrate. The gap is between the first substrate and the second substrate. The gap includes a first region and a second region. The first region is configured to accommodate a filling material. The directing structure is disposed in a flow path of the filling material and configured to reduce a migration of the filling material from the first region to the second region.Type: ApplicationFiled: November 23, 2022Publication date: May 23, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chun Fu KUO, Shang Min CHUANG, Ching Hung CHUANG, Hsu Feng TSENG, Jia Zhen WANG
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Publication number: 20240170829Abstract: The present disclosure provides an electronic package. The electronic package includes an antenna structure having a first antenna and a second antenna at least partially covered by the first antenna. The electronic package also includes a directing element covering the antenna structure. The directing element has a first portion configured to direct a first electromagnetic wave having a first frequency to transmit via the first antenna and a second portion configured to direct a second electromagnetic wave having a second frequency different from the first frequency to transmit via the second antenna. A method of manufacturing an electronic package is also provided.Type: ApplicationFiled: January 30, 2024Publication date: May 23, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jenchun CHEN, Ya-Wen LIAO
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Publication number: 20240166244Abstract: System, methods, and other embodiments described herein relate to estimating the origins of abnormal driving through observed driving patterns. In one embodiment, a method includes detecting, using parallel computations, abnormal classifications associated with a subject vehicle and nearby vehicles according to driving patterns derived from observation data, the abnormal classifications being associated with exceeding a position range in the observation data. The method also includes estimating an origin of abnormal driving with happens-before analysis according to the abnormal classifications, and the abnormal driving is associated with deviations in a traffic flow associated with the subject vehicle and the nearby vehicles. The method also includes controlling the subject vehicle using a driving command according to the origin.Type: ApplicationFiled: November 22, 2022Publication date: May 23, 2024Applicants: Toyota Motor Engineering & Manufacturing North America, Inc., Toyota Jidosha Kabushiki KaishaInventors: Seyhan Ucar, Haritha Muralidharan, Emrah Akin Sisbot, Kentaro Oguchi
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Publication number: 20240166230Abstract: An active road surface maintenance system and method developed for connected vehicles with the aid of a mobility digital twin (MDT) framework. A method performed in a cloud-based digital space includes receiving data regarding a physical object from a physical space connected to a vehicle. The method also includes processing the data using machine learning to model road surface conditions, in which respective penalty values are assigned to corresponding road surfaces, a respective penalty value being higher the lower a condition of the corresponding road surface. The method also includes deriving instructions based on the modeled road surface conditions and the respective penalty values to guide actuation of the vehicle along a trajectory. The method further includes transmitting the instructions to the physical space connected to the vehicle to guide actuation of the vehicle.Type: ApplicationFiled: November 22, 2022Publication date: May 23, 2024Applicants: Toyota Motor Engineering & Manufacturing North America, Inc., Toyota Jidosha Kabushiki KaishaInventors: ZIRAN WANG, Rohit Gupta, Kyungtae Han
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Publication number: 20240171698Abstract: A back-lit screen comprising: a rigid frame extending around the periphery of the screen and having a front face, the front face having an interior face which defines an opening, and an outer face which defines the exterior contour of the frame transversely to the opening; and a translucent sheet extending across the opening; the frame being configured so that over at least a part of the periphery of the screen the forward-most part of the interior face is coincident with the exterior contour of the frame.Type: ApplicationFiled: March 4, 2022Publication date: May 23, 2024Applicant: Mo-Sys Engineering LimitedInventor: Michael Paul Alexander Geissler
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Publication number: 20240166449Abstract: An inspection robot system, including one or more detection devices, a rail, a traction device, one or more connecting devices, and a multi-axis manipulator. The detection devices are configured to at least obtain environmental image information. The rail is suspended in an air. The traction device includes a steel cable and a steel cable drive assembly. The steel cable drive assembly is connected to the steel cable and is configured to drive the steel cable to move along an axial direction of the steel cable. The connecting devices are slidably connected to the rail. The detection devices are respectively arranged on the connecting devices. The connecting devices are connected to the steel cable and are configured to move along the rail under a traction of the steel cable. At least one of the connecting devices is/are each provided with the multi-axis manipulator.Type: ApplicationFiled: June 4, 2021Publication date: May 23, 2024Applicants: TAIYUAN UNIVERSITY OF TECHNOLOGY, SHANXI DEDICATED MEASUREMENT CONTROL CO., LTD., TAIYUAN BOSHITONG MACHINERY, ELECTRICITY AND HYDRAULIC ENGINEERING CO., LTD.Inventors: Ziming KOU, Juan WU, Shaoni JIAO, Xin LI, Wei ZHANG, Xinjie FAN, Jiabao XUE, Lijun ZHANG, Yongyong DONG, Qingshan NIU
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Publication number: 20240168238Abstract: A recessed portion in a semiconductor substrate and a method of forming the same are provided. The method comprises: forming a mask on the semiconductor substrate; forming a protection layer on a top surface of the mask and on at least one sidewall of the mask, and on at least one surface of the semiconductor substrate exposed by the mask; performing a first etching process to remove the protection layer on the top surface of the mask and on a bottom surface of the semiconductor substrate exposed by the mask; and performing a second etching process to remove the remaining protection layer and to etch the semiconductor substrate to form the recessed portion. In this way, a recessed portion with relatively smooth and vertical sidewalls can be realized.Type: ApplicationFiled: January 30, 2024Publication date: May 23, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Shao Hsuan CHUANG, Huang-Hsien CHANG
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Publication number: 20240165285Abstract: Disclosed are a disinfection and illumination lamp and system. The disinfection and illumination lamp includes: a light source unit (11), including a visible light source (111) and a disinfection light source (112); a sensing unit (12), configured to sense the presence of living beings within a preset range; and a control unit, connected with the light source unit (11) and the sensing unit (12). After the control unit receives a signal transmitted by the sensing unit (12) sensing the presence of the living being, the visible light source (111) is controlled to emit illumination light, and the disinfection light source (112) is turned off; and after the control unit receives a signal transmitted by the sensing unit (12) not sensing the presence of the living being, the visible light source (111) is controlled to emit warning light, and the disinfection light source (112) is controlled to emit disinfection light.Type: ApplicationFiled: May 27, 2021Publication date: May 23, 2024Applicants: SHANGHAI SANSI ELECTRONIC ENGINEERING CO. LTD., SHANGHAI SANSI TECHNOLOGY CO. LTD., JIASHAN SANSI OPTOELECTRONIC TECHNOLOGY CO. LTD., PUJIANG SANSI OPTOELECTRONIC TECHNOLOGY CO. LTD.Inventors: BISHOU CHEN, MING CHEN, SHAN LI, XIAOLIANG HE
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Publication number: 20240170396Abstract: A package structure is provided. The package structure includes an encapsulant and an interposer. The encapsulant has a top surface and a bottom surface opposite to the top surface. The interposer is encapsulated by the encapsulant. The interposer includes a main body, an interconnector, and a stop layer. The main body has a first surface and a second surface opposite to the first surface. The interconnector is disposed on the first surface and exposed from the top surface of the encapsulant. The stop layer is on the second surface, wherein a bottom surface of the stop layer is lower than the second surface.Type: ApplicationFiled: January 30, 2024Publication date: May 23, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Yung-Shun CHANG, Sheng-Wen YANG, Teck-Chong LEE, Yen-Liang HUANG
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Publication number: 20240165896Abstract: The present invention relates to the technical field of composite materials, and in particular to a fiber composite material and a preparation method thereof. The preparation method comprises: A) uniformly dispersing nanoparticles in a solvent to obtain a nanoparticle dispersion; B) uniformly spray-coating the nanoparticle dispersion on a chopped fiber nonwoven fabric, and drying the fabric to obtain a nano-modified chopped fiber nonwoven fabric; C) intercalating the nano-modified chopped fiber nonwoven fabric between fiber preforms, and subjecting the obtained material and a resin matrix to composite molding by a molding process to obtain a fiber composite material. In the present invention, firstly nanoparticles are uniformly dispersed in a solvent to obtain a nanoparticle dispersion; secondly, the chopped fiber and the nanoparticles cooperate to construct a multi-scale interlaminar toughening phase, which significantly improves the interlaminar fracture toughness of the fiber composite material.Type: ApplicationFiled: July 7, 2023Publication date: May 23, 2024Applicant: NINGBO INSTITUTE OF MATERIALS TECHNOLOGY AND ENGINEERING, CHINESE ACADEMY OF SCIENCESInventors: Yunfu OU, Dongsheng MAO, Longqiang WU, Hongchen ZHAO, Kun LIU, Yiting WENG, Anran FU
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Publication number: 20240164989Abstract: The present disclosure relates to medical devices containing time-release drug substance, and more particularly, to medical tubing, catheters, stents, cables (including fiber optic cables), pills, capsules, sheaths, threads, clamps, sutures, and endotracheal devices. The invention also generally relates to a method for extruding multiple laminated flow streams using microlayer coextrusion to create these various time-release drug delivery products.Type: ApplicationFiled: December 4, 2023Publication date: May 23, 2024Applicant: Guill Tool & Engineering Co., Inc.Inventors: Richard Guillemette, Robert Peters, Christopher Hummel
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Publication number: 20240168059Abstract: A probe card is provided. The probe card includes: a main circuit board defining an opening; a fixed core provided on a bottom surface of the main circuit board; a movable core provided adjacent the fixed core and configured to move through the opening along a vertical direction; and a driver provided on an upper surface of the main circuit board and configured to control the movable core to move along the vertical direction. The driver includes a driving source provided on an installation portion of the main circuit board, and a power transmission member connected to the driving source and including a roller configured to contact the movable core, and the driver is configured to move the movable core to control whether the fixed core or the movable core is electrically connected to a product, according to a type of the product.Type: ApplicationFiled: November 16, 2023Publication date: May 23, 2024Applicants: Samsung Electronics Co., Ltd., Top Engineering Co., Ltd.Inventors: Kyubeom KIM, Junoh Choi, Duhyun Hwang, Dongdae Kim, Youngil Kim, Jaehan Cho
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Patent number: 11987142Abstract: Apparatuses and methods for temperature regulation of a charging system. A fluid is provided within a channel formed between a charging component of the charging system in a vehicle and a regulation jacket that surrounds the charging component. The charging component of the charging system is cooled via the fluid.Type: GrantFiled: March 26, 2021Date of Patent: May 21, 2024Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.Inventor: Charlie Yang
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Patent number: 11987216Abstract: A rock knocker bracket holds a rock ejector such as a chain or bar that is used to clear debris from the gap between two tires of a mining vehicle. The rock ejector is pivotally mounted on a horizontal, lateral pin that is held at both ends by side plates of the bracket. The pin has a series of holes formed along its length. Bar retainers and washers mounted on the pin allow the rock ejector to be moved laterally along the pin and thereby provide for different laterally spacing configurations of the tires. Fasteners pass through holes in the bar retainers and the holes in the pin to hold the rock ejector at a predetermined lateral location along the pin. Alternative designs for the pin and the bracket include other systems for laterally moving the rock ejector and mounting it in the predetermined lateral position.Type: GrantFiled: September 23, 2020Date of Patent: May 21, 2024Assignee: Austin Engineering USA Services, Inc.Inventors: Seth J. E. Reynolds, Frederick J. Reynolds
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Patent number: 11988434Abstract: A high efficiency airflow management system can be used to reliably and consistently draw air through palletized product stacks with a minimum of energy expenditure. A racking system is provided with a grid of pallet bays separated from an air plenum/chamber by a wall having an airflow opening for each pallet bay. An air dam selectively permits or prevents airflow through portions of the airflow opening such that airflow may be allowed to flow through the entire opening, only a portion of the opening, or none of the opening.Type: GrantFiled: May 3, 2022Date of Patent: May 21, 2024Assignee: Tippmann Engineering, LLCInventor: Daniel J. Tippmann