Patents Assigned to Engineering
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Patent number: 6797966Abstract: A quick-install irradiation unit for irradiating a surface includes an adapter that accepts a frame for supporting an ultraviolet lamp with a reflector or a lens for focusing the radiation on the surface. The unit may include a housing secured to one end of the frame containing a drive motor and a cam assembly which oscillate the reflector, if the radiation is focused on a predefined area of the surface at any given time. The unit can be quickly installed in any orientation on practically any flat surface.Type: GrantFiled: January 26, 2001Date of Patent: September 28, 2004Assignee: Engineering Dynamics, Ltd.Inventors: George Robert Summers, Forwood Cloud Wiser, III
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Patent number: 6799090Abstract: A system for actuating a spray pump assembly comprises a reference platform, a motor, a drive transmission, a spray pump holder, a force coupler, a force transducer, and a system controller. The motor receives a power and control input, and produces a rotary drive output. The drive transmission receives the rotary drive output and produces a linear drive output. The spray pump holder secures the spray pump assembly. The force coupler couples the linear drive output to the spray pump, and applies a force to the spray pump. The force transducer produces a force signal proportional to the force applied to the spray pump. The system controller receives a set of test inputs and provides the control input to the motor as a function of the set of test inputs. The system actuates the spray pump mechanism according to an actuation profile defined by the set of test inputs.Type: GrantFiled: June 21, 2002Date of Patent: September 28, 2004Assignee: Image Therm Engineering, Inc.Inventors: Dino J. Farina, Timothy M. Fallon, Socratis Kalogrianitis, Peter Taylor
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Patent number: 6797153Abstract: A catalyst for the hydrocracking of heavy oils contains iron and active carbon having an MCH conversion rate of 40-80%, a specific surface area of 600-1000 m2/g of, a pore volume of 0.5 to 1.4 cm3/g, 2-50 nanometers' mesopore volume of not less than 60% and an average pore diameter of 3-6 nanometers, the iron being carried on the active carbon in an amount of 1 to 20 wt. % to the active carbon. The hydrocracking process using the catalyst includes a first step of conducting hydrocracking at a temperature within the range of 360-450° C. at a hydrogen partial pressure of 2-14 MPaG and a second step of conducting hydrocracking at a temperature within the range of 400-480° C. at a hydrogen partial pressure of 2-18 MPaG, which can suppress the generation of coke and remove, in a high efficiency, heavy metals such as Ni and V, asphaltene, residual carbon, sulfur and nitrogen from the heavy oils.Type: GrantFiled: April 27, 2000Date of Patent: September 28, 2004Assignees: Petroleum Energy Center, Toyo Engineering CorporationInventors: Hidetsugu Fukuyama, Koji Ohtsuka, Satoshi Terai, Shuhei Sawamoto
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Patent number: 6797566Abstract: A semiconductor integrated circuit device with third gates comprising second conduction type source/drain diffusion layer regions 205 formed in first conduction type well 201, floating gates 203b formed on semiconductor substrate 200 through an insulator film 202, control gates 211a formed on floating gates 203b through nitrogen-introduced silicon oxide film 210a and third gates 207a different from the floating gates and the control gates, formed through the semiconductor substrates, the floating gates, the control gates and the insulator film, where the third gates are formed as filled in gaps between the floating gates existing in a vertical direction to word lines and channels and the height of third gates 207a thus formed is made lower than that of floating gates 203b, has improved reduction of memory cell size and operating speed and improved reliability after programming/erasing cycles.Type: GrantFiled: January 16, 2002Date of Patent: September 28, 2004Assignees: Renesas Technology Corp., Hitachi Device Engineering Corp. Ltd.Inventors: Takashi Kobayashi, Yasushi Goto, Tokuo Kure, Hideaki Kurata, Hitoshi Kume, Katsutaka Kimura, Syunichi Saeki
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Patent number: 6796334Abstract: The present invention relates to a conduit repairing material, repairing structure, and repairing method thereof, and particularly provides a repairing method for an existing conduit characterized by comprising using a plurality of reinforcing members capable of being carried in the existing conduit, assembling said reinforcing members into a hollow skeleton-like reinforcing body extending substantially along the inner surface of the existing conduit, attaching a plurality of inner face bars to the inside of the reinforcing body to assemble them into a tubular form along the lengthwise direction of the conduit, and injecting a curable infilling into the gap between the inner face bars and the inner surface of the existing conduit.Type: GrantFiled: October 31, 2002Date of Patent: September 28, 2004Assignees: Ashimori Industry Co., Ltd., Ashimori Engineering Co., Ltd.Inventors: Masatoshi Ishikawa, Hitoshi Saito, Futoshi Makimoto
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Patent number: 6798123Abstract: External electrodes on piezoceramic multilayer actuators, composed of a layer of a basic metallization applied to the ceramic material of the surface of a actuator, to which metallization there is joined by means of a joining layer a reinforcing layer to which a connecting wire is soldered, wherein the layer of basic metallization is structured by discontinuities or recesses.Type: GrantFiled: November 1, 2001Date of Patent: September 28, 2004Assignee: CeramTec AG Innovative Ceramic EngineeringInventors: Rainer Bindig, Hans-Jurgen Schreiner
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Publication number: 20040184250Abstract: A multi-chips stacked package mainly comprises a substrate, a first lower chip, a second lower chip, an upper chip and a carrier. The substrate has an upper surface, and the first lower chip and the second lower chip are disposed on the upper surface of the substrate and electrically connected to the substrate. The carrier is disposed on and electrically connected to the first lower chip and the second lower chip simultaneously, and the upper chip is mounted on the carrier. Moreover, the upper chip is electrically connected to the substrate through the carrier, the first lower chip or the second lower chip.Type: ApplicationFiled: December 30, 2003Publication date: September 23, 2004Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Sung-Fei Wang
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Publication number: 20040183217Abstract: A column tray assembly includes a tray having passages formed therein. The tray is a multifunction tray and is configured to receiving appropriate superstructures which can be selected according to the respective use of the assembly. Superstructures which communicate with the passages are mounted to the tray. The superstructures have gas penetration holes embedded in such way that, when the superstructures are mounted to the tray, the orifices of the gas penetration holes extend in a perpendicular manner in relation to the tray. The tray and the superstructures are formed from the same or different corrosion-resistant materials or combination of materials. The tray may also be provided with smaller holes for the discharge of liquid, into which holes distributor cups, or the like are inserted. These smaller holes may be closed for specific purposes.Type: ApplicationFiled: February 13, 2004Publication date: September 23, 2004Applicant: QVF Engineering GmbHInventor: Gottfried Dichtl
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Publication number: 20040183607Abstract: A modulated Class E oscillator. In one embodiment, the modulated Class E oscillator may achieve high coil currents (about 1 A) and voltages (about 500 V) with low power components. Current may be injected when the oscillating current in the inductor passes through zero. A detector circuit may be used to trigger the current injection at the appropriate instant regardless of changes in the resonant frequency of the system. Its phase can be adjusted to compensate for propagation delays in the drive circuitry, while amplitude modulation is accomplished by switching in additional reactive conductance to increase the current injected into the tank circuit. Frequency modulation is accomplished in an alternate embodiment. The oscillator can also lock to an external reference signal and be phase modulated.Type: ApplicationFiled: March 19, 2004Publication date: September 23, 2004Applicant: Alfred E. Mann Institute for Biomedical Engineering at the University of Southern CalifornInventor: William Henry Moore
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Publication number: 20040183190Abstract: A multi-chips stacked package mainly comprises a substrate, a first lower chip, a second lower chip, an upper chip, and a filled material. The substrate has an upper surface, and the first lower chip and the second lower chip are disposed on the upper surface of the substrate and electrically connected to the substrate. The filled material is disposed in and filled with a gap between the first lower chip and the second lower chip, and the upper chip is mounted on the first lower chip, the second lower chip and the top of the filled material. Moreover, the upper chip is electrically connected to the substrate through electrically conductive wires.Type: ApplicationFiled: December 30, 2003Publication date: September 23, 2004Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Sung-Fei Wang
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Publication number: 20040184894Abstract: A cutting tool insert having a controlled contact clearance behind the cutting edge which limits flank wear and allows more coolant near the cutting edge further allowing an increase in surface speed, feed rates, and tool life. The controlled contact clearance surface provides a first wear zone and a second wear zone, the first wear zone generated during operation of the drill insert allows the flank wear distance to grow from zero to the distance from the cutting edge to the controlled contact clearance surface, the second wear zone keeps the flank wear distance substantially constant until the controlled contact clearance surface is substantially worn away.Type: ApplicationFiled: March 21, 2003Publication date: September 23, 2004Applicant: Allied Machine & EngineeringInventor: Rolf H. Kraemer
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Publication number: 20040185666Abstract: A single crystalline aluminum nitride laminated substrate comprising a single crystalline &agr;-Al2O3 substrate such as a sapphire substrate, an aluminum oxynitride layer formed on the substrate and a single crystalline aluminum nitride film as the outermost layer, wherein the dislocation density in the single crystalline aluminum nitride is 108/cm2 or less.Type: ApplicationFiled: March 26, 2004Publication date: September 23, 2004Applicant: The Circle for the promotion of Science and EngineeringInventors: Hiroyuki Fukuyama, Kazuhiro Nagata, Wataru Nakao
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Publication number: 20040183180Abstract: A multi-chips stacked package mainly comprises a substrate, a lower chip, an upper chip and a supporter. The substrate has an upper surface, and the upper chip is disposed on the upper surface of the substrate and electrically connected to the substrate. The supporter has a carrying portion and at least a supporting portion connecting to the carrying portion and disposing on the substrate. In such a manner, the carrying portion covers the lower chip. Besides, the upper chip is disposed on the carrying portion of the supporter and electrically connected to the substrate.Type: ApplicationFiled: December 30, 2003Publication date: September 23, 2004Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chih-Ming Chung, Sung-Fei Wang
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Publication number: 20040182297Abstract: A system and method for mating risers or umbilicals extending vertically or near vertically from the ocean floor to a floating offshore system such as a TLP or semi-submersible platform. The risers or umbilicals are suspended vertically above the vessel's keel and are supported laterally near the platform's keel by keel guides or riser receptacles positioned along the submerged perimeter of the vessel's hull, or within the hull by production riser slots disposed in the bottom of the hull. The keel guides or production riser slots each receive a keel joint assembly which laterally supports a riser or umbilical passing therein while providing a bearing surface for free vertical movement of the riser.Type: ApplicationFiled: February 27, 2004Publication date: September 23, 2004Applicants: Modec International, L.L.P., Sea Engineering Associates, Inc.Inventors: Pieter G. Wybro, Shukai Wu
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Patent number: 6793364Abstract: A non-lethal method and devices for dispersing nuisance birds from a preselected area. Such nuisance birds disrupt many activities such as the steady flow of safely moving aircraft on runways and adjacent thereto, growing crops on farmland, playing golf and the use of the interior of large open buildings. The present method utilizes a series of bright light sources that are positioned adjacent the area from which the birds are to be dispersed. The light sources are activated to produce one or more beams of bright light that are moved in such a manner to produce a pattern of bright light in the vicinity of the birds to be dispersed. This action causes the birds to become sufficiently startled and disoriented so as to disperse these nuisance birds from the area to be cleared.Type: GrantFiled: June 20, 2002Date of Patent: September 21, 2004Assignee: Science & Engineering Associates, Inc.Inventors: Eric J. Cramer, Michael D. Tocci
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Patent number: 6795746Abstract: The internet bonding diagram system comprises a processing unit to process the information send by a user via a network. A blank lead frame/substrate database is coupled to the processing unit to store lead frame information. A job database is coupled to the processing unit to store information forwarded by a potential client, wherein the job database includes buyer satisfaction data provided by said user. A bonding diagram generator is coupled to the processing unit to generate a layout of bonding diagram in accordance with the information provided by the user. A forwarding module is responsive to the bonding diagram generator to forward the layout of bonding diagram to the user.Type: GrantFiled: March 22, 2001Date of Patent: September 21, 2004Assignee: Advanced Semiconductor Engineering, Inc.Inventors: Chun-Min Chuang, I-Liang Lin, Chun-Kuang Lin, Yung-I Yeh
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Patent number: 6795013Abstract: An antenna base, a control circuit section, and a high-frequency circuit section are enclosed in an inner space defined by a housing and a radome. Inside this inner space, the control circuit section and the high-frequency circuit section are surrounded by the antenna base and the housing. A circuit GND common to the control circuit section and the high-frequency circuit section is electrically connected to the antenna base and the housing, and it is connected to a body GND through only capacitive impedance.Type: GrantFiled: August 22, 2003Date of Patent: September 21, 2004Assignees: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.Inventors: Mitsushige Suzuki, Kazuaki Takano, Terumi Nakazawa, Shirou Oouchi, Kazuto Nakamura
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Patent number: 6794590Abstract: A foil sensor mat includes a plurality of active regions which are interconnected by flexible connection lines. The sensor mat further includes two substantially elastic foil layers arranged at a certain distance from one another by a spacer. The spacer has a plurality recesses and each of the active regions are arranged in one of the recesses of the spacer. The foil sensor also includes an additional flexible protective covering of a waterproof material.Type: GrantFiled: November 4, 2002Date of Patent: September 21, 2004Assignee: I.E.E. International Electronics & Engineering S.a.r.l.Inventor: Laurent Federspiel
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Patent number: 6793198Abstract: A valve plug design is disclosed that uses a plug head band and a retaining ring to restrain a valve plug head to a valve plug stem. This invention is specifically directed to providing valve plugs where the plug head material is different and distinct from the plug stem material and where each material is selected to optimize its performance. Moreover, this invention is provided with a means for fixing and removing the plug head to and from the plug stem that can easily be worked in the field without special purpose manufacturing equipment, thereby making the maintenance, repair and replacement of plug head easier for users. This valve plug design subjects the plug head to reduced stresses thereby enhances the operating life of the valve and valve plug. This valve plug design provides a shock absorbing, compliance barrier around and/or under the plug head.Type: GrantFiled: February 22, 1999Date of Patent: September 21, 2004Assignee: Caldera Engineering, LLCInventors: Jeffrey C. Robison, Stephen R. Chipman, Craig C. Smith
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Patent number: 6793497Abstract: Three-dimensional models of molecules, including proteins, and molecular model construction kits, including an alpha helix construction kit, a beta sheet construction kit, and a nucleic acid construction kit. The three-dimensional models of molecules include one or more elongated tubular strands representing alpha carbons and the bonds between the alpha carbons. The alpha helix and beta sheet construction kits include amino acid backbone units, hydrogen bond units, and side chain units. The nucleic acid construction kits include base units, hydrogen bond units, sugar units, and phosphate units.Type: GrantFiled: August 17, 2001Date of Patent: September 21, 2004Assignee: Milwaukee School of EngineeringInventors: Timothy M. Herman, Michael H. Patrick, Vito R. Gervasi, Gunnar Vikberg
