Abstract: A membrane assembly is provided. The membrane assembly includes a non-metallic, porous substrate. A graphene oxide membrane is formed over the non-metallic, porous substrate. A chemical linker interface covalently binds the graphene oxide membrane to the non-metallic, porous substrate.

Abstract: A frequency tracking system may use shaft speed and electrical frequency to estimate a frequency of a monitored machine. The frequency tracking system may convert shaft speed to a mechanical frequency and blend the electrical frequency and the mechanical frequency together to determine an estimated frequency. The frequency tracking system may blend the frequencies based on an operating state of the monitored machine and the frequency sensors.

Abstract: A method and system detects failures in nuclear fuel assemblies (600). A water treatment device degasses/removes fission gases from water used in the canister (500) of a vacuum sipping device (30). A sipping procedure then detects a failure in a fuel assembly in the canister. The degassing improves a signal-to-noise ratio of the detector used during the sipping process, and improves the failure detection sensitivity of the system. Additionally and/or alternatively, gas may be recirculated through the canister water before the vacuum is applied so that fission gas concentration in the recirculating gas reaches a baseline equilibrium with the canister water. The vacuum is thereafter applied and the sipping procedure proceeds such that an increase in detected radioactivity over the baseline equilibrium indicates a leak in the fuel assembly.

Abstract: The present disclosure relates to digital microfluidic systems. Particularly, aspects are directed to a digital microfluidic system that includes a droplet chip having a substrate, a plurality of electrodes and corresponding plurality of conducting vias or embedded conductive posts formed in the substrate, and a dielectric layer formed over the plurality of electrodes; and a control chip having a substrate, a plurality of transistors and corresponding wiring layers formed in the substrate, and a plurality of contacts formed over the plurality of transistors. Each of the plurality of contacts is electrically connected to a corresponding transistor of the plurality of transistors, and one or more of the plurality of contacts is removably connected to one or more of the plurality of conducting vias or embedded conductive posts such that one or more of the plurality of transistors are electrically connected to one or more of the plurality of electrodes.

Abstract: A semiconductor device package and a method for manufacturing the semiconductor device package are provided. The semiconductor device package includes a first substrate, a second substrate and an interconnection. The second substrate is arranged above the first substrate and has an opening. The interconnection passes through the opening and connects to the first substrate and the second substrate.

Abstract: Systems and methods for detecting an anomaly in a power semiconductor device are disclosed. A system includes a server computing device and one or more local components communicatively coupled to the server computing device. Each local component includes sensors positioned adjacent to the power semiconductor device for sensing properties thereof. Each local component receives data corresponding to one or more sensed properties of the power semiconductor device from the sensors and transmits the data to the server computing device. The server computing device utilizes the data, via a machine learning algorithm, to generate a set of eigenvalues and associated eigenvectors and select a selected set of eigenvalues and associated eigenvectors. Each local component conducts a statistical analysis of the selected set of eigenvalues and associated eigenvectors to determine that the data is indicative of the anomaly.

Abstract: A semiconductor device package includes a magnetically permeable layer having a top surface and a bottom surface opposite to the top surface. The semiconductor device package further includes a first conductive element in the magnetically permeable layer. The semiconductor device package further includes a first conductive via extending from the top surface of the magnetically permeable layer into the magnetically permeable layer to be electrically connected to the first conductive element. The first conductive via is separated from the magnetically permeable layer. A method of manufacturing a semiconductor device package is also disclosed.

Abstract: A plastic scintillator includes a polymer matrix, an aliphatic additive present in the polymer matrix in an effective amount to impart fog resistance to the plastic scintillator, and at least one fluorescent dye in the polymer matrix, the dye being effective to provide scintillation upon exposure to radiation. The effective amount of the aliphatic additive is in a range of greater than 0 weight percent up to 5 weight percent relative to the total weight of the plastic scintillator. Moreover, the aliphatic additive has a structure comprising up to 300 repeat units.

Abstract: An apparatus and methods are provided for a throttle body spacer that improves the performance of an internal combustion engine. The throttle body spacer comprises a body that includes an airflow opening for conducting airflow from a throttle body into an intake manifold. A spiral is disposed along a sidewall of the airflow opening and configured for swirling the airflow. The spiral comprises a helical shape disposed around a circumference of the sidewall and extends from an initial bore near a first contact surface of the body to a second contact surface. The helical shape includes a diameter that increases as the spiral extends toward the second contact surface, giving the body a sidewall taper angle that contributes to an increase in power output of the engine. A sawtooth cross-sectional shape of the spiral causes the airflow to swirl so as to improve atomization of an air-fuel mixture entering engine.

Abstract: An exoskeleton wheelchair system includes a base, one or more wheels coupled to the base, a body support connected to the base comprising: a back support; and one or more leg supports pivotally coupled to the back support, and a gait wheel linked with the one or more leg supports via one or more gait linkages and configured to rotate the one or more leg supports. The one or more leg supports are configured to pivot about a first axis when the back support is in a standing position mode. The back support is maintained at a fixed position relative to a location of the base when the one or more leg supports pivot about the first axis while the back support is in the standing position mode.

Abstract: A semiconductor package structure includes a first semiconductor die having an active surface and a passive surface opposite to the active surface, a conductive element leveled with the first semiconductor die, a first redistribution layer (RDL) being closer to the passive surface than to the active surface, a second RDL being closer to the active surface than to the passive surface, and a second semiconductor die over the second RDL and electrically coupled to the first semiconductor die through the second RDL. A first conductive path is established among the first RDL, the conductive element, the second RDL, and the active surface of the first semiconductor die.

Abstract: A package structure and a method for manufacturing a package structure are provided. The package structure includes a substrate, at least one redistribution structure, at least one electronic component and at least one semiconductor die. The substrate has a first surface and a second surface opposite to the first surface. The at least one redistribution structure is disposed on the first surface of the substrate. The at least one electronic component is disposed on the first surface of the substrate. The at least one semiconductor die is disposed on the at least one redistribution structure and electrically connected to the at least one electronic component through the substrate.

Abstract: A metal film-coated molded resin article includes: a molded article formed of a polybutylene terephthalate-based resin composition and/or a polycarbonate-based resin composition; and a metal film disposed on a surface of the molded article, wherein the resin composition(s) contain(s) a reactive compound and/or a resin having a reactive functional group. A metal film-coated molded resin article includes: a molded article formed of a polybutylene terephthalate-based resin composition; and a metal film disposed on a surface of the molded article, wherein the peel strength of the metal film measured under the adhesion test described in appendix 1 (specifications) of JIS H8630:2006 is ?9.0 N/cm. A metal film-coated molded resin article may include a metal film excellent in adhesion, formed on the surface of the article such as a molded polybutylene terephthalate based-resin article and/or a molded polycarbonate-based resin article using a dry process instead of electroless plating.

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a first electronic component having an active surface and a backside surface opposite to the active surface and a first antenna layer disposed on the backside surface of the first electronic component. The semiconductor device package further includes a first dielectric layer covering the first antenna layer and a second antenna layer disposed over the first antenna layer. The second antenna layer is spaced apart from the first antenna layer by the first dielectric layer. A method of manufacturing a semiconductor device package is also disclosed.

Abstract: A vehicle leveler which includes a first portion with a leading edge and a trailing edge, the trailing edge is disposed further from the driveway than the leading edge. The leveler also includes a second portion with a leading edge and a trailing edge, the leading edge of the second portion is removably attached to the trailing edge of the first portion and the leading edge of the second portion is disposed further from the driveway than the trailing edge of the second portion. The second portion also includes an extension portion. The vehicle leveler has opposing side portions which have a top surface that forms a walkway. The vehicle leveler having a power unit and a hydraulic system that provides power and allows movement of the first portion and second portion.

Abstract: In an optical apparatus, an introduced semiconductor device is heterointegrated on a silicon-based platform containing a silicon-based waveguide. A polymeric waveguide is optically coupled to the introduced semiconductor device and overlies at least a portion of the silicon-based waveguide. The polymeric waveguide is conformed as a multimode interference (MMI) coupler between the introduced semiconductor device and the silicon-based waveguide. At least the polymeric waveguide, and in embodiments, also the silicon-based waveguide, is tapered with a shape that effectuates optical coupling to the silicon-based waveguide.

Abstract: The present disclosure pertains to systems and methods for monitoring electrical arc events in an electric power system. In one embodiment, a system may comprise an arc flash detection (AFD) unit to detect electromagnetic radiation generated by an electrical arc event, a primary protection relay to generate measurements of an electric current, and an integrator. In various embodiments, the integrator may comprise a communication port to receive the detection of the electrical arc event and the measurements of the electric current. The integrator may also comprise a processing subsystem to validate the detection of the electrical arc and generate protective actions to interrupt the flow of the current to the electrical arc event.

Abstract: Passively controlled acoustic metamaterials allow transmission of low amplitude acoustic (sound) waves having a resonance frequency and reflect waves having a substantially different frequency. Such materials also reflect waves having the resonance frequency when those waves have an amplitude exceeding a threshold. High amplitude resonance waves cause a resonance membrane contained in unit cells of the metamaterial to contact a rigid structure that is positioned at a longitudinal constraint distance from the resonance membrane in each unit cell. Such contact changes the resonance frequency of the membrane, thereby causing reflection of high amplitude waves. Actively controlled acoustic metamaterials include a ferromagnetic layer on the membrane and an electromagnetic positioned in each unit cell. Activation of the electromagnetic displaces the membrane and thereby shifts the resonance frequency of the membrane, on demand.

Abstract: A nozzle for dispensing fluid includes a probe slidably disposed in a main body. The probe has a probe body defining a check sealing surface and a check void. A check assembly is at least partially disposed in the check void, and includes a check configured to move relative to the main body and the probe body. A spring is configured to bias the check to sealingly engage the check against the check sealing surface of the probe body.

Abstract: A cam having at least two part cams are arranged axially behind one another along a longitudinal axis includes an undercut between the cam parts. The part cams have running faces which lie radially on the outside of the part cams and have different variable running face contours. The undercut has a profile with a variable contour which is dependent in each case on that adjacent running face contour which is at a smaller radial spacing from the longitudinal axis than the other running face contour.