Patents Assigned to Engineering
  • Patent number: 11028318
    Abstract: Proppant compositions for use in hydraulic fracturing and methods of using same are disclosed herein. The proppant compositions include a plurality of proppant particulates and at least one particulate of the plurality of proppant particulates containing at least one tracer, wherein the at least one tracer separates from the at least one particulate located inside a fracture of a subterranean formation after a period of time.
    Type: Grant
    Filed: September 18, 2018
    Date of Patent: June 8, 2021
    Assignees: National Technology & Engineering Solutions of Sandia, LLC, CARBO Ceramics Inc., UNM Rainforest Innovations
    Inventors: Chad Cannan, Terrence Palisch, Richard A. Kemp, Timothy J. Boyle, Bernadette A. Hernandez-Sanchez, James E. Miller
  • Patent number: 11029140
    Abstract: The subject invention reveals a distance measuring device comprising: a sensing module, a target module, and an evaluating module, wherein the sensing module and the target module are mountable so as to execute a movement with respect to each other along a movement trajectory, wherein the target module comprises a magnetic field generating element having a magnetic pole axis, wherein the sensing module comprises a first magnetic field sensing array being arranged distant to the movement trajectory. The sensing module and the target module can advantageously be situated within the pressurizable chamber of an air spring which is defined by (contained within) a first mounting plate, a second mounting plate, and a flexible member of the air spring.
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: June 8, 2021
    Assignee: Infinity Engineered Products, LLC
    Inventor: Lutz May
  • Patent number: 11028694
    Abstract: An opposed-piston engine includes an engine block, at least two intake valves, and at least two exhaust valves. The engine block includes a first center section and a second center section. The first center section defines a first cylinder half bore having a first longitudinal axis and a first open end. The second center section defines a second cylinder half bore having a second longitudinal axis and a second open end. The second longitudinal axis is offset from the first longitudinal axis. The first and second open ends overlap to form and opening therebetween that places the first and second cylinder half bores in fluid communication with one another to form a single cylinder. The intake valves are arranged at the first open end of the first cylinder half bore. The exhaust valves are arranged at the second open end of the second cylinder half bore.
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: June 8, 2021
    Assignee: AVL Powertrain Engineering, Inc.
    Inventors: Vasile Frasinel, Jennifer Weiche
  • Patent number: 11032390
    Abstract: Techniques are described for managing the generation, style, and/or distribution of digital contact cards. An organization may access a card management platform and upload style information for digital contact card(s). Style information may include an arrangement and/or layout of the card(s), an organization name and/or logo to be included on the card(s), the font, color, size, or other characteristics of the text on the card(s), and so forth. A user may access the platform to request the distribution of a digital contact card to recipient(s). In response to the request, the platform may generate a digital contact card for the user based on the previously specified style information, and distribute card(s) to the specified recipient(s). Techniques are also described for determining positions of various mobile devices (and associated users) in a room or other area, and presenting received contact card information in a user interface according to the determined positions.
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: June 8, 2021
    Assignee: Altair Engineering, Inc.
    Inventors: James R. Scapa, Srikanth Mahalingam
  • Patent number: 11028249
    Abstract: Methods and compositions are provided for synthesizing ionic liquids from lignin. Methods and compositions are also provided for treating lignin with ionic liquids.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: June 8, 2021
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Tanmoy Dutta, Blake Simmons, Seema Singh
  • Patent number: 11028494
    Abstract: The invention relates to nonferrous metallurgy, in particular to the electrolytic production of aluminum, namely to the devices for feeding electrolytic cells, and can be used to feed alumina, aluminum fluoride, crushed electrolyte to electrolytic cells for producing aluminum. A device for feeding an electrolytic cell for producing aluminum comprises a hopper, a metering chamber with loading windows located around a perimeter of an upper part of the metering chamber above the hopper base, a valve stem with a pneumatic actuator, an upper locking element rigidly fixed to the valve stem at the upper part of the metering chamber, wherein the upper locking element is positioned between upper and lower edges of loading windows, when the stem is in an upper position, and a lower locking element is mounted on an end of the valve stem.
    Type: Grant
    Filed: May 5, 2015
    Date of Patent: June 8, 2021
    Assignee: United Company RUSAL Engineering and Technology Centre LLC
    Inventors: Vladimir Petrovich Batorshin, Aleksandr Olegovich Gusev, Vladimir Viktorovich Yurkov
  • Patent number: 11029235
    Abstract: A tire testing assembly adapted to provide precise displacements and simulate slow rate conditions, the tire testing assembly including: a support structure adapted to be coupled to a tire under test; a ground plane adapted to contact the tire under test and simulate a ground or road surface; and a lateral translation mechanism movably coupled between the support structure and the tire under test and adapted to translate the tire under test laterally relative to the ground plane. The tire testing assembly also includes a steering frame pivotably coupled between the support structure and the tire under test and adapted to pivot the tire under test about a steer axis of rotation relative to the ground plane. The tire testing assembly further includes a longitudinal translation mechanism movably coupled between the support structure and the tire under test and adapted to translate the tire under test longitudinally relative to the ground plane.
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: June 8, 2021
    Assignee: Link Engineering Company
    Inventor: James F. Cuttino
  • Patent number: 11030818
    Abstract: Systems and methods for presenting virtual-reality information in a vehicular environment are disclosed herein. One embodiment receives, at a first vehicle, a set of presentation attributes for a second vehicle that is in an external environment of the first vehicle, the set of presentation attributes for the second vehicle corresponding to a virtual vehicle that is different from the second vehicle and within a same vehicle category as the second vehicle; and presents to an occupant of the first vehicle, in a virtual-reality space, the second vehicle in accordance with the received set of presentation attributes for the second vehicle while the second vehicle is visible from the first vehicle in the external environment of the first vehicle.
    Type: Grant
    Filed: November 19, 2019
    Date of Patent: June 8, 2021
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Timothy Wang, Roger Akira Kyle, Bryan E. Yamasaki
  • Patent number: 11027385
    Abstract: A device for mechanically processing a workpiece is provided. The device includes a rotating device and a holding adapter which are mechanically intercoupled such that the rotating device generates a rotation of the holding adapter about a rotation axis, while the holding adapter holds a clamping part for the mechanical treatment of the workpiece such that the holding adapter rotation axis and a longitudinal axis of the clamping part enclose an angle of more than zero degrees.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: June 8, 2021
    Assignee: Neumayer Tekfor Engineering GmbH
    Inventors: Niels Vogel, Daniel Aschenbrenner, Andreas Penner, Steffen Trinter
  • Patent number: 11030361
    Abstract: An automated modelling system for automatically and quickly creating computer-aided-engineering model of body in white structures such as members, braces, and joints based on limited inputs from a user. The automated modelling system generally includes a computer system which receives various inputs from the user, including but not limited to trajectories, axis along height, any base components, height, width, angle, size, radius, thickness, and the like. Using these inputs, the computer system will automatically create the desired elements, such as members, braces, or joints, based on user inputs. The computer system may also adjust existing elements, mesh elements, and parameterize elements based on user inputs received via an interface displayed on the computer system.
    Type: Grant
    Filed: October 29, 2019
    Date of Patent: June 8, 2021
    Assignee: Detroit Engineered Products, Inc.
    Inventors: Radhakrishnan Mariappasamy, Raymond E. Chaney
  • Patent number: 11028878
    Abstract: The present application discloses a bearing structural member, a support, a joint assembly and a tube section assembly, wherein the maximum counter force provided by the bearing structural member under an external load is an own designed threshold value, namely when the external load is greater than the designed threshold value of the bearing structural member, the bearing structural member deforms, and provides a counter force equal to the designed threshold value; the support includes at least one bearing structural member; and the joint assembly and the tube section assembly are both equipped with the support. When the external load is not high and is less than the designed threshold value, the bearing structural member may effectively suppress the deformation just like a rigid structural member; when the external load exceeds the designed threshold value, the bearing structural member may deform, and provide a stable counter supporting force less than the external load.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: June 8, 2021
    Assignees: China Communications Construction Co. Ltd., CCCC Highway Consultants Co. Ltd., CCCC Wuhan Harbour Engineering Design & Research Co., Ltd., Shanghai Zhenhua Heavy Industries Co., Ltd.
    Inventors: Ming Lin, Wei Lin, Xiaodong Liu, Kexin Liu, Haiqing Yin, Liuqing Tu, Jibing Gao, Yaping Liu, Weibin Chen, Yiyuan Wu, Huawen Wang, Yu Liu
  • Patent number: 11031317
    Abstract: Direct-bonded metal substrates of electronic assemblies are disclosed. For example, the direct-bonded metal substrate includes a ceramic substrate and a first conductive layer. The first conductive layer is bonded to a first surface of the ceramic substrate, and the first conductive layer includes a first core and a first encapsulating layer that encapsulates the first core. The first core includes a phase change material having a first melting temperature, the first encapsulating layer includes an encapsulating material having a second melting temperature, and the second temperature is greater than the first melting temperature.
    Type: Grant
    Filed: October 9, 2019
    Date of Patent: June 8, 2021
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Shailesh N. Joshi, Yanghe Liu
  • Publication number: 20210162510
    Abstract: Provided is a coated cutting tool having a base material side single layer portion and a laminated portion provided as a hard coating in order from a base material side. The base material side single layer portion is formed of a nitride-based hard coating in which a proportion of Al is highest among metal (including metalloid) elements, a sum of Al and Cr in a content ratio (atomic ratio) is 0.9 or more, and at least B is contained. In the laminated portion, a nitride-based a layer in which a proportion of Ti is highest among metal (including metalloid) elements and at least B is contained, and a nitride-based b layer in which a proportion of Al is highest among metal (including metalloid) elements and at least Cr and B are contained are alternately laminated.
    Type: Application
    Filed: March 27, 2019
    Publication date: June 3, 2021
    Applicant: MOLDINO Tool Engineering, Ltd.
    Inventor: Ryoutarou Fuwa
  • Publication number: 20210167053
    Abstract: A semiconductor device package includes a first semiconductor device having a first surface, an interconnection element having a surface substantially coplanar with the first surface of the first semiconductor device, a first encapsulant encapsulating the first semiconductor device and the interconnection element, and a second semiconductor device disposed on and across the first semiconductor device and the interconnection element.
    Type: Application
    Filed: February 8, 2021
    Publication date: June 3, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chang-Yu LIN, Chi-Han CHEN, Chieh-Chen FU
  • Publication number: 20210168327
    Abstract: Existence of instrumentation for automatic video recording creates an excess capacity of video recording for those who own automatic video recorders. Others may want to utilize this excess capacity to record their activities thus there is a need for a system that helps match those who would like to utilize the excess capacity with those who have such capacity. Such excess capacity is matched with demand to use such excess capacity by creating a network of automatic video recording units and tags that are associated with people who want to be recorded.
    Type: Application
    Filed: February 16, 2021
    Publication date: June 3, 2021
    Applicant: H4 Engineering, Inc.
    Inventors: Christopher T. Boyle, Konstantin Othmer, Gordon Jason Glover, Alexander G. Sammons
  • Publication number: 20210161275
    Abstract: A multi-purpose touch free applicator with reservoir is provided herein. The applicator includes at least one reservoir, a first film, at least one second film contained wholly within the reservoir and a pad. An enclosure defines an inner volume of the at least one reservoir and the enclosure has an opening at a proximal end of the at least one reservoir, wherein the boundary of the opening defines a perimeter of the reservoir. Further, the first film is fixedly attached to the perimeter of the enclosure and the first film has at least one frangible aperture within the perimeter of the reservoir. Moreover, the at least one second film divides the inner volume of the reservoir creating a plurality of distinct volumes within the inner volume of the reservoir. Finally, the pad is fixedly attached to the reservoir at the perimeter of the reservoir.
    Type: Application
    Filed: December 2, 2019
    Publication date: June 3, 2021
    Applicant: CaseMed Engineering, LLC
    Inventor: SAMANGOOIE Casey
  • Publication number: 20210166987
    Abstract: A semiconductor package structure includes a semiconductor die, at least one wiring structure, a metal support, a passive element, a plurality of signal vias, and a plurality of thermal structures. The semiconductor die has an active surface. The at least one wiring structure is electrically connected to the active surface of the semiconductor die. The metal support is used for supporting the semiconductor die. The passive element is electrically connected to the semiconductor die. The signal vias are electrically connecting the passive element and the semiconductor die. The thermal structures are connected to the passive element, and the thermal structures are disposed on a periphery of the at least one wiring structure.
    Type: Application
    Filed: February 11, 2021
    Publication date: June 3, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ian HU, Cheng-Yu TSAI
  • Publication number: 20210167856
    Abstract: A system including optical devices is provided. The system includes a first substrate and a first device for optical communication. The first device has a first surface, a second surface opposite to the first surface, and a first side contiguous with the first surface and the second surface. Moreover, the first side is smaller than one of the first surface and the second surface in terms of area. The first device is attached at the first side thereof to the first substrate.
    Type: Application
    Filed: January 8, 2021
    Publication date: June 3, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chang-Yu LIN, Cheng-Yuan KUNG, Hung-Yi LIN
  • Publication number: 20210166198
    Abstract: To monitor lubrication maintenance of an automotive vehicle a signal is generated by a sensor that is indicative of exposure of a lubrication system access port through which automotive lubricant is accessed. Performance of a lubrication maintenance operation is determined from the signal and lubrication maintenance information is transmitted externally to the vehicle, where the lubrication maintenance information includes an indication of the performance of the lubrication maintenance operation.
    Type: Application
    Filed: December 2, 2019
    Publication date: June 3, 2021
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventor: William Daryl CAMMACK
  • Publication number: 20210167016
    Abstract: An electronic device package includes a substrate, a first semiconductor die, a second semiconductor die and an encapsulant. The substrate includes a first surface, and a second surface opposite to the first surface. The substrate defines a cavity recessed from the first surface. The first semiconductor die is disposed in the cavity. The second semiconductor die is disposed over and electrically connected to the first semiconductor die. The encapsulant is disposed in the cavity of the substrate. The encapsulant encapsulates a first sidewall of the first semiconductor die, and exposes a second sidewall of the first semiconductor die.
    Type: Application
    Filed: December 3, 2019
    Publication date: June 3, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Mei-Ju LU, Jr-Wei LIN