Abstract: A window assembly heat transfer system is disclosed in which a window member has a selected transparency to monitored or sensed light wavelengths. One or more passages are provided in the window member for flowing a single-phase or two-phase heat transfer fluid, the passages being optically non-transparent to the monitored or sensed light wavelengths. A mechanism allows either evaporation or condensation of the fluid and/or balancing of a flow of the fluid within the passages. In one embodiment, the window assembly can be made by producing passages in a top surface of a first single plate, optionally producing passages in a bottom surface of a second single plate and bonding the top surface of the first plate to a bottom surface of a second single plate to form the window member with the passage or passages. In another embodiment, the window assembly can be made by providing a core around which the window member material is grown and thereafter removing the core to produce the passage or passages.

Abstract: An insulation system for a vehicle includes a vehicle component that operates at an operating temperature that is higher than an initial temperature, an insulation member thermally coupled to the vehicle component and thermally coupled to an ambient medium, the insulation member including an enclosed chamber, the enclosed chamber including a chamber wall that defines an interior volume, and carbon dioxide positioned within the interior volume of the enclosed chamber, where the chamber wall prevents flow of the carbon dioxide out of the enclosed chamber.

Abstract: A fluid coupling includes a body, a poppet valve assembly, a handle shaft assembly, and a retention member. The body has a fluid conduit, a through-hole extending through a sidewall, and one or more openings that extend between an external surface of the body and an interior of the through hole. The poppet valve assembly is disposed within the fluid conduit and is selectively movable between an open position and a closed position. The handle shaft assembly extends through the through-hole and into the fluid conduit and is interconnected with the poppet valve assembly such that the handle shaft assembly can be actuated to move the poppet valve assembly between the open position and the closed position. The retention member is insertable through the one or more openings and into the through-hole to interact with the handle shaft assembly to selectively hold the handle shaft assembly in the body.

Abstract: A side member (10) for a vehicle seat (1), in particular motor vehicle seat, includes a metallic frame section (12). The frame section (12) has an exposed supporting section (14) for supporting a padding of the side member (10), wherein the supporting section (14) is flexurally elastic and, in a normal position, protrudes from the frame section (12) in order to support the padding, wherein at least one electrically controllable actuator (20) is provided, which, by generating a force, transfers the supporting section (14) from the normal position into a retracted position. The invention furthermore relates to a vehicle seat (1) having at least one side member (10).

Abstract: A dehydration device removes moisture from a process gas compressed by a compressor, and includes a contactor that causes a dehydration solvent to absorb the moisture, a still column that separates the moisture from the dehydration solvent, a carrying line that carries the dehydration solvent from the contactor to the still column, a dehydration solvent conveying pump, a bypass line that couples the carrying lines upstream and downstream of the dehydration solvent conveying pump, a first on-off valve disposed in the bypass line, and a control device. In a case where the pressure detected by a pressure sensor is lower than a first predetermined pressure, the control device closes the first on-off valve and causes the conveying pump to operate, whereas in a case where the pressure detected by the pressure sensor is equal to or higher than the first predetermined pressure, the control device opens the first on-off valve and causes the conveying pump to stop.

Abstract: A method of forming a textured surface layer along a substrate that includes disposing a plurality of polymer spheres on a surface of the metal substrate, and electroplating the metal substrate at a current density to deposit a metal layer along a body of each of the plurality of polymer spheres disposed on the surface of the metal substrate. The metal layer does not extend above a top surface of the plurality of polymer spheres. The method further includes removing the plurality of polymer spheres from the metal layer to form the textured surface defined by a size and shape of the plurality of polymer spheres.

Abstract: A lead frame includes a die paddle, a plurality of leads, at least one connector and a bonding layer. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle and an outer lead portion opposite to the inner lead portion. The connector is connected to the die paddle and the inner lead portions of the leads. The bonding layer is disposed on a lower surface of the die paddle and a lower surface of each of the outer lead portions.

Abstract: A semiconductor package may include a first substrate and a second substrate, a redistribution layer (RDL), a first conductive via and a second conductive via. The first substrate has a first surface and a second surface opposite to the first surface. The second substrate has a first surface and a second surface opposite to the first surface. The RDL is disposed on the first surface of the first substrate and the first surface of the second substrate. The first conductive via passes through the RDL and is electrically connected to the first substrate. The second conductive via passes through the RDL and is electrically connected to the second substrate.

Abstract: A semiconductor substrate includes a substrate and a plurality of electronic components. The substrate defines a cavity. A total number of the electronic components is N, the electronic components are divided into M groups, M and N are positive integers, and M is smaller than N. The electronic components in each group are encapsulated by a first insulation layer to form a respective component module. Each of the component modules is disposed in the cavity. A second insulation layer fills the cavity and encapsulates the component modules.

Abstract: Systems and methods described herein may be used to search for a minimum load overshed in a power system. For example, a control system includes memory and a processor operatively coupled to the memory. The processor may obtain an amount of power consumed by each load in a total set of loads in a microgrid. The processor may detect a difference between the amount of power generated and the amount of power consumed. The processor may select a subset of loads to shed from the total set of loads by searching a tree of potential load shed amounts to substantially balance the amount of power generated with the amount of power consumed. The processor may send one or more signals to one or more electronic devices to cause the selected subset of loads to be shed.

Abstract: A package structure includes a wiring structure, a first electronic device, a second electronic device, a protection material and a reinforcement structure. The first electronic device and the second electronic device are electrically connected to the wiring structure. The protection material is disposed between the first electronic device and the wiring structure and between the second electronic device and the wiring structure. The reinforcement structure is disposed on and contacts the first electronic device and the second electronic device. The reinforcement structure contacts the protection material.

Abstract: A device structure includes a first electronic structure and a plurality of first electric contacts. The first electronic structure has a surface and a center. The first electric contacts are exposed from the surface. The first electric contacts are spaced by a pitch that increases with increasing distance from the center.

Abstract: A transformer system including a transformer including a set of wye windings, a three-phase current transformer, a neutral-current transformer, and a controller. The three-phase current transformer outputs a first signal indicative of a three-phase current conducting through the set of wye windings and the three-phase current transformer. The neutral-current transformer couples the current flowing from the ground to the neutral node of the transformer, and outputs a second signal indicative of a neutral current conducting from the ground node to the neutral node of the transformer. The controller receives the first signal and the second signal, determines whether an external ground fault condition or an internal ground fault condition is present based on the three-phase current and the neutral current, and determines whether a wiring error is present for the three-phase current transformer or the neutral-current transformer based on the three-phase current and the neutral current.

Abstract: A method for forming an assembly is provided. The method includes depositing a colloidal template onto a substrate, wherein the colloidal template is porous, depositing a metal layer onto and within the colloidal template, depositing a cap structure onto the colloidal template opposite of the substrate, and removing the colloidal template from between the substrate and the cap structure to form a metal inverse opal structure disposed therebetween. The method continues by depositing an electrical isolation layer in contact with the cap structure opposite the metal inverse opal structure, and attaching the electrical isolation layer to a cooling device.

Abstract: Embodiments of the disclosure relate to apparatuses for enhanced thermal management of a planar inductor assembly. In one embodiment, a cooling package for an inductor assembly includes a cold plate and a heat-spreading bracket mechanically coupled to the cold plate at a first end of the heat-spreading bracket. The cold plate has a slotted recess for mounting a first inductor core along a first end thereof. The heat-spreading bracket is configured to apply a clamping force to a second inductor core at a second end opposite to the first end of the heat-spreading bracket.

Abstract: A system for detecting and mapping off-road obstacles within a vicinity of a vehicle includes one or more processors, one or more location sensors, a display, one or more off-road obstacle detection sensors, and one or more memory modules. The one or more location sensors output a location signal indicative of the location of the vehicle. The display displays map data of the location of the vehicle. The one or more off-road obstacle detection sensors output an obstacle signal indicative of a location of an obstacle. The one or more memory modules store logic that when executed by the one or more processors cause the system to determine whether the vehicle is off-road, detect the obstacle in the vicinity of the vehicle in response to determining that the vehicle is off-road, and generate and display a map indicator on the display corresponding to the location of the obstacle.

Abstract: A capacitor structure includes a first metal layer, a first metal oxide layer, a second metal oxide layer, a first conductive member, a second conductive member and a metal composite structure. The first metal layer has a first surface and a second surface opposite the first surface. The first metal oxide layer is formed on the first surface of the first metal layer. The second metal oxide layer is formed on the second surface of the first metal layer. The first conductive member penetrates through the capacitor structure and is electrically isolated from the first metal layer. The second conductive member is electrically connected to the first metal layer. The metal composite structure is disposed between the second conductive member and the first metal layer.

Abstract: A semiconductor device package includes an electronic component, a first passivation layer having an inner surface surrounding the electronic component, and a conductive layer disposed on the inner surface of the first passivation layer. The electronic component has a first surface, a second surface opposite the first surface, and a lateral surface extended between the first surface and the second surface. The conductive layer has a relatively rough surface. A method of manufacturing a semiconductor device package is also disclosed.

Abstract: An independent self-climbing form system may be assembled at a work site to build, maintain, or repair vertical structures. The independent self-climbing form system may include a plurality of support towers. Additionally, at least two trusses may be connected to the plurality of support towers. The trusses may be spaced apart from each other. Further, one or more platforms may be formed within a perimeter delimited by the at least two trusses. The at least one or more platforms may be configured to extend or retract within the perimeter. Furthermore, screw jacks may be disposed at each connection point of the at least two trusses on the plurality of support towers. The screw jacks may be configured to vertically move the at least two trusses up and down the plurality of support towers.

Abstract: A semiconductor device package includes a substrate and a monolithic encapsulant. The substrate has a first surface, a second surface opposite to the first surface and a plurality of lateral surfaces extending between the first surface and the second surface. The substrate defines a first opening and a second opening that extend between the first surface and the second surface and respectively expose the plurality of lateral surfaces. The monolithic encapsulant includes a first portion disposed on the first surface of the substrate, a second portion disposed on the second surface of the substrate and a third portion disposed within the first opening and the second opening.