Abstract: A wiring structure includes an upper conductive structure, a lower conductive structure, a plurality of metallic structures and an intermediate layer. The upper conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The lower conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The metallic structures are disposed between the upper conductive structure and the lower conductive structure, and electrically connecting the upper conductive structure and the lower conductive structure. The intermediate layer is disposed between the upper conductive structure and the lower conductive structure, and covers the metallic structures.

Abstract: A semiconductor device package includes a first circuit layer, a second circuit layer, a first semiconductor die and a second semiconductor die. The first circuit layer includes a first surface and a second surface opposite to the first surface. The second circuit layer is disposed on the first surface of the first circuit layer. The first semiconductor die is disposed on the first circuit layer and the second circuit layer, and electrically connected to the first circuit layer and the second circuit layer. The second semiconductor die is disposed on the second circuit layer, and electrically connected to the second circuit layer.

Abstract: The present invention belongs to the technical field of landscape garden engineering, and specifically discloses a salt-isolated rain garden structure. The salt-isolated rain garden structure includes a depression surrounded by side slopes, where a 10 cm thick drainage layer, a 10-30 cm thick filler layer, a 5 cm thick transition layer, a 20-30 cm thick planting layer, a 0.2-0.5 cm thick mulch layer and a 15-20 cm thick ponding layer are stacked in order from the bottom of the depression to up; a salt barrier is disposed between the planting layer and the transition layer and/or between the drainage layer and a saline layer; a vertical overflow pipe and a horizontal drainage pipe are disposed at the bottom of the depression; the overflow pipe and drainage pipe are connected; the salt barrier is filled with river sand, zeolite or ceramsite and is 10-20 cm in thickness.

Abstract: A tape includes at least one tape unit. The tape unit includes a base structure having a first portion and a second portion. The first portion has a first surface and a second surface opposite to the first surface. The second portion protrudes from the second surface of the first portion, and has a third surface opposite to the first surface of the first portion and a lateral surface extending between the second surface and the third surface. An area of the first portion from a top view is greater than an area of the second portion from a top view.

Abstract: A leveling device for leveling a feeder platform relative to a die table of a tablet compression machine to a desired distance, the leveling device comprising a top plate, a bottom plate, and at least three distance sensors; the top plate and the bottom plate are attached and the top plate has a top plate surface and a proximate feeder platform surface; the bottom plate has a die table engaging surface and the at least three adjustable distance sensors are mounted in a non-linear fashion on the proximate feeder platform surface; the die table engaging surface and the proximate feeder surface are essentially flat and are parallel to the each other and the die table engaging surface and the proximate feeder surface are sized such that when mounted on the tablet compression machine the die table engaging surface is parallel and proximate to the die table and the proximate feeder platform surface is approximately parallel and proximate to the feeder platform.

Abstract: A polycarbonate resin composition pellet contains a polycarbonate resin (A), an aromatic compound (B) represented by general formula (1) below, and a phosphorus-based stabilizer (C), the aromatic compound (B) being contained in the pellet in an amount of 0.001% to 1% by mass, the phosphorus-based stabilizer (C) being contained in the pellet in an amount of 0.003% to 0.5% by mass: (where Y is a hydrogen atom or an organic group that does not contain any of nitrogen, sulfur, and halogen elements, when Y is a hydrogen atom, X is an alkyl group or an optionally substituted aryl group, when Y is an organic group, X is an organic group that does not contain any of nitrogen, sulfur, and halogen elements, g is 1 or 2, n is 0 to 5, k is 1 to 4, and k+n is 6 or less.

Abstract: An optical fiber polishing fixture assembly comprises a fixture base and a clamping assembly. The clamping assembly has first and second base portions, a lever, and a biasing member. Each of the first and second base portions has an inner facing side with a slot and an inner facing surface. The slots are adapted to receive bars on opposing sides of a fiber optic connector and cable assembly. The lever has a first end positioned between the inner facing surfaces and a second end extending outward therefrom. The clamping assembly has a locked position, when the first and second base portions are biased toward one another by the biasing member, and an unlocked position, when the lever overcomes a biasing force of the biasing member and separates the first and second base portions.

Abstract: A semiconductor device package includes a first semiconductor device, a first redistribution layer (RDL) structure and a second RDL structure. The first semiconductor device has a first conductive terminal and a second conductive terminal. The first RDL structure covers the first conductive terminal. The second RDL structure covers the second conductive terminal and being separated from the first RDL structure.

Abstract: A wireless earphone comprises a battery, a speaker and a chamber/space. The battery has a first surface, a second surface opposite the first surface, and a third surface extended between the first surface and the second surface. The battery is disconnected from any protecting circuits. The speaker is disposed adjacent to the first surface of the battery. The chamber/space is defined by the battery and the speaker. The chamber/space is devoid of any electronic component.

Abstract: A semiconductor structure and a method of manufacturing the same are provided. The semiconductor structure includes a first semiconductor element and a first bonding structure. The first semiconductor element has a first element top surface and a first element bottom surface opposite to the element top surface. The first bonding structure is disposed adjacent to the element top surface of the first semiconductor element and includes a first electrical connector, a first insulation layer surrounding the first electrical connector, and a first metal layer surrounding the first insulation layer.

Abstract: An optical communication package structure includes a wiring structure, at least one via structure, a redistribution structure, at least one optical device and at least one electrical device. The wiring structure includes a main portion and a conductive structure disposed on an upper surface of the main portion. The main portion defines at least one through hole extending through the main portion. The via structure is disposed in the at least one through hole of the main portion and electrically connected to the conductive structure. The redistribution structure is disposed on a lower surface of the main portion and electrically connected to the via structure. The optical device is disposed adjacent to the upper surface of the main portion and electrically connected to the conductive structure. The electrical device is disposed on and electrically connected to the conductive structure.

Abstract: A household appliance hinge includes a mounting portion and a mounting tab including a cam profile. A door mounting lever is pivotally connected to the mounting tab of the mounting portion. A spring-biased control system is connected to the door mounting lever and includes a spring-biased cam follower system including a cam follower that: (i) engages the cam profile in an engagement position and for all positions of the door mounting lever between the engagement position and a first operative position; and, (ii) separates from the cam profile for all positions of said door mounting lever located between the engagement position and a second operative position. The hinge is self-latching.

Abstract: A package structure includes a plurality of lower elements, a reinforcement structure and an encapsulant. The lower elements are disposed side by side. The reinforcement structure surrounds the lower elements. The encapsulant covers the lower elements and the reinforcement structure. The electrical connectors of the lower elements are exposed from the encapsulant.

Abstract: The invention relates to an auto injector, by which a fixed dose of a medicament can be injected as self-treatment, and by which needle exposure to an accessible position, injection of the medicament and retraction of the needle to an inaccessible position is automatically performed as a continuous sequence, after the auto injector is triggered. The invention provides solutions to improve the functionality of the retraction of the needle and the general experience of the use.

Abstract: A wiring structure includes an upper conductive structure, a lower conductive structure and an intermediate layer. The upper conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The lower conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The intermediate layer is disposed between the upper conductive structure and the lower conductive structure and bonds the upper conductive structure and the lower conductive structure together. The upper conductive structure is electrically connected to the lower conductive structure. The intermediate layer includes a plurality of sub-layers. Each of the sub-layers is formed from a polymeric material. A boundary is formed between two adjacent sub-layers.

Abstract: An absorbent liquid which absorbs at least one of CO2 and H2S from a gas, including a secondary linear monoamine; a tertiary linear monoamine or a sterically hindered primary monoamine; and a secondary cyclic diamine, wherein a concentration of each of the secondary linear monoamine, the tertiary linear monoamine or the sterically hindered primary monoamine; and the secondary cyclic diamine is less than 30% by weight.

Abstract: A method of confirming an identity of a user, including displaying a first visual indicator, where the first visual indicator is flashing at a first frequency to induce a first brainwave activity. The first brainwave activity of the user may be measured by a sensor. The measured first brainwave activity may be compared against a user profile to confirm the identity of the user.

Abstract: A semiconductor device package includes a magnetically permeable layer having a top surface and a bottom surface opposite to the top surface. The semiconductor device package further includes a first conductive element in the magnetically permeable layer. The semiconductor device package further includes a first conductive via extending from the top surface of the magnetically permeable layer into the magnetically permeable layer to be electrically connected to the first conductive element. The first conductive via is separated from the magnetically permeable layer. A method of manufacturing a semiconductor device package is also disclosed.

Abstract: A spray apparatus that includes a stand, a motor secured to the stand, a spray applicator secured to the stand, and a rotatable disc secured to the stand relatively above the spray applicator such that the rotatable disc is positioned within a spray field of the spray applicator. The rotatable disc is coupled to the motor such that the rotatable disc is configured to rotate in response to activation of the motor. The rotatable disc is configured to receive an overspray from the spray field to generate a spray pattern from the spray applicator. The apparatus includes a scraper positioned in fixed engagement with the rotatable disc, where the scraper is configured to remove accumulated overspray from the rotatable disc.

Abstract: A semiconductor device package comprises a first substrate, a first electronic component, an encapsulant, and a feeding structure. The first substrate has a first surface and a second surface opposite the first surface. The first electronic component is disposed on the first surface of the first substrate. The encapsulant encapsulates the first electronic component on the first surface of the first substrate. The feeding structure is disposed on the second surface of the first substrate without covering.