Patents Assigned to Engineering
  • Publication number: 20210013585
    Abstract: A semiconductor device package includes a substrate and an antenna module. The substrate has a first surface and a second surface opposite to the first surface. The antenna module is disposed on the first surface of the substrate with a gap. The antenna module has a support and an antenna layer. The support has a first surface facing away from the substrate and a second surface facing the substrate. The antenna layer is disposed on the first surface of the support. The antenna layer has a first antenna pattern and a first dielectric layer.
    Type: Application
    Filed: July 9, 2019
    Publication date: January 14, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Lin Ho, Chih-Cheng Lee, Chun Chen Chen, Yuanhao Yu
  • Publication number: 20210014958
    Abstract: Embodiments of the disclosure relate to flexible electronic substrates for placement on an external surface of a vehicle motor assembly. In one embodiment, a motor assembly includes a motor comprising an external surface and one or more electronic assemblies positioned on the external surface of the motor. Each electronic assembly includes a metal substrate disposed on the external surface of the motor, a dielectric layer disposed on the metal substrate, a flexible metal base layer disposed on the dielectric layer, a bonding layer disposed on the flexible metal base layer, and one or more electronic devices disposed on the bonding layer. The bonding layer bonds the one or more electronic devices to the flexible metal base layer.
    Type: Application
    Filed: July 11, 2019
    Publication date: January 14, 2021
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventor: Shailesh N. JOSHI
  • Publication number: 20210008937
    Abstract: A cover assembly for a hitch assembly includes a cover and a cover lock assembly. The cover is coupled to the body component for movement between an open position and a closed position. In the open position, the cover permits access to a hitch lock assembly configured to secure a hitch to a hitch receiver and in the closed position, the cover inhibits access to the hitch lock assembly. The cover lock assembly is configured to releasably secure the cover to the hitch receiver when the cover is in the closed position. The cover lock assembly includes a locked configuration and an unlocked configuration. In the locked configuration, the cover is inhibited from moving from the closed position to the open position. In the unlocked configuration, the cover is permitted to move from the closed position to the open position.
    Type: Application
    Filed: July 10, 2019
    Publication date: January 14, 2021
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventor: Todd R. Muck
  • Publication number: 20210013072
    Abstract: The present invention relates to a method and an apparatus for determining the position of a substrate within a closed chamber, wherein the substrate is moved within the chamber by a transport system comprising at least one rotating shaft. A load-converting element is provided adjacent to at least one of the rotating shafts, wherein the load-converting element detects a load acting on the at least one rotating shaft and converts it into an electrical parameter. While no substrate is present on the at least one rotating shaft, a first output signal corresponding to a first value of the electrical parameter is measured. The output signal is then monitored and a presence of the substrate on the at least one rotating shaft is detected when the output signal differs from the first output signal by at least a predetermined amount.
    Type: Application
    Filed: November 30, 2017
    Publication date: January 14, 2021
    Applicants: China Triumph International Engineering Co., Ltd., CTF Solar GmbH
    Inventors: Shou PENG, Michael HARR, Xinjian YIN, Ganhua FU, Christian KRAFT, Stefan RAU, Bastian SIEPCHEN
  • Publication number: 20210013118
    Abstract: A semiconductor package structure includes a package substrate, at least one semiconductor die, a heat dissipating device, at least one electronic device and a heat transmitting structure. The package substrate has a first surface and a second surface opposite to the first surface. The semiconductor die is electrically connected to the first surface of the package substrate. The heat dissipating device is thermally connected to the first surface of the package substrate. The electronic device is electrically connected to the second surface of the package substrate. The electronic device has a first surface and a second surface opposite to the first surface, and the first surface of the electronic device faces the second surface of the package substrate. The heat transmitting structure is disposed adjacent to the second surface of the package substrate, and thermally connected to the electronic device and the heat dissipating device.
    Type: Application
    Filed: July 10, 2019
    Publication date: January 14, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hsin-En Chen, Ian Hu, Chih-Pin Hung
  • Publication number: 20210009211
    Abstract: A vehicle includes a truck bed having a front wall, a tailgate, and a pair of sidewalls that extend between the front wall and the tailgate and an airflow assembly. The airflow assembly includes air inlets, air outlets, and a tubular duct. The air inlet is provided on an exterior surface of each of the pair of sidewalls. The air outlet is provided on an interior surface of each of the pair of sidewalls. At least two air ducts fluidly couple the air inlet and the air outlet on each of the pair of sidewalls. The tubular duct extends in the vehicle lateral direction to couple the air outlets on each of the pair of sidewalls such that air exiting the air outlets enters into the tubular duct and exits the tubular duct to create an air ramp flow path.
    Type: Application
    Filed: July 12, 2019
    Publication date: January 14, 2021
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Paxton S. Williams, Scott Louis Frederick
  • Publication number: 20210013352
    Abstract: Object of the invention is to provide a new thin film device comprising at least one thin film cell, wherein the thin film cell comprises a first electrode, a photoactive layer and a second electrode, wherein the photoactive layer is arranged between the first and the second electrode, wherein at least one additional conductive line is arranged within an active area of the thin film cell and included in the photoactive layer and electrically interconnected with the first electrode and electrically insulated from the second electrode. Furthermore, the invention provides a method of forming a thin film device comprising at least one thin film cell, wherein the thin film cell comprises a first electrode, a photoactive layer and a second electrode and the photoactive layer is arranged between the first and the second electrode.
    Type: Application
    Filed: November 30, 2017
    Publication date: January 14, 2021
    Applicants: China Triumph International Engineering Co., Ltd., CTF Solar GmbH
    Inventors: Shou PENG, Michael HARR, Xinjian YIN, Ganhua FU, Krishnakumar VELAPPAN, Bastian SIEPCHEN
  • Publication number: 20210013163
    Abstract: A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes an antenna zone and a routing zone. The routing zone is disposed on the antenna zone, where the antenna zone includes a first insulation layer and two or more second insulation layer and a thickness of the first insulation layer is different from that of the second insulation layer.
    Type: Application
    Filed: July 10, 2019
    Publication date: January 14, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wen Hung HUANG, Yan Wen CHUNG, Wei Chu SUN
  • Publication number: 20210013126
    Abstract: Embodiments of the disclosure relate to an MIO substrate with integrated jet cooling for electronic modules and a method of forming the same. In one embodiment, a substrate for an electronic module includes a thermal compensation base layer having an MIO structure and a cap layer overgrown on the MIO structure. A plurality of orifices extends through the thermal compensation base layer between an inlet face and an outlet face positioned opposite to the inlet face, defining a plurality of jet paths. A plurality of integrated posts extends outward from the cap layer, wherein each integrated post of the plurality of integrated posts is positioned on the outlet face between each orifice of the plurality of orifices.
    Type: Application
    Filed: July 11, 2019
    Publication date: January 14, 2021
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventor: Shailesh N. JOSHI
  • Publication number: 20210013375
    Abstract: A semiconductor device package includes a carrier, a conductive pillar, an adhesive layer and a package body. The conductive pillar is disposed on the carrier. The conductive pillar has a top surface facing away from the carrier. The adhesive layer is disposed on the top surface of the conductive pillar. The package body is disposed on the carrier. The package body has a top surface facing away from the carrier. The top surface has a first portion and a second portion. The first portion and the second portion of the top surface of the package body are discontinuous.
    Type: Application
    Filed: July 11, 2019
    Publication date: January 14, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Mei-Yi WU
  • Publication number: 20210009047
    Abstract: A pickup truck includes a passenger cabin that includes a rear wall. A truck bed includes a front wall that faces the rear wall of the passenger cabin. A space is provided between the rear wall of the passenger cabin and the front wall of the truck bed. A speaker assembly includes a speaker enclosure mounted externally to the rear wall of the passenger cabin and located between the rear wall of the passenger cabin and the front wall of the truck bed. A speaker extends forward from the speaker enclosure and through an opening in the rear wall of the passenger cabin.
    Type: Application
    Filed: July 10, 2019
    Publication date: January 14, 2021
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Ryan C. Harris, Edgardo Reyes-Crespo
  • Patent number: 10889355
    Abstract: Aquatic structures with adjustable buoyancy constructed in part with a vent valve for a buoyancy control device suitable for divers, where the vent valve may be opened by any combination of over-pressure, manual pressure relief or a powered means, where a force to a valve plug is applied by means of a spring that is constrained to prevent entirely lateral and angular movement but in which movement of the plug in the axis of the seat is unconstrained.
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: January 12, 2021
    Assignee: Marine Depth Control Engineering, LLC
    Inventors: Andrew Craig Sinclair, Christopher Charles Webb
  • Patent number: 10889769
    Abstract: A systems and method for manufacturing a base stock from an ethanol stream are described herein. An example method includes dehydrating an ethanol stream to form an impure ethylene mixture, recovering an ethylene stream from the impure ethylene mixture, and oligomerizing the ethylene stream to form a raw oligomer stream. A heavy olefinic stream is distilled from the raw oligomer stream. The heavy olefinic stream is hydro-processed to form a hydro-processed stream, and the hydro-processed stream is distilled to form the base stock.
    Type: Grant
    Filed: August 15, 2019
    Date of Patent: January 12, 2021
    Assignee: ExxonMobil Research and Engineering Company
    Inventors: Guang Cao, Suzzy C. Ho, Matthew S. Ide, Shifang Luo, William R. Gunther
  • Patent number: 10889356
    Abstract: An offshore structure has an upending device for upending an elongate suppo structure from a substantially horizontal loading position on a deck of the offshore structure to a substantially vertical launch position outboard of the offshore structure. The upending device has a pivot axis situated near a side of the offshore structure for pivoting the upending device between the loading position and the launch position. A first end of the upending device has a connector member for pivotally connecting to the elongate support structure. The connector member in the launch position is in a position outboard from the side of the offshore structure. A second end of the upending device is attached to a pulling device that is located on the deck of the offshore structure. The upending device is within reach of one or more hoisting means for the elongate support structure.
    Type: Grant
    Filed: February 7, 2018
    Date of Patent: January 12, 2021
    Assignee: Seaway Heavy Lifting Engineering B.V.
    Inventor: Bernardus Martinus Zaal
  • Patent number: 10889215
    Abstract: A mat attachment structure of a seatback includes: a guide wire attached to the mat and provided, at the distal end part, with a straight portion extending in a longitudinal direction of the seatback frame on a tip side of the seatback frame or its root side; and a through-hole formed in the seatback frame and through which the straight portion is insertable. The through-hole is provided with a protruding part which includes a high protruding portion and a low protruding portion formed adjacent to the high protruding portion. In a first movement of the mat, the straight portion moves in a de-insertion direction while coming into contact with the high protruding portion. As the amount of movement of the mat gets larger than the amount of movement of the first movement, a contact position between the straight portion and the protruding part moves toward the low protruding portion.
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: January 12, 2021
    Assignees: Adient Engineering and IP GmbH, Honda Motor Co., Ltd.
    Inventors: Toshimitsu Mizukoshi, Masaki Shimazu, Taiji Misono, Hiroyuki Yasui, Motohiko Ozawa
  • Patent number: 10889374
    Abstract: An autonomous drone system uses an onboard command and control system for controlling operations of a drone without the need for a radio frequency controller or an external electronic device programming unit. The system uses a control unit that interacts with the drone's unmanned aerial system flight controller. The control unit is programmed via an HMI button that is resident onboard the drone. Various sequences of HMI button depressions program the drone for its missions as well as command the drone to perform the missions. A microphone can be substituted for or can augment the HMI button. Various devices, such as a speaker, lights, a visual display screen, etc., can be resident on the drone for giving a user feedback during command and programming of the drone.
    Type: Grant
    Filed: May 3, 2018
    Date of Patent: January 12, 2021
    Assignee: SURVICE Engineering Company
    Inventors: Robert Eric Baltrusch, Shawn Thomas Recker, Mark Thomas Butkiewicz
  • Patent number: 10892523
    Abstract: An electrolyte composition has a fluoroalkylsulfonyl salt and water. The water is present, relative to the fluoroalkylsulfonyl salt, at a molar ratio within a range of 0.1:1 to 10:1, inclusive. This creates a “water-in-salt” in which individual water molecules are surrounded by salt rather than vice versa. Water contained in this environment is electrochemically stabilized relative to a bulk water. The electrolyte also has an organic carbonate present, relative to the fluoroalkylsulfonyl salt, at a molar ratio within a range of 0.1:1 to 50:1, inclusive. It has been discovered that inclusion of the organic carbonate further increases the electrochemical stability of the water within the “in-salt” environment.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: January 12, 2021
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Kensuke Takechi, Ruidong Yang
  • Patent number: 10890334
    Abstract: A hinge assembly for an associated appliance door includes an arm and a lever pivotally connected to the arm. The lever and arm are adapted to pivot relative to each other about a main pivot axis between a first position that corresponds to a closed position of the associated appliance door and a second position that corresponds to an opened position of the associated appliance door. A slide link is located adjacent the lever. A damper engagement structure is connected to the slide link. A biasing system urges the arm and lever toward the first position. A damper system includes a damper that damps pivoting movement between the arm and the lever for at least part of the movement between the arm and the lever when the arm and lever pivot relative to each other from the first position toward the second position.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: January 12, 2021
    Assignee: Mansfield Engineered Components, Inc.
    Inventors: Brian S. White, James J. Collene
  • Patent number: 10891540
    Abstract: A method and computer system for managing a neural network. Data is sent into an input layer in a portion of layers of nodes in the neural network. The data moves on an encode path through the portion such that an output layer in the portion outputs encoded data. The encoded data is sent into the output layer on a decode path through the portion back to the input layer to obtain a reconstruction of the data by the input layer. A determination is made as to whether an undesired amount of error has occurred in the output layer based on the data sent into the input layer and the reconstruction of the data. A number of new nodes is added to the output layer when a determination is present that the undesired amount of the error occurred, enabling reducing the error using the number of the new nodes.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: January 12, 2021
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Timothy J. Draelos, James Bradley Aimone
  • Patent number: D907671
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: January 12, 2021
    Assignee: Mitsubishi Hitachi Tool Engineering, ltd
    Inventors: Kenji Nagafuchi, Yasuhiro Kiuchi, Yoshiyuki Kobayashi