Abstract: A method of forming a semiconductor device package includes: (1) providing an electronic device including an active surface and a contact pad adjacent to the active surface; (2) forming a package body encapsulating portions of the electronic device; and (3) forming a redistribution stack, including: forming a dielectric layer over a front surface of the package body, the dielectric layer defining a first opening exposing at least a portion of the contact pad; and forming a redistribution layer (RDL) over the dielectric layer, the RDL including a first trace, wherein the first trace includes a first portion extending over the dielectric layer along a first longitudinal direction adjacent to the first opening, and a second portion disposed in the first opening and extending between the first portion of the first trace and the exposed portion of the contact pad, wherein the second portion of the first trace has a maximum width along a first transverse direction orthogonal to the first longitudinal direction, and

Abstract: A method for manufacturing a semiconductor device package includes: (1) providing a first encapsulation layer; (2) disposing an adhesive layer on the first encapsulation layer; (3) disposing a first die on the adhesive layer; and (4) forming a second encapsulation layer covering the first die, the adhesive layer, and the first encapsulation layer.

Abstract: An optical device package includes: (1) a waveguide, the waveguide including: a main body; and multiple forks, wherein each of the plurality of forks has a tapering end and is extended from the main body, and wherein each of the tapering ends of the forks includes a facet for receiving light; and (2) an optical fiber having a surface configured to output the light into the waveguide; wherein a lateral distance between the surface of the optical fiber and at least one of the facets is less than about 25 micrometers (?m).

Abstract: A semiconductor device package is provided, which includes a carrier, a first reflective element, a second reflective element, a first optical component, a second optical component and a microelectromechanical system (MEMS) device. The carrier has a first surface. The first reflective element is disposed on the first surface of the carrier. The second reflective element disposed on the first surface of the carrier. The first optical component is disposed on the first reflective element. The second optical component is disposed on the second reflective element. The MEMS device is disposed on the first surface of the carrier to provide light beams to the first reflective element and the second reflective element. The light beams provided to the first reflective element are reflected to the first optical component and the light beams provided to the second reflective element are reflected to the second optical component.

Abstract: The present disclosure pertains to systems and methods for publishing time-synchronized information. In one embodiment, a system may include a time interface configured to receive a common time signal and a network interface configured to transmit a plurality of data packets using a network. A publishing subsystem may be configured to cause the system to publish at least one data value according to a schedule and the common time signal. A processing sequence number subsystem may be configured to generate a processing sequence number to be included in the plurality of data packets and to reset the processing sequence number at a fixed interval based on the common time signal. A data packet subsystem may be configured to generate a plurality of data packets comprising a respective processing sequence number and the at least one data value.

Abstract: A system for sealing one end of an existing conduit through which a number of cables extend and in which a number of elements are placed for holding each of the number of cables in a position in the conduit, the system comprising: a sealant for applying a first layer of sealant at an end of the existing conduit against the number of elements so that the first layer of sealant completely covers that end of the conduit as far as not occupied by any of the number of cables; a number of flexible elements which each have a first end for positioning that first end into the first layer of sealant when the first layer is still uncured, each of the number of flexible elements further having a second end at such a distance from the respective first end when the first ends are positioned in the first layer of sealant, that the second ends form together a structure against which a second layer of the sealant can be applied, a single-part or multiple part subsystem for constructing a rigid second conduit around the flexib

Abstract: A semiconductor device package includes: (1) an electronic device including an active surface and a contact pad adjacent to the active surface; and (2) a redistribution stack including a dielectric layer disposed over the active surface and defining a first opening exposing at least a portion of the contact pad; and a redistribution layer (RDL) disposed over the dielectric layer and including a first trace, wherein the first trace includes a first portion extending over the dielectric layer along a first longitudinal direction adjacent to the first opening, and a second portion disposed in the first opening and extending between the first portion of the first trace and the exposed portion of the contact pad, wherein the second portion of the first trace has a maximum width along a first transverse direction orthogonal to the first longitudinal direction, and the maximum width of the second portion of the first trace is no greater than 3 times of a width of the first portion of the first trace, wherein the sec

Abstract: A semiconductor device package includes a carrier, a first conductive post and a first adhesive layer. The first conductive post is disposed on the carrier. The first conductive post includes a lower surface facing the carrier, an upper surface opposite to the lower surface and a lateral surface extended between the upper surface and the lower surface. The first adhesive layer surrounds a portion of the lateral surface of the first conductive post. The first adhesive layer comprises conductive particles and an adhesive. The first conductive post has a height measured from the upper surface to the lower surface and a width. The height is greater than the width.

Abstract: In one aspect, the present disclosure belongs to the new material field and can be used to produce atomic-state fluid iodine by iodine atom rearrangement occurring in the pseudo-critical reaction system. In one aspect, the atomic-state fluid iodine has a specific gravity of about 3.8-4.0 g/mL and maintains stable physical state under 10-100 C and light environment without sublimation or decomposition.

Abstract: Described herein are systems and methods for multimodal recurrent network processing. In an embodiment, a system for evaluating multimodal data comprising a multimodal data input and a multimodal processing module is described. The multimodal data input may comprise the multimodal data, the multimodal data may comprise a first modality and a second modality. The multimodal processing module may be configured to receive the multimodal data comprising the first modality and the second modality; evaluate the first modality using a first recursive neural network comprising a first transformation matrix; evaluate the second modality using a second recursive neural network comprising the first transformation matrix; and determine an output based, at least in part, on evaluating the first modality and the second modality.

Abstract: A method and apparatus for teaching a programmed controlled robot at least one of two set up position coordinates by use of a tool having a first surface aligned with the end of a stud welding gun collet when the tool is mounted in the collet, a second surface on the tool spaced from the first surface by a predetermined set up distance. A probe carried by the stud welding engagable with the second surface on the tool to establish a predetermined set up distance. A third surface on the tool spaced from the first surface and engagable with a work piece to establish a minimum stud-welding gun set up dimension. The coordinates of the stud-welding gun when the third surface is engaged with the work piece are transmitted to a robot control program to establish the predetermined stud weld gun travel distance dimension.

Abstract: The present disclosure relates to systems and methods of locking a faulted circuit indicator (FCI). For example, the FCI may include a locking assembly. The locking assembly may include a lock plate that selectively moves between a locked position and an unlocked position. When in the locked position, the lock plate blocks a lock link of the FCI from moving in a first direction to prevent the FCI from opening. When in an unlocked position, the lock plate enables the lock link of the FCI to move in the first direction to allow the FCI to open.

Abstract: A location of a broken electrical conductor of an electric power delivery system may be detected by monitoring a rate of change of phase voltage and/or a rate of change of zero-sequence voltage at various points on the conductor. Intelligent electronic devices (IEDs) such as phasor measurement units may be used to obtain measurements and calculate synchrophasors. The synchrophasors may be used by a central controller to determine which two continuous IEDs measure rates of change of voltages of opposite polarities, where the broken conductor is between the two continuous IEDs. The synchrophasors may be used by a central controller to determine which two continuous IEDs where one exhibits a zero-sequence voltage magnitude that exceeds a predetermined threshold for a predetermined time, wherein the zero-sequence voltage magnitude of the other of the continuous IEDs does not exceed the predetermined threshold.

Abstract: A fill assembly sterilization system for a blow/fill/seal machine utilizes a closed loop circulation of sterilant containing gas. A typical sterilant is nitrogen dioxide. The closed loop includes a shroud that defines a plenum and encloses the fill system. Optionally, at least one high efficiency particulate absorption (HEPA) filter is provided in the closed loop. Sterility assurance level of 10?6 can be achieved by subjecting the fill system to the sterilizing gas for at least 20 minutes at a temperature in the range of about 18° C. to about 30° C.

Abstract: Systems and methods for qualitative and/or quantitative indentation detection are provided. A method includes receiving imaging data comprising a plurality of indentations within a region on a surface. The method further includes obtaining a size measurement for each indentation. The method further includes calculating a number of indentations within the region are equal to or above a minimum size.

Abstract: A vehicle service system configured to modify an ongoing vehicle service procedure in response to changes in vehicle wheel alignment angles which alter the vehicle tracking, thrust line, or thrust angle, in a manner which will affect the operation of an onboard vehicle safety system sensor which is aligned or calibrated relative to a selected characteristic of the vehicle.

Abstract: A load securement apparatus for a vehicle incorporating a cargo bed and a tailgate movable between a raised configuration and a lowered configuration to open and close the cargo bed. The load securement apparatus includes at least one tie-down engagement structure connected to another portion of the vehicle in a position located such that a tie-down member is engaged with the tie-down engagement structure by extending a portion of the tie-down member into a gap formed between an end of the cargo bed and the tailgate when the tailgate is in the lowered configuration.

Abstract: Described herein are various technologies pertaining to detecting tampering of a seal based upon quantum optical communication via a communications channel comprising the seal. A plurality of pulses of light encoded with random data are transmitted on the communications channel, whereupon they are received and their data values measured. The measured data values of the pulses are then compared to the known transmitted data to determine a correlation statistic between the transmitted and received data values. Tampering with the seal can be detected based upon identifying that the correlation statistic has dropped below a threshold non-tampered level of correlation between transmitted and received values.

Abstract: Various technologies for performing discrete-variable (DV) quantum key distribution (QKD) with integrated electro-optical circuits are described herein. An integrated DV-QKD system uses Mach-Zehnder modulators (MZMs) to modulate a polarization of photons at a transmitter and select a photon polarization measurement basis at a receiver. A transmitter of a DV-QKD system further uses phase shifters to correct for non-idealities of the MZM in output provided to a polarization beam splitter. A receiver of a DV-QKD system can use phase shifters between a polarization beam splitter and an MZM to correct for non-idealities of the polarization beam splitter and the MZM on the receiver side.