Abstract: A junction termination with an internal field plate, the field plate structure and the junction termination extension region are folded inside the device to make full use of the thickness of the drift region in the body, thereby reducing the area of the termination and relieving the electric field concentration at the end of the PN junction. The breakdown position is transferred from the surface into the body of the original PN junction, and the withstand voltage of termination can reach to the breakdown voltage of the parallel plane junction. Under such design, a smaller area can be obtained than that of the conventional structure at the same withstand voltage.

Abstract: A semiconductor package structure includes a substrate, at least one first semiconductor element, a heat dissipation structure and an insulation layer. The at least one first semiconductor element is attached to the substrate, and has a first surface and a second surface opposite to the first surface. The first surface of the at least one first semiconductor element faces the substrate. The heat dissipation structure is disposed on the second surface of the at least one first semiconductor element. The insulation layer is disposed on the heat dissipation structure, and defines a plurality of openings extending through the insulation layer and exposing a plurality of exposed portions of the heat dissipation structure.

Abstract: The present invention discloses moulded laminated reinforced composite glass which is mechanically strong composite of high optical quality and transparency. The moulded laminated reinforced composite glass comprises 10% to 20% (by vol.) of glass; and 80% to 90% (by vol.) nano composite liquid system comprising at least one resin selected from polyester and/or epoxy, at least one curing system and at least one nano particle uniformly dispersed in the resin. Another moulded composite glass comprises 10% to 20% (by vol.) of glass; 60% to 80% (by vol.) nano composite liquid system comprising at least one resin selected from polyester and/or epoxy, at least one curing agent and at least one nano particle uniformly dispersed in the resin and 5% to 10% (by vol.) of pre-stretched fabric embedded within the resin matrix. It also discloses a system and processes for the production of said moulded laminated reinforced composite glass.

Abstract: The present invention relates to an apparatus and a system that may be utilized to maximize and utilize greater air flow through an intercooler apparatus. The present invention utilizes unique coil configurations and designs to help promote better air flow through an intercooler apparatus. The present invention utilizes unique profiled passage separators to improve air flow through the passages of the intercooler. Additionally, the present invention utilizes profiled passage separators that improve and significantly cool temperatures of the air flow in much smaller packaging because of the unique passage separators and air flow design of the intercooler.

Abstract: To create a printed matter having favorable image quality that can prevent air bubbles from being trapped at the time when a protective film is attached to a medium. A method of creating printed matter includes: an ink arrangement step of ejecting a photocurable ink on a printing face of a medium by an inkjet method so that an average surface roughness of the printing face is smaller than 15 ?m and irradiating the photocurable ink with a light to be cured; and a laminating step of attaching the protective film to the medium by bonding an adhesive layer of the protective film to the printing face and a surface of the photocurable ink, and the protective film including the adhesive layer having a thickness equal to or larger than 18 ?m and a substrate supporting the adhesive layer.

Abstract: A substrate for packaging a semiconductor device is disclosed. The substrate includes a first dielectric layer having a first surface and a second surface opposite to the first surface, a first patterned conductive layer adjacent to the first surface of the first dielectric layer, and a second patterned conductive layer adjacent to the second surface of the first dielectric layer. The first dielectric layer includes a first portion adjacent to the first surface, a second portion adjacent to the second surface, and a reinforcement structure between the first portion and the second portion. A thickness of the first portion of the first dielectric layer is different from a thickness of the second portion of the first dielectric layer.

Abstract: A processor and method for performing outer product and outer product accumulation operations on vector operands requiring large numbers of multiplies and accumulations is disclosed.

Abstract: A semiconductor package device comprises a first dielectric layer, a first conductive pad and a first conductive element. The first dielectric layer has a first surface and a second surface opposite to the first surface. The first dielectric layer defines a first opening tapered from the first surface toward the second surface. The first conductive pad is within the first opening and adjacent to the second surface of the first dielectric layer. At least a portion of the first conductive element is within the first opening. The first conductive element is engaged with (e.g., abuts) a sidewall of the first opening, the first conductive element having a first surface facing toward the first conductive pad, wherein the first surface of the first conductive element is spaced apart from the first conductive pad.

Abstract: A multilayered printed matter is made up of a plurality of layers formed on a medium, including a front layer and a back layer with patterns printed thereon, and a white layer and a black layer interposed between the front layer and the back layer so as to conceal the back layer to be invisible from the front-layer side. The system for producing the multilayered printed matter includes a computer that executes a printing step of moving the medium and an inkjet head relative to each other using a moving device and printing the front, back, white, and black layers on the medium using the inkjet head, and a cutting step, subsequent to the printing step, of moving the medium and a cutting blade relative to each other using the moving device and cutting the medium using the cutting blade.

Abstract: A vehicle includes a front fascia having a lower bumper region extending outwardly in a vehicle longitudinal direction at a bottom of a front end assembly. An undercover assembly is located rearward of the front fascia and has an undercover body including a front edge located at the lower bumper region. The undercover assembly includes an undercover reinforcement member that is connected to a surface of the undercover body and extends along a length of the undercover body to increase a stiffness within at least a region of the undercover body.

Abstract: A semiconductor package includes a die and a patterned conductive layer electrically connected to the die. The patterned conductive layer includes a connection pad and a trace. The semiconductor package further includes an encapsulation layer encapsulating the die and the patterned conductive layer. The semiconductor package further includes an electrical connection element disposed on the connection pad and a protection layer including a sidewall portion surrounding the electrical connection element.

Abstract: A system for (1) for filling of big bags (4) of various heights with material and a method for adjusting thereof, wherein a big bag (4) is to be placed with its filling spout (3) around an outer pipe (6) and the bottom (2) of the big bag (4) rests on an underlying surface (7). The outer pipe (6) is telescopically engaged to a feed pipe (5). The feed pipe (5) is in sections extendible. The feed pipe (5) is designed to fill a determined quantity of material in a vertical stream from an overlying dosage unit (8) via the outer pipe (6) and down into the big bag (4). The feed pipe (5) at its upper connection (5.3) includes at least one radial continuous interface surface design to attach to another feed pipe's (5.2) downward facing rim (5.6) or to the underside of the dosage unit (8.2).

Abstract: A multilayered printed matter includes a group of print layers formed on a medium. The group of layers include a front layer and a back layer on which patterns are printed, a white layer, and a black layer. The white layer is interposed between the front layer and the back layer to conceal the back layer to be invisible from the side of the front layer. The white layer reflects incident light from the side of the front layer to allow the front layer to be visible from the side of the front layer. The black layer is interposed between the white layer and the back layer to conceal the back layer to be invisible from the side of the front layer. In comparison between the black layer and the white layer that are equal in thickness, the black layer exerts a higher light blocking effect than the white layer.

Abstract: An integrated passive component comprises a capacitor, a first passivation layer, an inductor, an insulation layer and an external contact. The first passivation layer surrounds the capacitor. The inductor is on the first passivation layer and electrically connected to the capacitor. The inductor comprises a plurality of conductive pillars. The insulation layer is on the first passivation layer and surrounds each of the conductive pillars. The insulation layer comprises a first surface adjacent to the first passivation layer, a second surface opposite to the first surface, and a side surface extending between the first surface and the second surface. A ratio of a width of each of the conductive pillars to a height of each of the conductive pillars is about 1:7. The external contact is electrically connected to the inductor and contacts the second surface of the insulation layer and the side surface of the insulation layer.

Abstract: A battery grid pasting machine includes a support structure, a battery grid plate support for supporting a battery grid plate, a paste dispensing hopper, a height adjustment mechanism for adjusting the spacing between the hopper and the battery grid plate support and a control system. The height adjustment mechanism includes a hydraulic cylinder connected to the hopper and a position sensor for sensing the position of the hydraulic cylinder. The control system includes a first hydraulic pump and a first hydraulic valve associated with the first hydraulic pump for incrementally moving the hydraulic cylinder by a first specified distance and a second hydraulic pump and a second hydraulic valve associated with the second hydraulic pump for incrementally moving the hydraulic cylinder by a second specified distance.

Abstract: A printing device includes a head unit and a scanning driving unit, in which the head unit includes a same color head group, configured by a plurality of inkjet heads, a nozzle interval PL in the inkjet heads has a relationship of PL=k·Ph (k is a natural number greater than or equal to two) with respect to a dot interval Ph in the sub-scanning direction corresponding to a resolution of printing, and positions in the sub-scanning direction of a first head and an ith head is shifted by ?i·PL+?i·Ph (?i is a natural number greater than or equal to one, ?i is a natural number greater than or equal to one and smaller than or equal to k?1), the first head being a first inkjet head from one end side in the sub-scanning direction, and the ith head being the ith inkjet head from the one end side.

Abstract: A vehicle, front end assembly, and a method for creating a front end assembly including an upper bumper cover portion including an upper wall, a lower wall, and an exterior wall facing forward in a vehicle-longitudinal direction that extends between the upper wall and the lower wall and a bumper cover retainer that extends along a width of a rear edge of the upper wall, the bumper cover retainer having a sidewall engaging the upper wall of the upper bumper cover portion as the upper wall deflects rearward in the vehicle-longitudinal direction in response to a front impact to the upper bumper cover portion to inhibit movement of the upper wall rearward in the vehicle-longitudinal direction.

Abstract: A configuration system of a test device designed for testing an electronic control unit. The test device is a hardware-in-the-loop simulator or a rapid control prototyping simulator. A software model of a technical system is executed on the test device and the software model communicates via an input/output interface of the test device with a device connected to the test device. Data is electronically transmitted by the communication, wherein the configuration system has a plurality of configuration items. The configuration items are assigned technical functional properties of the test device and the test device and/or the communication between the connected device and the software model is configured using the technical functional properties. The configuration items are assigned a functional category and are structured in functional panels in the configuration system.

Abstract: A method of manufacturing a semiconductor package includes: (1) providing a first passivation layer on a carrier; (2) patterning the first passivation layer to define a first hole; (3) disposing a first seed layer on the first hole; (4) disposing a first conductive layer on the first seed layer; (5) replacing the carrier with a second passivation layer; (6) patterning the second passivation layer to define a second hole exposing the first seed layer; and (7) disposing a second conductive layer on the exposed first seed layer through the second hole.

Abstract: Provided is an ? amylase variant obtained by the mutation or deletion of at least one amino acid residue in the amino acid sequence of a parent ? amylase, and at the same time, same is an ? amylase maintaining the capability of the parent to hydrolyse ?-1,4 glycosidic bond, wherein the amino acid sequence homology of the two reaches 95% or more. A series of ? amylase variants provided therein have a relatively high catalytic activity under acidic conditions of pH 5.0 and high temperatures of at least 100° C.