Abstract: System, methods, and other embodiments described herein relate to locally aligning features within a map. In one embodiment, a method includes segmenting map data that forms the map using a first grid to divide the map into a first set of tiles and a second grid to divide the map into a second set of tiles that are offset and overlap the first set of tiles. The method includes analyzing neighbor tiles in relation to a patch tile based, at least in part, on shared features between the patch tile and the neighbor tiles to identify external misalignments between one or more of the neighbor tiles and the patch tile. The neighbor tiles are from a different one of the first grid and the second grid. The method includes adjusting alignment of the neighbor tiles within the map according to the external misalignments for the neighbor tiles.

Abstract: A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a continuous layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the time at temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.

Abstract: The present invention relates to magnetoelastic resonators, sensors, and tunable devices, as well as methods for making such components. The resonators can be used as tags and/or sensors. In general, the resonators include one or more micron-sized resonator portions affixed on a substrate. For use as a tag, each tag includes a plurality of resonator portions that allow for multiplexed coding, and methods for making tags and arrays of such tags include use of electrodeposition processes. In particular embodiments, these components include an electrodeposited material that exhibits magnetostrictive properties.

Abstract: A vision-assist device may include one or more sensors configured to generate data corresponding to one or more objects present in an environment, and a processor communicatively coupled to the one or more sensors. The processor is programmed to identify one or more objects present in the environment based on the data generated by the one or more sensors, classify the environment based on the one or more identified objects, and modify at least one parameter of the vision-assist device based on the classification of the environment.

Abstract: A method for enhancing the cooling efficiency of a computer room air conditioning unit, in a data center, is provided. Raised floor panels are carried on a pedestal support system. The floor panels divide a data center, into upper and lower plenums. A cold aisle is includes air-grate floor panels. The computer room air conditioning unit is operated to condition a heated hot aisle return air flow. A server rack has a front, a back, and side rack support frame members. The support members define an interior server compartment. At least one damper door frame has a top, a bottom and side members. The door frame members define at least one open air flow panel portion. A series of horizontal damper blade members are pivotally mounted in the open panel portion. The damper blade members are pivoted to direct a stream of the conditioned air flow over heat generating components contained in the interior server compartment in order to elevate the temperature of the heated return airflow at the air conditioning unit.

Abstract: A semiconductor package includes a substrate, a dielectric layer, at least one conductive pillar and an electrical device. The dielectric layer is disposed on the substrate and defines at least one through hole corresponding to the respective first pad of the substrate. The conductive pillar is disposed in the respective through hole. The conductive pillar includes a body portion and a cap portion. The body portion is physically connected to the cap portion, and the cap portion is electrically connected to the first pad. A maximum width of the cap portion is greater than a maximum width of the body portion. The electrical device is disposed on the dielectric layer and electrically connected to the body portion of the conductive pillar.

Abstract: A semiconductor package includes a first semiconductor die, a first encapsulant, a first redistribution layer, a second encapsulant and a patterned conductive layer. The first encapsulant encloses the first semiconductor die and has a top surface and a lateral surface. The first redistribution layer is disposed on the top surface of the first encapsulant and electrically connected to the first semiconductor die, wherein a portion of the first redistribution layer is exposed from the lateral surface of the first encapsulant. The second encapsulant covers the first encapsulant and the first redistribution layer. The patterned conductive layer is disposed on at least one of the lateral surface of the first encapsulant or a lateral surface of the second encapsulant, and is electrically connected to the first redistribution layer.

Abstract: Various technologies for simultaneously making a plurality of modifications to a previously manufactured semiconductor are described herein. A mask layer is applied to a surface of the previously manufactured semiconductor device. A pattern is formed in the mask layer, where the pattern is aligned with a plurality of features of the semiconductor device that are desirably modified. Layers of the semiconductor device are etched based on the pattern to create a plurality of vias that each extend through one or more layers of the semiconductor device to a respective feature of the device. A conducting material is deposited into the vias to form a plurality of conducting plugs. Conducting material may be further deposited on the surface of the semiconductor device to connect plugs to one another and/or connect plugs to surface features of the device, thereby forming a plurality of new connections between features of the semiconductor device.

Abstract: A measurement-while-drilling system is integrated into a mud motor. The measurement-while-drilling system includes sensors which may include inclination and tool face sensors, for example, located near to the drill bit. Data from the near bit sensors is transmitted by way of telemetry, for example, EM telemetry. The mud motor may include a rotating electrical coupling which provides good electrical productivity between an uphole coupling of the mud motor and the rotating mandrel. The EM telemetry transmitter may include an electrically-insulating gap integrated with the mandrel of the mud motor.

Abstract: A silicon carbide based MOS integrated circuit is monolithically integrated with a suspended piezoelectric aluminum nitride member to form a high-temperature-capable hybrid MEMS-over-MOS structure. In the integrated structure, a post-MOS passivation layer of silicon carbide is deposited over the MOS passivation and overlain by a structural layer of the MEMS device. Electrical contact to refractory metal conductors of the MOS integrated circuit is provided by tungsten vias that are formed so as to pass vertically through the structural layer and the post-MOS passivation layer.

Abstract: Arrangements related to sensing systems and methods are described. A sensing system can include a sensor track and one or more sensors. The sensor track can be operatively connected to a vehicle surface, such as at least a portion of a perimeter of a roof of a vehicle. The one or more sensors can be operatively connected to the sensor track such that the one or more sensors move along the sensor track while scanning an environment of the vehicle. The sensing systems can include a controller operatively connected to the one or more sensors to control the movement of the one or more sensors along the sensor track. The controller can also receive signals from the one or more sensors relating to the environment. In one or more arrangements, the one or more sensors can include LIDAR sensors.

Abstract: A method includes transferring at least one feed stream including calcium oxide, calcium carbonate, water, and a fluidizing gas into a fluidized bed; contacting the calcium oxide with the water; based on contacting the calcium oxide with the water, initiating a hydrating reaction; producing, from the hydrating reaction, calcium hydroxide and heat; transferring a portion of the heat of the hydrating reaction to the calcium carbonate; and fluidizing the calcium oxide, calcium hydroxide, and the calcium carbonate into a first fluidization regime and a second fluidization regime. The first fluidization regime includes at least a portion of the calcium carbonate and at least a portion of the calcium oxide, and the second fluidization regime includes at least a portion of the calcium hydroxide and at least another portion of the calcium oxide. The first fluidization regime is different than the second fluidization regime.

Abstract: A method for purifying ?-nicotinamide mononucleotide (NMN) includes: sequentially microfiltrating and nanofiltrating a crude product solution containing NMN using membrane concentration devices to obtain a concentrated crude product solution; adjusting the concentrated crude product solution to pH 3-7 to obtain a loading solution, loading the loading solution onto a preparative reverse phase high performance liquid chromatographic column, and purifying by gradient elution using an octadecylsilane-bonded silica gel as a stationary phase, a hydrochloric acid solution at pH 3-7 as a mobile phase A, and 100% ethanol as a mobile phase B, to obtain a purified sample solution; concentrating the purified sample solution by nanofiltration and freeze drying in a vacuum freeze drier to obtain a purified NMN.

Abstract: A device and a method for accurately discharging a fixed amount of a liquid, the liquid containing solid particles, in a state that the solid particles are dispersed in the liquid material. The device includes a first reservoir, a first air pressure supply pipe, a metering portion having a metering hole, a plunger moving back and forth in the metering hole, a nozzle, a switching valve having a first position and a second position, a plunger driver, and a switching valve driver. The discharge device further includes a second reservoir, a second air pressure supply pipe, a branch portion provided in an upper portion of the metering hole and having a branch flow path, and an opening/closing mechanism that establishes or cuts off communication between the second reservoir and the metering hole. A discharge method is carried out using the discharge device.

Abstract: Method and apparatus for generating asymmetric high-voltage waveforms with near-rectangular profiles. The method comprises producing selected low-frequency components of the Fourier series for a rectangular waveform explicitly and adding them to the amplified residual of lower-amplitude near-rectangular waveform upon filtering out certain frequencies.

Abstract: A method for manufacturing a semiconductor package includes: (a) providing a package device, the package device comprising a substrate, a package body and a plurality of connecting elements, the substrate having a first surface, the package body being disposed adjacent to the first surface of the substrate, and the connecting elements being disposed adjacent to the first surface of the substrate and encapsulated by the package body; and (b) removing a portion of the package body along one or more machining paths to expose the connecting elements, wherein each machining path has one or more first paths passing over, between, or along a side of at least two connecting elements, wherein a portion of each of the at least two connecting elements is within the package body, and another portion of each of the at least two connecting elements protrudes from a surface of the package body.

Abstract: In a first aspect, a B-pillar central beam made of steel which comprises hard zones and soft zones. Such soft zones have less mechanical strength than the hard zones. The B-pillar central beam further comprises an upper region with a fastening portion for fastening to a roof member, and a lower region with a fastening portion for fastening to a sill member. The B-pillar central beam includes two soft zones. A lower soft zone is located between the lower fastening portion and 50% of the B-pillar central beam height, and an upper soft zone is located between the upper fastening portion and 50% of the B-pillar central beam height. The upper soft zone has higher mechanical strength than the lower soft zone. Methods for manufacturing such B-pillar central beam are also provided.

Abstract: An electrical device comprises a substrate, a first dielectric layer, a first die, an adjustable inductor and a second die. The substrate has a first surface. The first dielectric layer is disposed on the first surface of the substrate and has a first surface. The first die is surrounded by the first dielectric layer. The adjustable inductor is electrically connected to the first die. The adjustable inductor comprises a plurality of pillars surrounded by the first dielectric layer, a plurality of first metal strips disposed on the first surface of the first dielectric layer and electrically connected to the pillars, and a plurality of second metal strips disposed on the first surface of the first dielectric layer and electrically connected to the pillars. A width of at least one of the second metal strips is different than a width of at least one of the first metal strips. The second die is electrically connected to the adjustable inductor.

Abstract: A battery cell comprising a composite water-responsive safety layer and/or composite water- and pH-responsive safety layer to protect against tissue damage and/or electrolysis, when the battery cell is exposed to aqueous solution or tissue, is provided.

Abstract: A Micro Electro-Mechanical System (MEMS) device package includes a first circuit layer, a partition wall, a MEMS component, a second circuit layer and a polymeric dielectric layer. The partition wall is disposed over the first circuit layer. The MEMS component is disposed over the partition wall and electrically connected to the first circuit layer. The first circuit layer, the partition wall and the MEMS component enclose a space. The second circuit layer is disposed over and electrically connected to the first circuit layer. The polymeric dielectric layer is disposed between the first circuit layer and the second circuit layer.