Patents Assigned to Enplas Corporation
  • Patent number: 11276974
    Abstract: An IC socket (11) comprises contact pins (14) disposed in the socket body (13) to be disjunctive to terminals of the IC package (12), an opening and closing body (19A,19B) rotatably provided in the socket body (13), the opening and closing body (19A,19B) having a pressing member (23a,23b) for pressing a top surface of the IC package (12) accommodated on an accommodating surface portion (16d) of the socket body (13); and an operating member (20) for opening and closing the opening and closing body (19A,19B) disposed up and down movably with respect to the socket body (13). A first opening and closing body (19A) having a heat sink (23a) for pressing an entire of the top surface of the IC package (12) and a second opening and closing body (19B) having a block (23b) for pressing the heat sink (23a) are disposed at different positions mutually.
    Type: Grant
    Filed: June 24, 2019
    Date of Patent: March 15, 2022
    Assignee: ENPLAS CORPORATION
    Inventor: Yuki Ueyama
  • Patent number: 11268620
    Abstract: A channel chip having a channel for running a fluid that is opened and closed by sliding on a film a sliding member slidable on the film while contacting with the film, the channel chip comprising: a substrate including a first channel, a second channel and a partition wall formed between the first channel and the second channel; a film including a diaphragm having a substantially spherical crown shape, the film being disposed on the substrate so that the diaphragm faces the partition wall; and a positioning section for holding the sliding member in such a way that the sliding member is slidable on the film while the positioning section positions the sliding member, the positioning section being disposed on the film.
    Type: Grant
    Filed: October 1, 2020
    Date of Patent: March 8, 2022
    Assignee: ENPLAS CORPORATION
    Inventors: Koichi Ono, Nobuya Sunaga
  • Publication number: 20220055028
    Abstract: The present invention addresses the problem of providing a fluid handling system that is capable of injecting a fluid into a desired chip or the like without using a large-scale device. In order to resolve the problem, this fluid handling system has a reservoir, a flow path chip, and a cap, one end of which is fitted to the internal opening of the reservoir and the other end of which is connected to an introduction port of the flow path chip, the cap having a through-hole that links the one end and the other end. In this fluid handling system, a protruding part provided to the flow path chip is fitted into the through-hole at the other end of the cap and restricts blocking of the through-hole when a fluid moves inside the through-hole of the cap.
    Type: Application
    Filed: November 20, 2019
    Publication date: February 24, 2022
    Applicant: Enplas Corporation
    Inventors: Ken KITAMOTO, Koji MURAKI, Yuya OSHIMA
  • Patent number: 11256116
    Abstract: A light isolator member of an embodiment of the present invention is configured to be joined to another light isolator member to serve as a part of a light isolator, the light isolator member including: a lens surface disposed in a first surface; a transmission surface disposed at a position corresponding to the lens surface in a second surface on a side opposite to the first surface; and a fitting part disposed in the second surface, the fitting part being configured for fitting to the other light isolator member.
    Type: Grant
    Filed: August 7, 2020
    Date of Patent: February 22, 2022
    Assignee: ENPLAS CORPORATION
    Inventors: Yuki Saito, Ayano Kon
  • Patent number: 11249342
    Abstract: This light emitting device includes a light emitting element and a light flux controlling member. The light flux controlling member includes an incident surface, an emission surface, a back surface, a protruding portion and a scattering portion. In a cross section including a central axis, an angle formed by two beams, which are emitted from the light emitting device and have a maximum luminous intensity, is 150° or more. In a cross section including a central axis, predetermined light is made incident at an incident angle of 60° and an average angle, which is formed by, among the light reflected by the scattering portion, a light ray having a maximum light amount and a light ray having a light amount of 50% of the maximum light amount, is 5° or more.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: February 15, 2022
    Assignee: Enplas Corporation
    Inventors: Toshihiko Mochida, Hiroaki Okuyama
  • Patent number: 11249345
    Abstract: Condition 1 (an absolute value of a difference between IB×B and EB×B is 55% or smaller) and condition 2 (an absolute value of a difference between IY×Y and EY×Y is 55% or smaller) are satisfied, where, when an area of the light-emitting surface is equally divided into inner and outer regions by a boundary line as an outer edge of a region similar in shape to the light-emitting surface in plan view of a white LED package, IB (%) is an area ratio of blue LED chips in the inner region; IY (%) is an area ratio of the region where no blue LED chips is disposed in the inner region; EB (%) is an area ratio of the blue LED chips in the outer region; and EY (%) is an area ratio of the region where no blue LED chip is disposed in the outer region.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: February 15, 2022
    Assignee: Enplas Corporation
    Inventor: Yuki Fujii
  • Patent number: 11243430
    Abstract: A light flux controlling member for controlling a distribution of light emitted from a light-emitting element includes an incidence surface configured to allow the light to enter the light flux controlling member; an emission surface configured to emit light; and a reflection part including an inclined surface configured to reflect light entered from the incidence surface, wherein in a cross-section, a region where light emitted from a light emission center of the light-emitting element that is entered from the incidence surface and sequentially reflected by the emission surface and the inclined surface reaches in the emission surface includes a portion where a derivative value of a gradient of a tangent to a given point in the emission surface is 0, or a portion where a sign of the derivative value reverses.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: February 8, 2022
    Assignee: Enplas Corporation
    Inventor: Toshihiko Mochida
  • Patent number: 11244882
    Abstract: To provide a socket for electrical component that allows an electrical component to be easily accommodated and to be able to be accommodated and be used even if the electrical component is large. The IC socket 10 comprises a socket body 13 accommodating an IC package 11; a cover member 15 for pressing the IC package 11; and a lever member 17 for pressing the cover member 15. The cover member 15 and the lever member 17 are rotatably connected to the same side end side of the socket body 13, and a pressing means 25, for pushing down the cover member 15 by closing the lever member 17 at the state that the cover member 15 is closed, is provided.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: February 8, 2022
    Assignee: ENPLAS CORPORATION
    Inventor: Osamu Hachuda
  • Patent number: 11236816
    Abstract: An aspect of a carrier for a planetary gear device includes two separate endplates that fit together using a snap-fit assembly. Retention protrusions extending from one of the endplates snap-fit into corresponding recesses on the other endplate to assemble the carrier. The shape of the recess is configured to reduce or eliminate any tendency for loads to force retention protrusion to disengage from the recess, which may result in loss of structural integrity of the carrier.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: February 1, 2022
    Assignee: ENPLAS CORPORATION
    Inventors: Kazuki Yamada, Koki Hisai
  • Patent number: 11236814
    Abstract: A lubrication system for a planetary gear device includes a planetary gear mounted on a planetary gear shaft. The shaft is mounted in a shaft hole that allows the gear to rotate freely about the shaft. Lubricant reservoirs formed as voids or spaces on the inner surface of the shaft hole and outer surface of the shaft provide additional volume for lubricant to lubricate the shaft and shaft hole interface. These lubricant reservoirs extend the lifespan of the lubricant and reduce maintenance requirements of the planetary gear.
    Type: Grant
    Filed: October 21, 2020
    Date of Patent: February 1, 2022
    Assignee: ENPLAS CORPORATION
    Inventors: Koki Hisai, Kazuki Yamada
  • Patent number: 11231619
    Abstract: A light bundle control member comprises: an incident plane which is an inner surface of a recess opening toward a back side so as to intersect a central axis of the light bundle control member; an exit plane disposed on a front side so as to intersect the central axis; a back surface which is connected to an opening edge of the recess and formed so as to be spaced apart from the opening edge of the recess; and a protrusion disposed on the back surface and protruding from the back surface toward the back side. A tip-end surface of the protrusion and at least an area surrounding the protrusion on the back surface have different properties.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: January 25, 2022
    Assignee: ENPLAS CORPORATION
    Inventor: Haruto Nagami
  • Publication number: 20210408736
    Abstract: An electric connection socket for relaying electric signals between a circuit substrate and an electric component includes: a metal housing which has a through hole enabling communication between the top surface and the bottom surface thereof, and on the top surface of which the electric component is mounted and on the bottom surface of which the circuit substrate is mounted; and a signal pin inserted into the through hole to configure a coaxial line between the inner wall surfaces of the through hole, and which is electrically connected at one end to a signal path first pad electrode of the circuit substrate and is electrically connected at the other end to a signal path terminal of the electric component. On the bottom surface, the metal housing has a ground connection unit which contacts a second pad electrode for grounding formed on the circuit substrate and which grounds the metal housing.
    Type: Application
    Filed: June 29, 2018
    Publication date: December 30, 2021
    Applicant: Enplas Corporation
    Inventor: Keiichi NARUMI
  • Publication number: 20210405453
    Abstract: Condition 1 (an absolute value of a difference between IB×B and EB×B is 55% or smaller) and condition 2 (an absolute value of a difference between IY×Y and EY×Y is 55% or smaller) are satisfied, where, when an area of the light-emitting surface is equally divided into inner and outer regions by a boundary line as an outer edge of a region similar in shape to the light-emitting surface in plan view of a white LED package, IB (%) is an area ratio of blue LED chips in the inner region; IY (%) is an area ratio of the region where no blue LED chips is disposed in the inner region; EB (%) is an area ratio of the blue LED chips in the outer region; and EY (%) is an area ratio of the region where no blue LED chip is disposed in the outer region.
    Type: Application
    Filed: June 29, 2021
    Publication date: December 30, 2021
    Applicant: Enplas Corporation
    Inventor: Yuki FUJII
  • Publication number: 20210397048
    Abstract: This light emitting device includes a light emitting element and a light flux controlling member. The light flux controlling member includes an incident surface, an emission surface, a back surface, a protruding portion and a scattering portion. In a cross section including a central axis, an angle formed by two beams, which are emitted from the light emitting device and have a maximum luminous intensity, is 150° or more. In a cross section including a central axis, predetermined light is made incident at an incident angle of 60° and an average angle, which is formed by, among the light reflected by the scattering portion, a light ray having a maximum light amount and a light ray having a light amount of 50% of the maximum light amount, is 5° or more.
    Type: Application
    Filed: September 5, 2018
    Publication date: December 23, 2021
    Applicant: Enplas Corporation
    Inventors: Toshihiko MOCHIDA, Hiroaki OKUYAMA
  • Publication number: 20210370302
    Abstract: The purpose of the present invention is to provide a liquid handling method that makes it possible to simply isolate a droplet, a fluid handling device used in this method, and a fluid handling system. This fluid handling method serves to flow a fluid including a solvent and a droplet through a fluid handling device comprising an inlet, a first flow path having one end connected to the inlet, a chamber connected to the other end of the first flow path, a second flow path having one end connected to the chamber, and an outlet connected to the other end of the second flow path. This fluid handling method includes an introduction step for introducing the fluid through the inlet and accommodating the droplet in the chamber, a rotation step for rotating the fluid handling device after the introduction step, and a removal step for removing the droplet from the inside of the chamber after the rotation step.
    Type: Application
    Filed: December 14, 2018
    Publication date: December 2, 2021
    Applicant: Enplas Corporation
    Inventor: Nobuya SUNAGA
  • Patent number: 11187314
    Abstract: A gear device includes a first double helical gear, a two-step gear, a second spur gear, and an intermediate shaft The two-step gear includes a second double helical gear meshing with the first double helical gear, and a first spur gear on a back surface side of the second double helical gear. The second spur gear meshes with the first spur gear. A housing includes a shaft support hole and a meshing guide groove. The shaft support hole houses one end side of the intermediate shaft. The meshing guide groove meshes the second double helical gear with the first double helical gear by guiding the intermediate shaft along a pitch circle of the second spur gear to a proximity of the shaft support hole while maintaining the first spur gear meshing with the second spur gear. The meshing guide groove rises up at the proximity of the shaft support hole.
    Type: Grant
    Filed: January 12, 2017
    Date of Patent: November 30, 2021
    Assignee: ENPLAS CORPORATION
    Inventor: Toru Hagihara
  • Patent number: 11189945
    Abstract: This electrical connection socket for relaying exchange of electrical signals between a first electrical component and a second electrical component, is provided with: a metallic casing which has a communication hole for communication between the upper surface and lower surface of the metallic casing, to the lower surface side of which the first electrical component is attached, and to the upper surface of which the second electrical component is attached; a signal pin which is disposed in the communication hole so as to be separated from the inner wall surface of the communication hole, one end of which is electrically connected to a terminal of the first electrical component, and the other end of which is electrically connected to a terminal of the second electrical component; an annular first holding member which is, in the upper region of the communication hole, press-fitted in the communication hole; and an annular second holding member which is, in the lower region of the communication hole, press-fitte
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: November 30, 2021
    Assignee: ENPLAS CORPORATION
    Inventors: Kazutaka Koshiishi, Keiichi Narumi
  • Patent number: 11171434
    Abstract: An electric connection socket for relaying electric signals between a circuit substrate and an electric component includes: a metal housing which has a through hole enabling communication between the top surface and the bottom surface thereof, and on the top surface of which the electric component is mounted and on the bottom surface of which the circuit substrate is mounted; and a signal pin inserted into the through hole to configure a coaxial line between the inner wall surfaces of the through hole, and which is electrically connected at one end to a signal path pad electrode of the circuit substrate and is electrically connected at the other end to a signal path terminal of the electric component. The metal housing is arranged on the circuit substrate such that an air gap is formed between the bottom surface of the metal housing and the top surface of the circuit substrate.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: November 9, 2021
    Assignee: Enplas Corporation
    Inventor: Keiichi Narumi
  • Patent number: 11163125
    Abstract: This optical receptacle includes: first, second, and third optical surfaces disposed on a first surface that faces a photoelectric conversion device; fourth and fifth optical surfaces that are disposed on a second surface that faces an optical transmission body; a first reflection surface that is disposed on an optical path between the first optical surface and the fifth optical surface; a second reflection surface that is disposed on an optical path between the second optical surface and the fourth optical surface; and an inclined surface that is disposed between the first reflection surface and the fifth optical surface on an optical path between the first optical surface and the fifth optical surface. The inclined surface functions as a transmissive surface when covered by a light-transmissive material, and functions as a reflective surface when not covered by a light-transmissive material.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: November 2, 2021
    Assignee: Enplas Corporation
    Inventors: Shimpei Morioka, Ayano Kon
  • Patent number: 11160889
    Abstract: The purpose of the present invention is to provide an ultraviolet sterilization device that can increase the ultraviolet irradiance near the center of a treatment flow path even at a position far from a light emitting element. This ultraviolet sterilization device comprises: a flow path tube having a linear treatment flow path therein; a light emitting element for emitting ultraviolet rays; and a reflector having a reflection surface for reflecting ultraviolet rays emitted from the light emitting element and collecting and directing the ultraviolet rays to the flow path tube. The ultraviolet sterilization device irradiates a fluid flowing in the linear treatment flow path with ultraviolet rays and sterilizes the fluid.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: November 2, 2021
    Assignee: Enplas Corporation
    Inventor: Masato Nakamura