Abstract: This invention relates to a die tool, a device and a method for producing, in particular embossing, a monolithic lens wafer that has a large number of microlenses.

Abstract: A method for producing a microlens with a carrier wafer, in which a lens in one opening of the carrier wafer is molded into the carrier wafer by stamping of the lens and to a corresponding device for executing the method and to a microlens which has been produced using the method.

Abstract: A method for producing a microlens with a carrier wafer, in which a lens in one opening of the carrier wafer is molded into the carrier wafer by stamping of the lens and to a corresponding device for executing the method and to a microlens which has been produced using the method.

Abstract: A chuck for clamping workpieces or tools in a clamping space with a clamping force (F). The chuck includes at least two chuck jaws movable in translation along one clamping plane (E) in the direction of one center Z of the clamping space and a gear train located at least largely within the chuck for transfer of a driving torque of a drive motor, which can be coupled to the gear train by coupling means of the gear train, to the chuck jaws for movement of the chuck jaws. The coupling means able to be coupled to a corresponding coupling connection of the drive motor. The movement from the maximum size of the clamping space to the minimum size of the clamping space is executed via the gear train from the drive motor.

Abstract: This invention relates to a die tool, a device and a method for producing, in particular embossing, a monolithic lens wafer that has a large number of microlenses.

Abstract: The invention relates to a device for processing of substrates, especially wafers, with at least one pretreatment module, at least one aftertreatment module and at least one primary treatment module, and the pretreatment module and the aftertreatment module can be switched as a lock for the primary treatment module, and a corresponding method for processing of substrates, especially wafers.

Abstract: The invention relates to a device for processing of substrates, especially wafers, with at least one pretreatment module, at least one aftertreatment module and at least one primary treatment module, and the pretreatment module and the aftertreatment module can be switched as a lock for the primary treatment module, and a corresponding method for processing of substrates, especially wafers.

Abstract: This invention relates to a die tool, a device and a method for producing, in particular embossing, a monolithic lens wafer that has a large number of microlenses.

Abstract: A method and a device for producing a lens wafer which has a plurality of microlenses, as well as microlenses produced from the lens wafer.

Abstract: A method and a device for producing a lens wafer which has a plurality of microlenses, as well as microlenses produced from the lens wafer.

Abstract: A chuck for clamping workpieces or tools in a clamping space with a clamping force (F). The chuck includes at least two chuck jaws movable in translation along one clamping plane (E) in the direction of one center Z of the clamping space and a gear train located at least largely within the chuck for transfer of a driving torque of a drive motor, which can be coupled to the gear train by coupling means of the gear train, to the chuck jaws for movement of the chuck jaws. The coupling means able to be coupled to a corresponding coupling connection of the drive motor. The movement from the maximum size of the clamping space to the minimum size of the clamping space is executed via the gear train from the drive motor.

Abstract: A chuck for clamping workpieces or tools in a clamping space with a clamping force (F). The chuck includes at least two chuck jaws movable in translation along one clamping plane (E) in the direction of one center Z of the clamping space and a gear train located at least largely within the chuck for transfer of a driving torque of a drive motor, which can be coupled to the gear train by coupling means of the gear train, to the chuck jaws for movement of the chuck jaws. The coupling means able to be coupled to a corresponding coupling connection of the drive motor. The movement from the maximum size of the clamping space to the minimum size of the clamping space is executed via the gear train from the drive motor.

Abstract: Device for stripping a product substrate off a carrier substrate connected to the product substrate by an bonding layer by means of a film frame, a flexible film which is connected to the film frame and which has an adhesive layer for holding the product substrate in a contacting surface section of the film, the film being connected to the film frame in an attachment section of the film which surrounds the contacting surface section, as well as a solvent reservoir formed by the film frame and the film, especially of variable volume, for holding the solvent for detaching the bonding layer, and the product substrate and the bonding layer can be accommodated in the solvent reservoir, and by delivery means for delivering the solvent into the solvent reservoir and by stripping means for stripping the product substrate off the carrier substrate.

Abstract: A device for aligning and prefixing a flat substrate on a carrier substrate for the further processing of the substrate. The device includes aligning means for aligning a substrate's outside contour relative to a carrier substrate's outside contour by engaging the substrate's outside contour. The alignment of the substrate is carried out along a substrate plane E that is parallel to a contact surface of the substrate. Attaching means is provided for at least partial prefixing of the aligned substrate on the carrier substrate.

Abstract: Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.

Abstract: Device for stripping a product substrate off a carrier substrate connected to the product substrate by an bonding layer by means of a film frame, a flexible film which is connected to the film frame and which has an adhesive layer for holding the product substrate in a contacting surface section of the film, the film being connected to the film frame in an attachment section of the film which surrounds the contacting surface section, as well as a solvent reservoir formed by the film frame and the film, especially of variable volume, for holding the solvent for detaching the bonding layer, and the product substrate and the bonding layer can be accommodated in the solvent reservoir, and by delivery means for delivering the solvent into the solvent reservoir and by stripping means for stripping the product substrate off the carrier substrate.

Abstract: A workholding fixture for holding flat semiconductor substrates with a carrier, a holding body which is fixed or which can be fixed on the carrier with a holding side which faces away from the carrier and at least one negative pressure channel which penetrates the holding body with one suction end on the holding side, the holding side having a defined suction structure of soft material.

Abstract: Device for stripping a product substrate off a carrier substrate connected to the product substrate by an bonding layer by means of a film frame, a flexible film which is connected to the film frame and which has an adhesive layer for holding the product substrate in a contacting surface section of the film, the film being connected to the film frame in an attachment section of the film which surrounds the contacting surface section, as well as a solvent reservoir formed by the film frame and the film, especially of variable volume, for holding the solvent for detaching the bonding layer, and the product substrate and the bonding layer can be accommodated in the solvent reservoir, and by delivery means for delivering the solvent into the solvent reservoir and by stripping means for stripping the product substrate off the carrier substrate.

Abstract: Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.

Abstract: A method and a device for producing a lens wafer which has a plurality of microlenses, as well as microlenses produced from the lens wafer.