Abstract: Device for separating a substrate from a carrier substrate which is connected to the substrate by an interconnect layer. The device includes a carrier substrate holder with a holding surface for holding the carrier substrate. A substrate holder is located opposite the carrier substrate holder. The substrate holder has a substrate holding surface which can be located parallel to the holding surface of the carrier substrate holder. A separating means is provided for parallel displacement of the substrate relative to the carrier substrate in the interconnected state of the substrate and carrier substrate.

Abstract: A method for producing a microlens with a carrier wafer, in which a lens in one opening of the carrier wafer is molded into the carrier wafer by stamping of the lens and to a corresponding device for executing the method and to a microlens which has been produced using the method.

Abstract: A workpiece holding fixture for receiving a workpiece and for use in a device for the machining of a workpiece with: a tool holding fixture for receiving the tool, a workpiece holding fixture for receiving the workpiece, characterized in that, during the machining, at least one first oscillation component in a Z-direction and a second, in particular simultaneous, oscillation component in the X- and/or Y-direction can be introduced by means of oscillation components.

Abstract: This invention relates to a method for producing a microlens with a carrier wafer, in which a lens in one opening of the carrier wafer is molded into the carrier wafer by stamping of the lens and to a corresponding device for executing the method and to a microlens which has been produced using the method. Furthermore the invention relates to a device for producing a microlens as well as a microlens.

Abstract: Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.

Abstract: A device for aligning and prefixing a flat substrate on a carrier substrate for the further processing of the substrate. The device includes aligning means for aligning a substrate's outside contour relative to a carrier substrate's outside contour by engaging the substrate's outside contour. The alignment of the substrate is carried out along a substrate plane E that is parallel to a contact surface of the substrate. Attaching means is provided for at least partial prefixing of the aligned substrate on the carrier substrate.

Abstract: Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.

Abstract: Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.

Abstract: A device for aligning and prefixing a flat substrate on a carrier substrate for the further processing of the substrate. The device includes aligning means for aligning a substrate's outside contour relative to a carrier substrate's outside contour by engaging the substrate's outside contour. The alignment of the substrate is carried out along a substrate plane E that is parallel to a contact surface of the substrate. Attaching means is provided for at least partial prefixing of the aligned substrate on the carrier substrate.

Abstract: A device for releasing an interconnect layer that provides a connection between a carrier and a wafer which forms a carrier-wafer combination. The device includes rotation means for rotation of the carrier-wafer combination in a release position, and a connection release means for providing an immersion bath that receives the carrier-wafer combination.

Abstract: Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.

Abstract: The invention relates to a device for loosening a polymer layer from a surface of a substrate.

Abstract: Handling device for handling of a wafer in the processing of the wafer with the following features: a carrier with a flat receiving side for holding the wafer, an especially lattice-like grid structure which is raised on the receiving side relative to the receiving side, a flexible cover which covers the grid structure relative to the carrier, sealing it, for fixing of the wafer on the carrier, and a grid space which is bordered by the cover and the carrier can be exposed to negative pressure, characterized in that the grid structure and the cover with the receiving side form an especially trough-shaped receiving space for holding of receiving structures which are provided on the wafer and which are raised relative to the wafer receiving side.

Abstract: Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.

Abstract: A device for releasing an interconnect layer that provides a connection between a carrier and a wafer which forms a carrier-wafer combination. The device includes rotation means for rotation of the carrier-wafer combination in a release position, and a connection release means for providing an immersion bath that receives the carrier-wafer combination.

Abstract: Method for stripping a wafer from a carrier that is connected to the wafer by an interconnect layer. The method includes the steps of accommodating the carrier-wafer combination on a receiving means, breaking the connection provided by the interconnect layer by a connection release means, and stripping the wafer from the carrier, or stripping the carrier from the wafer by stripping means.

Abstract: Method for bonding a plurality of chips onto a base wafer.

Abstract: The invention relates to a device for processing of substrates, especially wafers, with at least one pretreatment module, at least one aftertreatment module and at least one primary treatment module, and the pretreatment module and the aftertreatment module can be switched as a lock for the primary treatment module, and a corresponding method for processing of substrates, especially wafers.

Abstract: Device for stripping a product substrate off a carrier substrate connected to the product substrate by an bonding layer by means of a film frame, a flexible film which is connected to the film frame and which has an adhesive layer for holding the product substrate in a contacting surface section of the film, the film being connected to the film frame in an attachment section of the film which surrounds the contacting surface section, as well as a solvent reservoir formed by the film frame and the film, especially of variable volume, for holding the solvent for detaching the bonding layer, and the product substrate and the bonding layer can be accommodated in the solvent reservoir, and by delivery means for delivering the solvent into the solvent reservoir and by stripping means for stripping the product substrate off the carrier substrate.

Abstract: A workpiece holding fixture for receiving a workpiece and for use in a device for the machining of a workpiece with: a tool holding fixture for receiving the tool, a workpiece holding fixture for receiving the workpiece, characterised in that, during the machining, at least one first oscillation component in a Z-direction and a second, in particular simultaneous, oscillation component in the X- and/or Y-direction can be introduced by means of oscillation components.