Patents Assigned to Fico B.V.
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Patent number: 8813349Abstract: A device for separating electronic components including sawing means and positioning means, wherein between the positioning means and the sawing means at least one transfer position is defined for the purpose of transferring positioned electronic components. A separating device for electronic components including sawing means, positioning means, inspection means, and sorting means, wherein between the positioning means and the sawing means at least one transfer position is defined for the purpose of transferring positioned electronic components between the positioning means and the sawing means, and wherein between the inspection means and the sorting means at least another transfer position is defined for the purpose of transferring the inspected separated electronic components between the inspection means and the sorting means.Type: GrantFiled: July 9, 2009Date of Patent: August 26, 2014Assignee: FICO B.V.Inventors: Frederik Hendrik In 'T Veld, Mark Hermans, Wilhelmus Hendrikus Johannes Harmsen, Johannes Gerhardus Augustinus Zweers
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Patent number: 8677592Abstract: The invention relates to a method for separating electronic components, comprising the processing steps of placing an assembly of electronic components on a manipulator, transporting the electronic components with the manipulator along a first cutting tool such that the assembly is cut through only partially along cutting lines in the thickness direction thereof, and transporting the partially severed assembly with a manipulator along a second cutting tool such that the cutting lines are severed almost completely. The invention also relates to a device for separating electronic components, and to a separated electronic component obtainable with the method.Type: GrantFiled: September 19, 2006Date of Patent: March 25, 2014Assignee: Fico B.V.Inventors: Frederik Hendrik In't Veld, Joannes Leonardus Jurrian Zijl, Hendrik Wensink
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Patent number: 8425826Abstract: The invention relates to a method for encapsulating electronic components mounted on a carrier, comprising the processing steps of: A) heating encapsulating material, B) displacing the encapsulating material to a mold cavity, C) filling the mold cavity, and D) curing the encapsulating material in the mold cavity. The temperature regulation of the encapsulating material takes place during separate sections of the path covered by the encapsulating material by creating different temperature zones at least partially separated from each other thermally by means of at least one temperature carrier. The invention also relates to a device for encapsulating electronic components mounted on a carrier.Type: GrantFiled: June 9, 2005Date of Patent: April 23, 2013Assignee: Fico B.V.Inventor: Johannes Lambertus Gerarus Maria Venrooij
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Patent number: 8268217Abstract: The invention relates to a method for encapsulating electronic components in a mold by the processing steps of: A) placing the electronic component for encapsulating in a mold cavity, and B) feeding an encapsulating material to the mold cavity, wherein at least a part of the mold surface defining the mold cavity is brought into contact with a conditioning gas containing a decreased oxygen concentration relative to the atmosphere. The invention also relates to a device for encapsulating an electronic component, in particular a semiconductor, with encapsulating material.Type: GrantFiled: July 14, 2005Date of Patent: September 18, 2012Assignee: Fico B.V.Inventors: Hendrikus Johannes Bernardus Peters, Arthur Theodorus Johannes Reijmer, Franciscus Bernardus Antonius De Vries, Johannes Lambertus Gerardus Marla Venrooij
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Publication number: 20110197727Abstract: The invention relates to a device for separating electronic components, provided with: sawing means and positioning means, wherein between the positioning means and the sawing means at least one transfer position is defined for the purpose of transferring positioned electronic components. The invention further comprises a separating device for electronic components, provided with: sawing means, inspection means, and sorting means, wherein between the inspection means and the sorting means at least one transfer position is defined for the purpose of transferring separated electronic components. Finally, the invention also relates to a method for separating electronic components.Type: ApplicationFiled: July 9, 2009Publication date: August 18, 2011Applicant: FICO B.V.Inventors: Frederik Hendrik In 'T Veld, Mark Hermans, Wilhelmus Hendrikus Johannes Harmsen, Johannes Gerhardus Augustinus Zweers
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Publication number: 20110113645Abstract: The invention relates to a device for at least partially drying separated electronic components comprising: a carrier for the electronic components; a moisture-absorbing material; and a holder covered with the moisture-absorbing material, wherein the holder and the carrier are displaceable relative to each other such that the electronic components for drying can be brought into contact with the moisture-absorbing material.Type: ApplicationFiled: May 25, 2009Publication date: May 19, 2011Applicant: FICO B.V.Inventors: Jurgen Hendrikus Gerhardus Huisstede, Wilhelmus Johannes In Den Bosch
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Publication number: 20100230855Abstract: The invention relates to a plunger for feeding encapsulating material to a mould cavity, comprising at least one peripheral groove recessed into the cylinder casing of the plunger whereby a material part is placed in the groove which only partly fills the groove. The invention also related to a device for encapsulating electronic components mounted on a carrier. In addition, the invention also relates to a method for sealing a fitting of a plunger housing, which plunger is adapted to feed encapsulating material under pressure to a mould cavity.Type: ApplicationFiled: April 21, 2005Publication date: September 16, 2010Applicant: FICO B.V.Inventors: Hendrikus Johannes Bernardus Peters, Henricus Hermanus Johannes Van Londen
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Patent number: 7771184Abstract: The present invention relates to a press for encapsulating electronic components, comprising: two displaceable mold parts (5,6), feed means for encapsulating material, and a drive mechanism connecting onto the mold parts. In a first embodiment the drive mechanism is provided with a fluid bed (14) and a first fluid feed (15) whereby their connection can be interrupted by a displacer (16). In a further embodiment a displacer (28) is provided in the feed channel (26) to place the encapsulating material (25) under pressure. Furthermore, the present invention relates to methods for encapsulating electronic components with encapsulating material in such presses.Type: GrantFiled: April 25, 2006Date of Patent: August 10, 2010Assignee: Fico B.V.Inventors: Johannes Lambertus Gerardus Maria Venrooij, Adrianus Henricus Ignatius Maria Verkuijlen
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Publication number: 20100159672Abstract: The present invention relates to a method for processing with a laser beam and cleaning electronic components, wherein at least one new boundary surface is formed on an electronic component with the laser beam. The invention also relates to a device for processing and cleaning electronic components, comprising at least: a laser source for generating a laser beam, and at least one carrier for supporting an assembly of unseparated electronic components, wherein the carrier and the laser beam are displaceable relative to each other.Type: ApplicationFiled: June 15, 2006Publication date: June 24, 2010Applicant: FICO B.V.Inventors: Joannes Leonardus Jurriam Zijl, Henri Joseph Van Egmond
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Patent number: 7676900Abstract: The invention relates to an apparatus for processing electronic components mounted on a carrier, comprising at least two engaging elements which co-act when engaging on a carrier. The invention also relates to a processing element for processing electronic components mounted on a carrier, which processing element can be coupled interchangeably to an apparatus according to the invention. The invention furthermore relates to a method for product-related adjustment of such an apparatus.Type: GrantFiled: November 15, 2004Date of Patent: March 16, 2010Assignee: Fico B.V.Inventor: Wilhelmus Hendrikus Johannes Harmsen
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Patent number: 7608486Abstract: The invention relates to a device for encapsulating with encapsulating material an electronic component, in particular a semiconductor, fixed on a carrier, comprising: two co-acting mould parts which are displaceable relative to each other between an encapsulating position, in which the mould parts, when closing onto the carrier, occupy a position for defining at least one mould cavity, and an opened position in which the mould parts are situated at a greater distance from each other than in the encapsulating position, and feed means for encapsulating material connecting onto the mould cavity. The invention also relates to a method for encapsulating with encapsulating material an electronic component fixed on a carrier.Type: GrantFiled: January 6, 2004Date of Patent: October 27, 2009Assignee: Fico B.V.Inventors: Martin Herman Weggen, Michel Hendrikus Lambertus Teunissen, Wilhelmus Gerardus Jozef Gal
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Publication number: 20090115098Abstract: The invention relates to a mould part for applying in a device for encapsulating electronic components mounted on a carrier, comprising: at least one mould cavity recessed into a contact side, a contact surface at least partially enclosing the mould cavity for medium-tight connection to the carrier of the electronic component, a feed channel for encapsulating material recessed into the contact surface and connecting to the mould cavity, a first outlet channel for gas, and an extraction space recessed into the contact surface. The invention also relates to a device for encapsulating electronic components mounted on a carrier and to a method for encapsulating electronic components mounted on a carrier.Type: ApplicationFiled: July 26, 2005Publication date: May 7, 2009Applicant: FICO B.V.Inventors: Franciscus Bernardus Antonius De Vries, Wilhelmus Gerardus Jozef Gal, Johannes Lambertus Gerardus Maria Venrooij
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Publication number: 20080277825Abstract: The invention relates to a method for encapsulating electronic components mounted on a carrier, comprising the processing steps of: A) heating encapsulating material, B) displacing the encapsulating material to a mould cavity, C) filling the mould cavity, and D) curing the encapsulating material in the mould cavity. The temperature regulation of the encapsulating material takes place during separate sections of the path covered by the encapsulating material by creating different temperature zones at least partially separated from each other thermally by means of at least one temperature carrier. The invention also relates to a device for encapsulating electronic components mounted on a carrier.Type: ApplicationFiled: June 9, 2005Publication date: November 13, 2008Applicant: FICO B.V.Inventor: Johannes Lambertus Gerarus Maria Venrooij
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Patent number: 7425469Abstract: The invention relates to a method for encapsulating an electronic component, in particular a semiconductor, fixed on a carrier, comprising the processing steps of: a) placing at least one foil layer in a mould, b) placing the carrier in contact with the foil layer with the side remote from the component, and c) encapsulating the electronic component with encapsulating material, wherein the foil layer undergoes a treatment whereby the adhesion of the foil layer is increased such that it adheres to the carrier. The invention also relates to a foil material for applying during such a method.Type: GrantFiled: May 12, 2003Date of Patent: September 16, 2008Assignee: Fico B.V.Inventors: Wilhelmus Gerardus Jozef Gal, Franciscus Bernardus Antonius De Vries
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Publication number: 20070251084Abstract: The invention relates to an apparatus for processing electronic components mounted on a carrier, comprising at least two engaging elements which co-act when engaging on a carrier. The invention also relates to a processing element for processing electronic components mounted on a carrier, which processing element can be coupled interchangeably to an apparatus according to the invention. The invention furthermore relates to a method for product-related adjustment of such an apparatus.Type: ApplicationFiled: November 15, 2004Publication date: November 1, 2007Applicant: FICO B.V.Inventor: Wilhelmus Hendrikus Harmsen
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Patent number: 7211215Abstract: The invention relates to a mould for encapsulating electronic components mounted on a carrier, comprising: at least two mould parts displaceable relative to each other, at least one of which is provided with a recess, and feed means for encapsulating material, wherein at least one of the mould parts is provided with a runner which connects on one side to a wall of a mould part co-defining a mould cavity and connects on the other side to a side of the mould part remote from the mould cavity. The invention also relates to an encapsulating device of which such a mould forms parts, and to a method for encapsulating electronic components mounted on a carrier.Type: GrantFiled: July 5, 1999Date of Patent: May 1, 2007Assignee: Fico B.V.Inventors: Marcel Gerardus Antonius Tomassen, Antonius Bernardus Claassen
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Patent number: 7162906Abstract: A method for removing from a carrier a carrier part with a housing arranged thereon, wherein prior to performing the separating operation a notched line is arranged in the carrier on at least one side of the carrier along at least a part of the length of a separating edge to be arranged. The invention also relates to a carrier part with a housing arranged thereon, which carrier part contains openings on the side of the carrier remote from the housing which are filled with encapsulating material, manufactured with the present method. The invention moreover relates to an apparatus for performing the method.Type: GrantFiled: January 29, 2002Date of Patent: January 16, 2007Assignee: Fico B.V.Inventors: Adrianus Wilhelmus Van Dalen, Henri Joseph Van Egmond
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Publication number: 20060160275Abstract: The invention relates to a device for encapsulating with encapsulating material an electronic component, in particular a semiconductor, fixed on a carrier, comprising: two co-acting mould parts which are displaceable relative to each other between an encapsulating position, in which the mould parts, when closing onto the carrier, occupy a position for defining at least one mould cavity, and an opened position in which the mould parts are situated at a greater distance from each other than in the encapsulating position, and feed means for encapsulating material connecting onto the mould cavity. The invention also relates to a method for encapsulating with encapsulating material an electronic component fixed on a carrier.Type: ApplicationFiled: January 6, 2004Publication date: July 20, 2006Applicant: FICO B.V.Inventors: Martin Weggen, Michel Hendrikus Teunissen, Wilhelmus Gal
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Patent number: 6848174Abstract: The invention relates to an apparatus for processing electronic components, such as semi-conductor products, comprising at least two processing stations, at least one supply/discharge position for electronic components, a robot arm with engaging means for engaging the electronic components for displacing electronic components between the supply/discharge position and the processing stations, and a control for actuating the robot arm and the processing stations. The invention also relates to an assembly of at least two such apparatuses and to a method for processing electronic components which can be performed by means of the apparatus according to the invention.Type: GrantFiled: February 21, 2001Date of Patent: February 1, 2005Assignee: Fico B.V.Inventors: Johannes Lambertus Gerardus Maria Venrooij, Adrianus Henricus Ignatius Maria Verkuijlen
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Patent number: 6532783Abstract: The invention relates to a device for clamping at least two tool parts movable relative to each other for processing carriers for electronic components in a press. The invention also relates to a press adapted for co-action with the clamping device. The invention also describes a tool part and a tool assembled from tool parts and adapted for co-action with the clamping device. Finally, the invention also relates to a method for mounting a tool in a press.Type: GrantFiled: January 10, 2000Date of Patent: March 18, 2003Assignee: Fico B.V.Inventors: Adrianus Wilhelmus van Dalen, Willem Adriaan de Boer