Abstract: The invention relates to a test device for testing electronic components mounted on a carrier such as a lead frame, comprising: a transport path for supplying a carrier for testing; a manipulator for engaging and displacing a supplied carrier; a test contact with which a carrier and/or at least one component mounted on the carrier can be placed in contact by the manipulator; and a transport path for discharging a tested carrier. The invention also embraces a test assembly which includes at least one described test device. The invention furthermore provides a method for testing electronic components mounted on a carrier and method for calibrating a test device.

Abstract: A transporter for lead frames has two rotatable wheels with mutually facing running surfaces for engaging a lead frame between the wheels. A frame supports the wheels. An actuating cylinder engages on at least one wheel for mutual displacement of the wheels. An assembly of two such transporters is also disclosed.

Abstract: The invention relates to a mould part of a mould for encapsulating electronic components mounted on a carrier, composing at least one mould cavity provided in said mould part and at least one runner for moulding material connecting to said mould cavity, wherein the gate from said runner to said mould cavity has an oblong shape. The invention also relates to a mould with at least one such mould part. The invention also provides a method for encapsulating electronic components mounted on a carrier, wherein the liquid moulding material is fed into the mould cavity through a wide supply opening. Finally, the invention also provides an encapsulated electronic component mounted on a carrier, which component is manufactured by this method.

Abstract: An apparatus for encapsulating with plastic lead frames carrying chips includes mutually movable halves. In the closed position the movable halves bound a mold cavity for receiving a lead frame, a feed runner connecting onto the mold cavity for supplying encapsulating material, a pot for receiving an encapsulating material and a plunger reciprocating in the pot, connected onto said feed runner for carrying up encapsulating material under pressure. At a distance from a head end of the plunger a peripheral groove is arranged which is connected to the head end by at least one flow channel. The outer wall of the plunger is provided with helically running grooves and the depth of the grooves increases as seen from the drive side of the plunger.

Abstract: The invention relates to an ejector pin receivable in a mold part of a mold for encapsulating electronic components mounted on a carrier, wherein the substantially cylindrical ejector pin is provided with a side wall in which at least one recess is arranged close to the end which makes contact with the product for ejecting. The invention also relates to a mold part in which an opening is arranged for guiding an ejector pin, wherein at least one recess is arranged in the wall of the opening. The invention further includes a mold for encapsulating electronic components, in addition to a method for sealing an interspace between an ejector pin and an opening in a mold part.

Abstract: A device for encapsulating electronic components mounted on lead frames in a mold assembled from two mold halves movable relative to each other and closable onto each other. The device for causing the mold halves to move and to close are formed by a rotatable eccentric which can be coupled to one of the mold halves with interposing of at least one connecting rod. The invention also relates to a method for driving such a connecting rod. Another aspect of the invention relates to an encapsulating device wherein a one mold half is connectable to the device for causing the mold halves to move and close and the second mold half is connectable to a counter-plate which forms part of the device, which counter-plate is displaceable between two end positions. Yet another aspect of the invention relates to an encapsulating device with a counter-plate that includes a plurality of stacked, substantially plate-like parts, between which parts at least one shaft is placed.

Abstract: Apparatus for encapsulating products, for instance encapsulating lead frames with epoxy resin, wherein the apparatus comprises:one or more pressing devices for encapsulating the products at increased pressure and/or temperature;a first carriage device for transferring the products from supply means to the pressing device; anda second carriage device for discharging the encapsulated products from the pressing device to discharge means, wherein the first and second carriage are guidable along collective guide means.

Abstract: The invention relates to a moulding apparatus for moulding a chip on a flat carrier, including a mould formed by two mould parts which are movable relative to each other and between which the carrier can be received, the one mould part of which is provided with a mould cavity against the peripheral edges of which the carrier can be pressed, and a device for exerting pressure in at least one cavity for moulding material arranged in the mould and connected to the mould cavity by a runner, wherein at least one compensation element is arranged whereby in the closed position of the mould parts one side of the carrier is held sealingly against the peripheral edge of the mould cavity.

Abstract: A method and pellet for encapsulating lead frames. Prior to applying pressure to a pellet, a plastic foil is placed between the pellet and a plunger. The pellet has a body of encapsulating material (e.g. epoxy) and a plastic layer connected thereto. A device is described for manufacturing such a pellet.

Abstract: The invention relates to a moulding apparatus for moulding a chip on a flat carrier, including a mould formed by two mould parts which are movable relative to each other and between which the carrier can be received, the one mould part of which is provided with a mould cavity against the peripheral edges of which the carrier can be pressed, and means for exerting pressure in at least one cavity for moulding material arranged in the mould and connected to the mould cavity by means of a runner, wherein at least one compensation element is arranged whereby in the closed position of the mould parts one side of the carrier is held sealingly against the peripheral edge of the mould cavity.

Abstract: The invention relates to a system for dosed conveying and selecting of pellets for a moulding apparatus for lead frames, with which it is possible to prevent crumbled pellets or fragments and/or dust thereof being able to reach the molding apparatus arranged in a so-called clean room. For this purpose the system has structure for successively conveying pellets one by one, structure for selecting to length and feeding pellets to a transporting path, structure for reducing the transporting speed of conveyed pellets, structure for separating the pellets one by one and tranferring the pellets to a transport carrier, and means for transferring pellets from the transport carrier to a conveying device to a mold of a molding apparatus.

Abstract: An apparatus is provided for molding lead frames. The apparatus has a mold formed by two mold halves. An assembly for introducing a lead frame into one of the mold halves, an assembly for carrying encapsulating material into the cavities of the mold and an assembly for removing an encapsulated product from the mold are arranged on a carriage movable along a guide relative to the mold halves.

Abstract: The leads of a lead frame on which an encapsulated chip is placed are bent by placing them in a mould and subsequently bending them with a bending tool in the form of a cylinder-like roller rotatable round a rotating shaft. Because the roller rolls off over the leads, scraping off of solder onto the leads is prevented during bending. In view of its length the mounting of such a roller causes problems, such as sagging. This is resolved according to the invention by providing the roller on the periphery with slot-like recesses for passage of a bearing for the rotating shaft.

Abstract: An apparatus for encapsulating with plastic lead frames having chips arranged thereon includes mutually movable mold halves (102, 103). In the closed position a mold cavity is bounded, in which molding material is arranged under pressure via a runner. the pressure is provided by a plunger-cylinder (134-133) which carries up the molding material. Leaking molding material can result in adhering of the plunger to the cylinder wall, which is prevented according to the invention in that the outer wall of the plunger (134) is provided with scraping edges which scrape clean the inner wall of the cylinder (133) during operation.