Abstract: A method of manufacturing a pallet for use during manufacture of a printed circuit board assembly includes determining optimal solder flow for establishing connections between lead pins of a plurality of pin-through-hole components arranged on a circuit board, designing a pallet to include geometries configured to provide the optimal solder flow when the pallet, supporting the circuit board thereon, is passed through a wave solder machine, and creating the pallet based on the design. Pallets configured for optimal solder flow and methods of manufacturing printed circuit board assemblies using such pallet are also provided.

Abstract: Example embodiments are directed to a device comprising an antenna circuit that receives a radio frequency (RF) signal and that converts the RF signal into an electrical signal, a sensing circuit that senses the electrical signal and that outputs an output signal based on the sensed electrical signal, at least one processing circuit that generates at least one control signal based on the output signal, and a switching circuit that couples the antenna circuit to either the sensing circuit to enter a standby mode of the device or to the at least one processing circuit to exit the standby mode and enter an active mode of the device based on the at least one control signal.

Abstract: A method and system for predicting, detecting, and storing vehicle dynamics information. The method comprises receiving a series of consecutive signals indicating speed of a vehicle and additional data associated with the signals over a vehicle bus for a configurable period of time, comparing the consecutive speed signal with the previous speed signal to identify deceleration and acceleration of the vehicle, calculating a deceleration rate based on the sum of decelerations and accelerations, and storing the signals and additional data associated with the signals in a vehicle memory when the calculated deceleration rate is greater than or equal to a configurable event detection threshold deceleration rate. This configuration does not require the use of vehicle sensors, but instead utilizes pre-existing vehicle infrastructure, which allows for more precise analysis of vehicle dynamics information during an event like a collision, for all vehicles, in a cost-effective manner.

Abstract: An electronic pressure sensor array has a plurality of conductive electrodes and interconnects selectively formed on a pressure sensor substrate to form a plurality of individual pressure sensor assemblies. The individual pressure sensor assemblies can be aligned in various configurations to form the electronic pressure sensor array. Each pressure sensor assembly is made of a plurality of layers including a pressure sensor substrate, insulating layers on either side of the pressure sensor substrate, and conductive ink layers on an outer surface of each insulating layer. A cavity is formed in each insulating layer, the cavity in one insulating layer being vertically aligned with the cavity in the other insulating layer, and conductive ink fills each cavity to form electrodes.

Abstract: A conductive fabric includes a fabric with one or more electrically conductive wire braids woven into the fabric. The one or more wire braids are woven into the fabric such that one or more portions of each wire braid are exposed at one or more surfaces of the fabric, the exposed portions of the wire braid forming connection pads. Each connection pad provides an electrical connection point for attachment to a complementary electrical connection point on an electronic component, such as a bond pad, solder bump, or connection lead. A single wire braid can be used to electrically interconnect multiple electronic components. Multiple wire braids can be arranged, with appropriate spacing and alignment of exposed portions, to electrically interconnect multiple electronic components with multiple electrical interconnects between one or more electronic components. Each electrically conductive wire braid includes a plurality of individual electrically conductive wires braided together.

Abstract: A circuit and method provide improved trimming of a DCR sensing circuit where a sensing element is sensitive to self-heating or having a large tolerance. The circuit includes a resistive divider circuit coupled to a sensing element. The resistive divider circuit includes a trim resistor and two test points. Prior to trimming the trim resistor, an actual resistance of the sensing element is determined. A target voltage across the trim resistor to be trimmed is calculated according to the determined sensing element resistance and a known small trim current that is to be injected into the circuit during the trimming process. This injected trim current has a low current value so there is no self-heating of the sensing element. Then, the trim resistor is trimmed while injecting this small trim current into the resistive divider circuit and the voltage across the trim resistor is monitored.

Abstract: Attaching electronic components to a substrate can be challenging in certain applications. By utilizing printed conductive ink to fill vias, one or more conductive layers may be provided, which allow for fine pin pitches or other crowded substrates to utilize multiple layers for traces connecting the contact pad to the pins of an electronic component. By applying a substrate with conductive ink and then selectively applying a solderable ink on the conductive ink, and with conductive ink filling the vias, electronic components may be attached to a substrate that provides mechanical attachment and electrical connectivity which may also be formable or flexible.

Abstract: Voice information is received, via a network from a first voice assistant. The voice information comprises a digitized voice stream and/or information associated with the digitized voice stream. A keyword is identified in the voice information. The keyword is used to create a first bookmark. In response to identifying the first keyword in the voice information, a name for the first bookmark is received in the voice information, a command for the first bookmark is received in the voice information; and the bookmark is stored in a memory.

Abstract: Described herein is a method for and a device configured to receive a magnetic filed at a near field communication (NFC) tag, generate energy via induction from the magnetic field, and activate a temperature sensor form at least a portion of the generated energy. An electrochemical sensor may be activated from a portion of the generated energy and a temperature value of a container, solution and/or a housing may be measured based on thermal conduction such that the temperature value is measured using a temperature sensor. A pH value may be measured using an electrochemical sensor. The temperature value may be transmitted to a first receiver using at least a portion of the generated energy and the pH value may be transmitted to a second receiver.

Abstract: An electroluminescent display is flexible and stretchable, and therefore able to be attached to a textile. All interior layers of the electroluminescent display can be made using a screen printing process which can be scaled for volume production.

Abstract: An encapsulated circuit board assembly has a circuit board assembly that includes a substrate with a first surface and one or more electronic components mounted to the first surface to form an irregularly contoured front side of the circuit board assembly. A thermoformed sheet encapsulates the irregularly contoured front side of the circuit board assembly. Vacuum forming and pressure forming methods are used to apply a thermoformable sheet to the irregularly contoured front side of the circuit board assembly.

Abstract: A flexible and stretchable chain battery includes multiple individual batteries connected in parallel and/or in series via stretchable conductive interconnects. The positive terminals of each battery are connected to a first stretchable conductive interconnect and the negative terminals of each battery are connected to a second stretchable conductive interconnect. The stretchable conductive interconnects and the batteries are coupled to a stretchable substrate. The stretchable conductive interconnects provide electrical interconnection between the multiple batteries while enabling stretchability between the batteries.

Abstract: Methods and systems are provided to assemble an optical waveguide assembly. An optical waveguide assembly may be used in a virtual reality headset or other type of projection system. The optical waveguide assembly includes a front lens, one or more optical waveguides, and a back lens. In one embodiment, an insert is used that is the same width as the optical waveguides to prevent cracking of the optical waveguides. In another embodiment, the optical waveguide assembly includes Optically Clear Adhesive (OCA) tape between the different elements of the optical waveguide assembly to precisely align the optical waveguides. In another embodiment, the optical waveguide assembly has cover portions or a frame that protect the optical waveguides in the optical waveguide assembly.

Abstract: A resonant power converter includes an event generator and multiple separate resonant tanks configured as second harmonic filters. The event generator is configured to generate a predetermined resonant switching frequency to which the resonant tanks are tuned, to selectively apply voltage stress harmonic links using the resonant tanks, and to control zero voltage switching time and peak current through the switching devices. Configuring and operating the resonant power converter in the manner described herein enables the resonant power converter to maintain a substantially constant efficiency over varying input line voltage, making the efficiency of the resonant power converter substantially independent of the input line voltage value.

Abstract: A metal pallet is integrated within a circuit board using a process similar to a multilayer PCB, which integrates the metal pallet into the circuit board at the same time as the supporting layers are fabricated. The use of B-stage material provides a bonding mechanism for the metal pallet to be embedded within the circuit board, creating a cohesive integrated part. Embedding the pallet during the fabrication process, pre-lamination, generates a more robust construction and connection not impacted by post fabrication process in assembly. After assembly the circuit board with embedded metal pallet can be mounted directly on a heat sink, cool ribbon or other feature required to help remove heat. The planar back side surface provides a more robust mounting of the metal pallet than a post fabricated assembly as used in conventional techniques.