Abstract: A Fai 2 converter includes an isolated Fai 2 inverter coupled to a resonant rectifier with either clamped diodes or clamped self-driven synchronous rectifiers. The Fai 2 inverter converts an input DC signal to a high-frequency AC signal. The resonant rectifier with either clamped diodes or clamped self-driven synchronous rectifiers rectifies the high-frequency AC signal to a DC signal while clamping the voltage across the clamped diodes or clamped self-driven synchronous rectifiers to the output voltage. Clamping the voltage in this manner minimizes the voltage stress and enables the use of low voltage stress components (diodes or synchronous rectifiers) with low conduction voltage drop.

Abstract: A heat sink is mounted to a PCB for thermal heat removal. The PCB is configured with plated through hole vias within a footprint of the heat sink. The plated through hole vias can include thermal via types and signal carrying via types. The signal carrying via types are landless vias on the PCB back side configured to eliminate physical and electrical contact between the plated through hole via and the heat sink. The landless via is configured by removing a conductive annular ring on the back side of the PCB, and then covering this area with an insulating material such as soldermask. The insulating material forms an insulation cap between the via side wall plating and the attached heat sink.

Abstract: A mechanical strain reduction system include a flexible circuit section of a printed circuit board configured with a meandering shape while in a static state, and a compressible material having a cavity such that the meandering flexible circuit section is positioned within the cavity while the flexible circuit section is in the static state. The flexible circuit section can be part of a rigid-flexible printed circuit board or a flexible printed circuit board. The cavity can be shaped with the same meandering shape as the flexible circuit section in the static state. In general, the cavity is sufficiently shaped to allow positioning of the meandering flexible circuit section within the cavity. Support structures of the same, or different, compressible material can be interspersed within the meander of the flexible circuit section.

Abstract: A visible LED retrofit kit includes a chassis for an LED assembly and an elongated bracket including a first end portion and a bifurcated second end portion. The first end portion of the bracket is configured to be bent for attachment thereof to a first longitudinal side of a light fixture housing. The second end portion of the bracket includes a first tab and a second tab. The first tab is configured to be bent for attachment of the second end portion to a second longitudinal side of the light fixture housing. The second tab is configured to movably couple the chassis to the second longitudinal side of the light fixture housing.

Abstract: A method for performance ratio-based scheduling of solar system maintenance is implemented by a monitoring computing device. The monitoring computer device includes a processor in communication with a memory. The method includes receiving a plurality of production data associated with a solar system, determining at least one performance ratio based upon at least a portion of the plurality of production data wherein each performance ratio is associated with a range of expected performance values, validating the at least one performance ratio, determining that the at least one performance ratio is outside the range of expected performance values, and adjusting a maintenance schedule associated with the solar system based upon the at least one performance ratio.

Abstract: A power supply has a first stage for performing AC-DC voltage conversion and power factor correction and a second stage for isolated DC-DC voltage conversion. The power supply includes a feed forward mechanism for transmitting phase information corresponding to AC ripple. The phase information is transmitted from the first stage to a secondary side of the second stage as a digital signal using a low speed optical coupler, where the phase information is utilized by a DC-DC digital controller to implement AC ripple suppression using both phase compensation and amplitude compensation.

Abstract: A solar cell is provided including a substrate having a front and back side, a metallization pattern deposited on the front side, the metallization pattern including a plurality of front side bus bars each including fingers extending therefrom, and a plurality of back side bus bars deposited on the back side. On the front side, one front side bus bar is formed along an edge of the front side of the substrate, and a remainder of the front side bus bars are unequally spaced across the substrate. On the back side of the substrate, only one back side bus bar is formed along an edge of the back side of the substrate, and a remainder of the back side bus bars are unequally spaced across the substrate.

Abstract: An electrically interconnected assembly is a technology enabler for mechanical and electrical interconnects between conductive threads, such as those within fabrics and textiles, to electrical connection points, such as contact pads on a printed circuit board (PCB), a flexible printed circuit (FPC), and/or rigid-flexible circuit board. The electrically interconnected assembly uses an anisotropic conductive coated fabric to make an electrical and mechanical interconnect in fabrics or textiles. All fabrics or textiles can be anisotropic conductive coated and cut into sheet form or supplied in roll form.

Abstract: A solar cell is provided including a substrate having a front and back side, a metallization pattern deposited on the front side, the metallization pattern including a plurality of front side bus bars each including fingers extending therefrom, and a plurality of back side bus bars deposited on the back side. On the front side, one front side bus bar is formed along an edge of the front side of the substrate, and a remainder of the front side bus bars are unequally spaced across the substrate. On the back side of the substrate, only one back side bus bar is formed along an edge of the back side of the substrate, and a remainder of the back side bus bars are unequally spaced across the substrate.

Abstract: A system and method for generating command scripts for profile configurations of an Hewlett Packard Virtual Connect Blade enclosure, by parsing a show-all report of the domain, generating a configuration script that includes configuration statements for static entities of the domain; and generating a configuration script that includes configuration statements for dynamic entities of the domain.

Abstract: An inflatable splint is presented. The splint comprises integral foot-accommodating portion, calf-accommodating portion and intermediate, ankle-accommodating portion. The splint is configured to be fitted over a leg part comprising a foot, ankle and calf such that front faces of the leg part are exposed. The splint has a collapsed state and has an open state in which it can be mounted on the leg part. When opened, the splint assumes the general form of the leg part.