Abstract: Systems and methods according to one or more embodiments are provided for an imaging system having a plurality of sensors associated with input optics. In one example, an imaging system includes input optics configured to receive incident radiation along an input optical axis and a first optical sensor and a second optical sensor, each configured to detect the incident radiation. The imaging system further includes a rotating member positioned between the first and second optical sensors and configured to rotate about the input optical axis and a reflector coupled to the rotating member configured to be selectively positionable by the rotating member to a first orientation, in which the reflector directs the incident radiation along a first secondary axis to the first optical sensor, and to a second orientation, in which the reflector directs the incident radiation along a second secondary axis toward the second optical sensor.

Abstract: Various techniques are provided for binning (e.g., clustering or grouping) two or more infrared sensors of a focal plane array (FPA) to permit configuration of the FPA to various dimensions and/or pixel sizes. For example, according to one or more embodiments, switchable interconnects may be implemented within the FPA, wherein the switchable interconnects comprise a plurality of switches adapted to selectively connect or disconnect infrared sensors of the FPA to/from column lines, row lines, and between each other. The switchable interconnects may also comprise another set of switches adapted to selectively connect adjacent column lines together. By selectively opening and closing appropriate switches of the switchable interconnects, two or more neighboring infrared sensors may be binned together to form a binned detector. Advantageously, the binned detector, along with the array and associated circuitry, may provide increased sensitivity, reduced power consumption, and/or increased frame rate.

Abstract: Techniques using small form factor infrared imaging modules are disclosed. An imaging system may include visible spectrum imaging modules, infrared imaging modules, and other modules to interface with a user and/or a monitoring system. Visible spectrum imaging modules and infrared imaging modules may be positioned in proximity to a scene that will be monitored while visible spectrum-only images of the scene are either not available or less desirable than infrared images of the scene. Imaging modules may be configured to capture images of the scene at different times. Image analytics and processing may be used to generate combined images with infrared imaging features and increased detail and contrast. Triple fusion processing, including selectable aspects of non-uniformity correction processing, true color processing, and high contrast processing, may be performed on the captured images. Control signals based on the combined images may be presented to a user and/or a monitoring system.

Abstract: Various techniques are disclosed for providing a radar system. In one example, such a radar system includes a radar unit adapted to broadcast radar signals and receive return signals in response thereto. The radar unit includes a waveform generator adapted to provide pulse waveforms of different pulse widths and Frequency Modulated Continuous Wave (FMCW) waveforms, wherein the waveforms are interleaved with each other to provide a transmission sequence for the radar signals for detection of long range and short range targets, a power amplifier adapted to amplify the radar signals for broadcast, and an antenna adapted to broadcast the radar signals and receive the return signals. Other examples of radar systems and related methods are also provided.

Abstract: Various techniques are disclosed for providing electrical power and/or data from the interior of a building structure to a device at the exterior of the structure without piercing (e.g., making a hole through a wall or window frame) the structure. A camera surveillance system for an embodiment includes self-adhesive energy transfer units that can be placed on either side of a window so that electrical power is passed via the energy transfer units from inside a building to the outside without the need for making a hole in the window or building through which to pass electrical wire to feed power and/or data to/from the camera surveillance system. One of the energy transfer units may be integral with the camera surveillance system and the adhesive may be strong enough to support the weight of the camera surveillance system on the window. The camera surveillance system may be installed without the need for tools.

Abstract: Techniques are disclosed for systems and methods using infrared imaging modules to image and detect phase transitions of water, such as ice formation, in a scene. An ice formation detection system may include one or more infrared imaging modules, a logic device, and a communication module. The infrared imaging modules may be positioned to image a scene in which ice formation is to be detected. The logic device may be adapted to process captured infrared images to detect ice formation in the scene. The logic device may also be adapted to use the communication module to report detected ice formation to an indicator, a display, a user interface, and/or an ice formation mitigation system.

Abstract: Systems and methods may be provided for fabricating infrared focal plane arrays. The methods include providing a device wafer, applying a coating to the device wafer, mounting the device wafer to a first carrier wafer, thinning the device wafer while the device wafer is mounted to the first carrier wafer, releasing the device wafer from the first carrier wafer, singulating the device wafer into individual dies, each die having an infrared focal plane array, and hybridizing the individual dies to a read out integrated circuit.

Abstract: An improved emitter tracking system. In aspects of the present teachings, the presence of a desired emitter may be established by a relatively low-power emitter detection module, before images of the emitter and/or its surroundings are captured with a relatively high-power imaging module. Capturing images of the emitter may be synchronized with flashes of the emitter, to increase the signal-to-noise ratio of the captured images.

Abstract: Techniques are disclosed for systems and methods using small form factor infrared imaging modules to monitor occupants in an interior compartment of a vehicle. For example, a vehicle-mounted system may include one or more infrared imaging modules, a processor, a memory, alarm sirens, and a communication module. The vehicle-mounted system may be mounted on, installed in, or otherwise integrated into a vehicle with an interior compartment. The infrared imaging modules may be configured to capture thermal images of desired portions of the interior compartments. Various thermal image processing and analytics may be performed on the captured thermal images to determine the presence and various attributes of one or more occupants. Based on the determination of the presence and various attributes, occupant detection information or control signals may be generated. Occupant detection information may be used to perform various monitoring operations, and control signals may adjust various vehicle components.

Abstract: In one embodiment, an infrared (IR) sensor module includes an IR sensor assembly, including a substrate, a microbolometer array disposed on an upper surface of the substrate; and a cap disposed on the upper surface of the substrate and hermetically enclosing the microbolometer array. A base is disposed below the substrate, and a heat spreader having a generally planar portion is interposed between a lower surface of the substrate and an upper surface of the base. In some embodiments, the heat spreader can include a material having an anisotropic thermal conductivity, e.g., graphite.

Abstract: Various techniques are disclosed for bolometer circuits and related methods for thermal imaging in a difference domain, where each pixel value represents a difference in incident IR radiation intensity between adjacent bolometers. For example, a bolometer circuit may include an array of bolometers each configured to generate a pixel signal in response to a bias and incident infrared radiation. Each column of the bolometer array may comprise an amplifier, a first plurality of switches each configured to selectively provide a supply voltage to a respective one of bolometers of the each column, a second plurality of switches each configured to selectively route a difference of the pixel signals of a respective adjacent pair of the bolometers of the each column to an input of the amplifier, and a third plurality of switches configured to selectively provide a common voltage to a respective one of the bolometers of the each column.

Abstract: Various systems and methods are disclosed for monitoring and controlling using small infrared imaging modules to enhance occupant safety and energy efficiency of buildings and structures. In one example, thermal images captured by infrared imaging modules may be analyzed to detect presence of persons, identify and classify power-consuming objects, and monitor environmental conditions. Based on the processed thermal images, various power-consuming objects (e.g., an HVAC system, lighting, a water heater, and other appliances) may be controlled to increase energy efficiency. In another example, thermal images captured by infrared imaging modules may be analyzed to detect various hazardous conditions, such as a combustible gas leak, a CO gas leak, a water leak, fire, smoke, and, an electrical hotspot. If such hazardous conditions are detected, an appropriate warning may be generated and/or various objects may be controlled to remedy the conditions.

Abstract: Techniques are disclosed for systems and methods for providing accurate and reliable compact sonar systems for mobile structures. In one embodiment, a sonar system includes a mounting bracket, a transducer support arm, and a pivoting mechanism pivotably coupling the transducer support arm to the mounting bracket such that, for forces acting on the transducer support arm that are less than a preselected kick-up level, the pivoting mechanism holds the transducer support arm against such forces and at a user selectable first angular position relative to the mounting bracket, and for forces acting on the transducer support arm that are equal to or greater than the preselected kick-up level, allows the transducer support arm to be moved by those forces to a second angular position relative to the mounting bracket.

Abstract: Various techniques are provided for implementing a segmented focal plane array (FPA) of infrared sensors. In one example, a system includes a segmented FPA. The segmented FPA includes a top die having an array of infrared sensors (e.g., bolometers). The top die may also include a portion of a read-out integrated circuit (ROIC). The segmented FPA also includes a bottom die having at least a portion of the ROIC. The top and the bottom dies are electrically coupled via inter-die connections. Advantageously, the segmented FPA may be fabricated with a higher yield and a smaller footprint compared with conventional FPA architectures. Moreover, the segmented FPA may be fabricated using different semiconductor processes for each die.

Abstract: Various techniques are disclosed for an illuminator and related methods to be used with a wafer prober to provide illumination (e.g., visible and/or non-visible electromagnetic radiation) to perform testing, calibration, and/or inspection of devices on a wafer. For example, an illuminator may include a plurality of radiation sources, a reflector, an actuator for the reflector, a shutter, an actuator for the shutter, and/or a light pipe. Various components of the illuminator may interface with a wafer prober to provide sufficiently uniform and stable illumination with fast-switching intensities, wavelengths, and/or other properties. Such illumination provided by various embodiments of the illuminator may permit the wafer prober to perform high-throughput testing, calibration, and/or inspection of devices that may be fabricated and/or packaged on a wafer.

Abstract: Binocular system, including method and apparatus, for viewing a scene. The system may comprise a left camera and a right camera that create left and right video signals from detected optical radiation. At least one of the cameras may include a sensor that is sensitive to infrared radiation. The system also may comprise a left display and a right display arranged to be viewed by a pair of eyes. The left and right displays may be configured to present respective left video images and right video images formed with visible light based respectively on the left and right video signals.

Abstract: Described herein is an IR camera that can prepare a report on-board the camera in a standard file format that is substantially universally readable by a number of receiving devices, including but not limited to computers. The report preferably includes at least one IR image, at least one visual image and a table that can be populated with the output of any of the camera's measurement functions or any parametric information (time, date, emissivity, background temperature, GPS location, etc.). The report may also include text, voice, and/or visual/graphical comments and recommendations. The comments may be added directly to the report or hyperlinked to the report.