Abstract: Methods and systems are disclosed for recovering dirty linefill buffer data upon linefill request failures. When a linefill request failure occurs and the linefill buffer has been marked as dirty, such as due to a system bus failure, the contents of the linefill buffer are pushed back to the system bus. The dirty data within the linefill buffer can then be used to update the external memory. The disclosed embodiments are useful for a wide variety of applications, including those requiring low data failure rates.

Abstract: In accordance with at least one embodiment, a method and apparatus for improving the ability to correct errors in memory devices is described. At least one embodiment provides a way to salvage the part even it has double-bit or multi-bit error from the same ECC section, thus improving product reliability and extending the product lifetime. During a normal read, if a double-bit or multiple-bit error happens, which ECC can detect but cannot fix, the error is corrected by adjusting the read voltage level and reading again to determine the proper read level (and, therefore, the correct value being read). This dynamic read scheme can apply to extrinsic bits from either erase state or program state. It can be also used in a single bit scenario to minimize ECC occurrence and save ECC capacity.

Abstract: A process integration is disclosed for fabricating non-volatile memory (NVM) cells having recessed control gates (118, 128) on a first substrate area (111) which are encapsulated in one or more planar dielectric layers (130) prior to forming in-laid high-k metal select gates and CMOS transistor gates (136, 138) in first and second substrate areas (111, 113) using a gate-last HKMG CMOS process flow without interfering with the operation or reliability of the NVM cells.

Abstract: A stacked semiconductor device includes a first and second semiconductor device having a first major surface and a second major surface opposite the first major surface, the first major surface of the first and second semiconductor devices include active circuitry. The first and second semiconductor devices are stacked so that the first major surface of the first semiconductor device faces the first major surface of the second semiconductor device. At least one continuous conductive via extends from the second major surface of the first semiconductor device to the first major surface of the second semiconductor device. Conductive material fills a cavity adjacent to the contact pad and is in contact with one side of the contact pad. Another side of the contact pad of the first semiconductor device faces and is in contact with another side of the contact pad of the second semiconductor device.

Abstract: A method includes an erase of a plurality of blocks of memory cells in which the memory cells within a block are simultaneously erased. The erase of each block of the plurality of blocks is performed using an erase pulse applied multiple times. The erase pulse is applied to the plurality of blocks in parallel. An erase verify is performed after each application of the erase pulse. After a number applications of the erase pulse, it is determined if a condition comprising one of a group consisting of any memory cell has been more erased than a first predetermined amount and any memory cell has been erased less than a second predetermined amount has been met. If the condition has been met, erasing is continued by applying the erase pulse to the block having the memory cell with the condition independently of the other blocks of the plurality of blocks.

Abstract: A method for minimizing soft error rates within caches by controlling a memory scrubbing rate selectively for a cache memory at an individual bank level. More specifically, the disclosure relates to maintaining a predetermined sequence and process of storing all modified information of a cache in a subset of ways of the cache, based upon for example, a state of a modified indication within status information of a cache line. A cache controller includes a memory scrubbing controller which is programmed to scrub the subset of the ways with the modified information at a smaller interval (i.e., more frequently) compared to the rest of the ways with clean information (i.e., information where the information stored within the main memory is coherent with the information stored within the cache).

Abstract: In an embodiment, an electronic device includes an integrated circuit (IC) having a plurality of power domains, a first regulator coupled to a given power domain, a second regulator coupled to the given power domain, and a switching circuit coupled between the first and second regulators and configured to control an amount of current drawn by the power domain from the first and/or second regulators. In another embodiment, a method includes controlling an impedance of a switching circuit to change an amount of current, the switching circuit coupled to a given power domain of an IC configured to operate in a first mode followed by a second mode, where the switching circuit is coupled to a first regulator configured to provide more power to the IC than a second regulator, and a transition period includes turning off the first regulator and turning on the second regulator.

Abstract: An embodiment of an electrical device includes a device package and a plurality of amplifier paths physically contained by the device package. Each amplifier path includes an amplifier stage electrically coupled between an input and an output to the amplifier stage, and the amplifier stages of the plurality of amplifier paths are symmetrical. In a further embodiment, the amplifier paths have translational symmetry within the device package. In another further embodiment, transistors comprising the amplifier stages of the plurality of amplifier paths are substantially identical in size. The electrical device may be incorporated into an amplifier system that further includes an external input network and an external output network. For example, the amplifier system may be configured in a Doherty amplifier topology.

Abstract: Boosted Electrostatic Discharge (ESD) clamp circuit with high effective holding voltage. In some embodiments, an integrated circuit may include a trigger circuit operably coupled to a first voltage bus and to a reference bus; a diode including an anode terminal operably coupled to a second voltage bus, the second voltage bus distinct from the first voltage bus; a transistor including a gate operably coupled to an output terminal of the trigger circuit, a drain operably coupled to a cathode terminal of the diode, and a source operably coupled to the reference bus; and an input/output (I/O) cell operably coupled to the first voltage bus, the second voltage bus, and the reference bus.

Abstract: A die temperature measurement system (300) includes an external test environment setup (352) and an integrated circuit (302). The external test environment setup (352) includes means to force and accurately measure electrical variables. The integrated circuit (302) includes a bipolar transistor (325); a selectable switch (340) for selecting from plurality of integrated resistances (342, 344) to be coupled in series between a base (322) of the bipolar transistor and a first input (362); and a selectable-gain current mirror (310) with a gain, a programmable current-mirror output coupled to the collector (326) of the bipolar transistor. The bipolar transistor and optional diodes (335) are sequentially biased with a set of proportional collector current levels. For each bias condition, the temperature-dependent voltage produced by the structure is extracted and stored. Die temperature is obtained through algebraic manipulation (450) of this data. Parasitic resistance and I/O pad leakage effects are canceled.

Abstract: An integrated circuit device comprising at least one voltage supply module arranged to receive at an input thereof at least one control signal and to provide at an output thereof a voltage signal in accordance with the received at least one control signal, and at least one control module comprising at least one feedback loop between the output of the at least one voltage supply module and the input of the at least one voltage supply module, and arranged to generate the at least one control signal based at least partly on the voltage level of the voltage signal output by the at least one voltage supply module. The at least one control module is further arranged to receive at an input thereof at least one instantaneous indication of a load current at the output of the at least one voltage supply module, and apply a compensation to the at least one control signal provided to the at least one voltage supply module based at least partly on the received at least one indication of the load current.

Abstract: A stacked semiconductor device includes a first, a second, a third, and a fourth semiconductor device. A first major surface of each of the first and second semiconductor devices which includes the active circuitry directly face each other, and a first major surface of each of the third and fourth semiconductor devices which includes the active circuitry directly face each other. A second major surface of the second semiconductor device directly faces a second major surface of the third semiconductor device. The stacked semiconductor device includes a plurality of continuous conductive vias, wherein each continuous conductive via extends from the second major surface of the first device, through the first device, second device, third device, and fourth device to the second major surface of the fourth device. Each of the semiconductor devices may include a beveled edge at the first major surface on at least one edge of the device.

Abstract: A resistive random access memory (ReRAM) device can comprise a first metal layer and a first metal-oxide layer on the first metal layer. The first metal-oxide layer comprises the first metal. A second metal layer can comprise a second metal over and in physical contact with the first metal-oxide layer. A first continuous non-conductive barrier layer can be in physical contact with sidewalls of the first metal layer and sidewalls of the first metal-oxide layer. A second metal-oxide layer can be on the second metal layer. The second metal-oxide layer can comprise the second metal layer. A third metal layer can be over and in physical contact with the second metal-oxide layer. The first and second metal-oxide layers, are further characterized as independent storage mediums.

Abstract: Embodiments include bitstring generators and methods of their operation. A sampling parameter of the bitstring generator is set to a current value, and values of one or more bits are then repeatedly sampled based on the current value of the sampling parameter. The repeated sampling results in a set of test bits, which is analyzed to determine a randomness measurement associated with the set of test bits. A determination is made whether the randomness measurement meets a criterion. If not, the current value of the sampling parameter is changed to a different value that corresponds to a lower probability of being able to correctly predict the values of the one or more bits produced by the bitstring generator. The steps of repeatedly sampling, analyzing the set of test bits, and determining whether the randomness measurement meets the criteria are then repeated.

Abstract: Methods and systems are disclosed for selectively forming metal layers on lead frames after die attachment to improve electrical connections for areas of interest on lead frames, such as for example, lead fingers and down-bond areas. By selectively forming metal layers on areas of interest after die attachment, the disclosed embodiments help to eliminate anomalies and associated defects for the lead frames that may be caused by the die attachment process. A variety of techniques can be utilized for selectively forming one or more metal layers, and a variety of metal materials can be used (e.g., nickel, palladium, gold, silver, etc.). Further, cleaning can also be performed with respect to the areas of interest prior to selectively forming the one or more metal layers on areas of interest for the leaf frame.

Abstract: A reference voltage loss monitoring circuit having a first and second reference node. The reference nodes are connected to a voltage reference. A first connection device is connects the first reference node to the second reference node, and includes a first diode to allow a current flowing from the first reference node to the reference ground node and not conversely. The first diode includes a first main transistor. A second connection device connects the second reference node to the first reference node, and includes a second diode to allow a current flowing from the second reference node to first reference node and not conversely. The second diode includes a second main transistor. Each of the first and second connection devices further includes a secondary transistor mirrored with the main transistor of the connection devices.

Abstract: An integrated circuit package includes a die having a first substrate implementing an integrated circuit comprising circuit elements. The die includes a first plurality of metal layers implementing a first portion of a metal interconnect structure for the integrated circuit. The die also includes a first plurality of pads at or overlying a top metal layer of the first plurality of metal layers. The integrated circuit package includes an interposer having a second plurality of metal layers implementing a second portion of the metal interconnect structure. The interposer includes a second plurality of pads at or overlying a top metal layer of the second plurality of metal layers. A plurality of solder structures couple the first and second pluralities of pads. The first and second portions of the metal interconnect structure together complete a signal path between two or more circuit blocks of the integrated circuit.

Abstract: A method of sensing a user input to a capacitive touch sensor having a sense electrode is described. The method comprises obtaining a measure of capacitance of the sense electrode of the capacitive touch sensor, determining an indication of contact between a finger of a user and the capacitive touch sensor from comparing the measure of capacitance to a first threshold and determining an indication of exceeding a minimum pressure exercised by the finger of the user on the capacitive touch sensor from comparing the measure of capacitance to a second threshold, the second threshold being different from the first threshold. A capacitive touch sensor controller being arranged to perform such method is described. An input device for receiving user input is described. The input device comprises a capacitive touch sensor and such capacitive touch sensor controller.

Abstract: A power switching device connected or connectable between a power supply and a load is described. The device may have at least two different operating states, each operating state having a different level of said output voltage associated with it.

Abstract: An integrated circuit package includes a substrate having a heat conducting portion integrally formed with a heat dissipating portion. First and second integrated circuit dies are mounted to opposite sides of the heat conducting portion of the substrate. The first and second integrated circuit dies may each be packaged as flip-chip configurations. Electrical connections between contact pads on the first and second integrated circuit dies may be formed through openings formed in the heat conducting portion of the substrate. The heat dissipating portion may be positioned externally from a location between the first and second integrated circuit dies so that it dissipates heat away from the integrated circuit package into the surrounding environment.