Abstract: A component feeding system including: a stage configured to support components in a scattered state; a holding tool configured to pick up and hold the component scattered on the stage; an imaging device configured to image the components scattered on the stage; and a control device configured to acquire, based on image data of the imaging device, a pickup possible component quantity that is a quantity of components that can be picked up by the holding tool from among the components scattered on the stage.

Abstract: A component mounting machine includes a base material device to convey a circuit base material, a component mounting device to mount an electronic component, an imaging device to capture a predetermined region including the circuit base material, a first detection section to detect at least one device mark provided on the base material device and at least one base material mark provided on the circuit base material, a calculation section to calculate a position on the circuit base material where the electronic component is to be mounted, based on the device mark and the base material mark detected by the first detection section, and a feedback section configured to feed back, as a correction value for correcting a position on the circuit base material to be calculated next by the calculation section, a part of the deviation amount detected by a second detection section.

Abstract: There are provided a wind-up drum that is easily detached in a state in which a wound tape is fastened, a tape feeder including the wind-up drum, and a component mounting machine capable of mounting the tape feeder. A wind-up drum includes a tape holding member including an insertion hole for inserting a support shaft of a rotating device and configured to hold a wound tape, and a wound member attached to the tape holding member, configured to wind up the tape by rotating the support shaft by the rotating device in a state in which the support shaft is mounted, and including a rotating member that rotates in contact with the support shaft when the wound member is detached from the support shaft in a state in which the tape is wound.

Abstract: A management device of the present disclosure is used in a mounting system including multiple mounting-related devices each including a display section configured to visually notify an operator of information and an attachment portion to which a member is attached and related to a process of mounting a component on a processing target object, and a moving work device configured to move between the multiple mounting-related devices to automatically attach and detach the member to and from the attachment portion. The management device includes a management control section configured to, when a mounting-related device is in a restriction state in which work of the operator on the mounting-related device is not accepted due to movement of the moving work device, display a display mode indicating the restriction state on the display section of the corresponding mounting-related device to notify the operator of the restriction state.

Abstract: A tape loading device includes a feeder holding stand configured to hold a feeder, an acquisition section configured to acquire identification information of the feeder held by the feeder holding stand and identification information of a reel on which a carrier tape accommodating multiple components is wound, a loading section configured to load the carrier tape unwound from the reel into the feeder, and a control device configured to control an operation of the loading section based on a determination result of whether the carrier tape is loadable into the feeder by a management device.

Abstract: A substrate height measuring device includes an imaging section, a setting section, and a measurement section. The imaging section allows an imaging device to image a region of at least a part of a clamped substrate, the region including a measurement planned position at which a height of the substrate is to be measured. The setting section allows a display device to display a substrate image imaged by the imaging section and adjusts a measurement position at which the height of the substrate is actually measured based on the measurement planned position of the substrate image displayed on the display device to set the measurement position. The measurement section allows a measurement device to measure the height of the substrate at the measurement position set by the setting section.

Abstract: A component supply device including a stage on which electronic components are scattered; a contacting section at a height so as to contact the electronic components on the stage; a slide device to relatively slide the stage and the contacting section; a dropping opening to allow the electronic components scattered on the stage caught by the contacting section to drop in accordance with the relative movement of the stage and the contacting section by the slide device; and a wall at a side opposite to a side of the dropping opening at which the electronic components scattered on the stage drop. The contacting section is provided to extend in a direction perpendicular to a sliding direction by the slide device, and at least a portion of the contacting section is inclined with respect to a straight direction along the sliding direction and an upper surface of the stage.

Abstract: A plasma emitting device includes plasma head configured to generate a plasmarized gas and jet the plasmarized gas so generated from a nozzle thereof, a gas supply device configured to supply a gas to the plasma head while controlling a flow rate of the gas, gas tube connecting the gas supply device with the plasma head to constitute a gas flow path, and pressure detector configured to detect a pressure of the gas supplied from the gas supply deice. Pressures of gases which are supplied to the plasma head are detected for use for various purposes, whereby the practical plasma emitting device is made up. Specifically, for example, a head clogging, which is a clog impeding a gas flow in the plasma head, can be determined without difficulty based on the detected pressure.

Abstract: A data management device includes a determination section and an output section. Here, a set of data used in a mounting process of mounting a component on a substrate is defined as a data group. The determination section determines whether the derivative data group is associated with each of multiple types of the reference data groups. The output section outputs an identification information identifying a specific reference data group, which is the reference data group with which the derivative data group is associated, so as to be distinguishable from identification information identifying a normal reference data group, which is the reference data group with which the derivative data group is not associated, based on a determination result by the determination section.

Abstract: An image correction method for correcting multiple original images captured under illumination by multiple different light source colors in generating a composite image by superposing the original images, includes obtaining a correction amount for correcting a position of a fiducial mark recognized from a reference image of a specific light source color in reference images of the multiple different light source colors; obtaining correction amounts for correcting positions of the fiducial mark recognized from the reference images of other light source colors than a specific light source color to the reference position in the reference image of the specific light source color; and when the original images are captured, correcting collectively distortion aberration and chromatic aberration of the original images of the multiple different light source colors using the correction amounts associated with the multiple different light source colors.

Abstract: To provide a wiring formation method that can increase the wiring density in a case where wiring is formed on an inclined surface by three-dimensional additive manufacturing. The wiring formation method of the present disclosure includes a metal member forming step of forming multiple metal members with a first fluid containing metal particles, a resin layer forming step of forming a resin layer including an upper surface and an inclined surface inclined downward from the upper surface, and a connection wiring forming step of forming multiple connection wirings on the inclined surface and the upper surface of the resin layer with a second fluid containing metal particles, and the connection wirings being formed to individually connect the multiple connection wirings to the multiple metal members on a lower surface of the inclined surface.

Abstract: The image data generation device includes a component information input section and an image data generation section. The component information input section is configured to input a mounting position and an outer shape of the electronic component for each of the multiple electronic components to be mounted in the mounting processing. The mounting position includes a position in a height direction orthogonal to a surface of the board. The image data generation section is configured to generate image data for displaying a state when each of the multiple electronic components to be mounted in the mounting processing is arranged at the mounting position of the electronic component based on the mounting position and the outer shape of the electronic component input by the component information input section.

Abstract: A power supply shutoff device includes a movable section, a driving section, a power supply device, a power distribution section, an electric power supply circuit, and a supply control section. The movable section is configured to travel on a traveling path provided along a board production line in which multiple board work machines, which perform a predetermined board work on a board, are installed side by side. The driving section is provided in the movable section and configured to cause the movable section to travel by using supply electric power supplied from the board work machine with non-contact power feeding. The supply control section is configured to stop a supply of the electric power to the electric power supply circuit when drive electric power for driving the board work machine is shut off in at least one board work machine among the multiple board work machines.

Abstract: A printing control device includes a determination section, a first printing control section, a movement controller, and a second printing control section. When the determination section determines that an elapsed time in which no board is convey exceeds an allowable time, the first printing control section causes the printer to execute the printing process for a first time on a first board which is conveyed in since the determination is made. The movement controller separates the mask and the board from each other after the first printing control section executes the printing process for the first time and brings the mask and the board into abutment with each other again after the separation. The second printing control section causes the printer to execute the printing process for a second time on the board after the movement controller brings the mask and the board into abutment with each other again.

Abstract: A screen printer comprising: a conveyance device configured to convey a board; a board holding device configured to position a conveyed board at a printing position; a stencil holding device configured to attach a stencil above the held board; a squeegee device configured to fill pattern holes of the stencil with solder paste; a board raising and lowering device configured to raise and lower the board positioned by the board holding device; and a control device configured to perform drive control of each the above devices, the control device including a standby printing processing section configured to raise the board from below with respect to the stencil such that the board contacts the stencil, stand by in a state with solder paste filled in the pattern holes, and lower the board to separate the board from the stencil in accordance with a board conveyance signal.

Abstract: An image processing device for processing an image of a tape in which multiple cavities for accommodating a component are provided along a predetermined feeding direction includes a generation section configured to extract brightnesses of pixels of a line along the feeding direction from the image and to generate a brightness waveform of the line, and a recognition section configured to execute a periodic analysis of a brightness change from the brightness waveform and to recognize a pitch of the cavities based on a wavelength obtained by the periodic analysis.

Abstract: A component mounter includes a state recognition section configured to recognize a supply state of a component in a supply area based on a feature amount including at least one of a shape and an angle of each of multiple feature portions in image data on which image processing has been executed. The state recognition section determines whether one or more candidate feature portions included in a search range belong to an identical component together with a reference feature portion based on one of feature amounts of the candidate feature portion and a positional relationship between the reference feature portion and the candidate feature portion.